SN74AUP1G17
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
- Available in the Texas Instruments NanoStar™ Package
- Low Static-Power Consumption
(ICC = 0.9 µA Maximum) - Low Dynamic-Power Consumption
(Cpd = 4.4 pF Typical at 3.3 V) - Low Input Capacitance (Ci = 1.5 pF Typical)
- Low Noise – Overshoot and Undershoot
<10% of VCC - Ioff Supports Partial-Power-Down Mode Operation
- Includes Schmitt-Trigger Inputs
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 5.1 ns Maximum at 3.3 V
- Suitable for Point-to-Point Applications
The AUP family of devices is TIs premier solution to the industrys low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see AUP – The Lowest-Power Family and Excellent Signal Integrity).
This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
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技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | SN74AUP1G17 Low-Power Single Schmitt-Trigger Buffer datasheet (Rev. J) | PDF | HTML | 2017/9/29 | ||
| Application brief | Understanding Schmitt Triggers (Rev. B) | PDF | HTML | 2025/4/17 | |||
| Application brief | Debounce a Switch | PDF | HTML | 2020/10/8 | |||
| 應用說明 | Designing and Manufacturing with TI's X2SON Packages | 2017/8/23 |
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YFP) | 4 | Ultra Librarian |
| X2SON (DPW) | 5 | Ultra Librarian |
| SOT-5X3 (DRL) | 5 | Ultra Librarian |
| SOT-SC70 (DCK) | 5 | Ultra Librarian |
| X2SON (DSF) | 6 | Ultra Librarian |
| SOT-23 (DBV) | 5 | Ultra Librarian |
| USON (DRY) | 6 | Ultra Librarian |
| DSBGA (YZP) | 5 | Ultra Librarian |