TPSI8830
- Integrated back-back MOSFETs with ± 80V
Operation
- RON = 30mΩ (TJ = 25°C)
- IOFF = 1µA at 60V (TJ = 105°C)
- Power path overcurrent protection with fault
signal across isolation
- Version A: 4A
- Version B: 6A
- Wide supply range: 3.0V to 5.5V
- Configurable fault retry timer (TMR)
- Low on-state primary side supply current (VDD)
- 5mA ON state VDD current
- Wide temperature range:–40 to 125°C
- Functional isolation:
- 200VRMS, 250VDC working voltage
- 570VRMS, 800VDC transient voltage (60s)
- SSOP 14-pin (DFP) package with 8mm of creepage and clearance
-
Functional Safety Capable
- Documentation available to aid in ISO 26262 and IEC 61508 system design
The TPSI8830 is an isolated solid-state relay designed for industrial applications. The TPSI8830 uses TI’s high reliability capacitive isolation technology in combination with internal back-to-back MOSFETs to form a completely integrated option requiring no secondary side power supply. The TPSI8830 improves system reliability as TI’s capacitive isolation technology does not suffer from mechanical wear-out or photo degradation failure modes common in mechanical relay and photo relay components.
The primary side of the device is powered by only 5mA of input current and incorporates a fail-safe EN pin preventing any possibility of back powering the VDD supply. In most applications, the VDD pin of the device must connect to a system supply from 3.0V to 5.5V and the EN pin of the device must be driven by a GPIO output with logic HI from 1.8V to 5.5V. In other applications, the VDD and EN pins can be driven together directly from the system supply or from a GPIO output.
The secondary side consists of back-to-back MOSFETs with a standoff voltage of ±80V from S1 to S2. The TPSI8830 integrates bidirectional overcurrent protection to prevent damage due to output miswiring or short to ground.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | TPSI8830 80V, 20mΩ, 4A, Solid-state Relay with Overcurrent Protection, Load Diagnostics and Functional Isolati datasheet | PDF | HTML | 2026/5/28 |
設計與開發
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TPSI88XXEVM — TPSI88xx 評估模組
TPSI88XXEVM 是用於評估 TPSI88XX 系列中裝置性能的硬體評估模組。使用 TPSI88XXEVM 評估應用需求，例如恆溫器及 PLC 數位輸出模組。EVM 已安裝 TPSI8830ZB (DFP 封裝)。
TPSI88XXEVM-DOC-CERT — TPSI88XXEVM EU Declaration of Conformity (DoC)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SSOP (DFJ) | 14 | Ultra Librarian |
訂購與品質
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。