TPSM53604
- Functional Safety-Capable
- 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package
- Industry’s smallest 36-V, 4-A footprint: 85 mm2 solution size (single sided)
- Low EMI: meets CISPR11 radiated emissions
- Excellent thermal performance: up to 20 W output power at 85°C, no airflow
- Standard footprint: single large thermal pad and all pins accessible from perimeter
- Input voltage range: 3.8 V to 36 V
- Output voltage range: 1 V to 7 V
- Efficiency up to 95%
- Power-good flag
- Precision enable
- Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
- Operating IC junction range: –40°C to +125°C
- Operating ambient range: –40°C to +105°C
- Shock and vibration tested to Mil-STD-883D
- Pin compatible with: 3-A TPSM53603 and 2-A TPSM53602
- Create a custom design using the TPSM53604 with the WEBENCH Power Designer
- Download the EVM Design Files for fast board design
The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | TPSM53604 36-V Input, 4-A Power Module in Enhanced HotRod™ QFN Package datasheet (Rev. C) | PDF | HTML | 2021/9/30 | ||
| 應用說明 | Soldering Considerations for Power Modules (Rev. C) | PDF | HTML | 2024/3/14 | |||
| 白皮書 | Addressing Factory Automation Challenges with Innovations in Power Design | PDF | HTML | 2021/9/28 | |||
| 功能安全資訊 | TPSM53604 Functional Safety, FIT Rate, Failure Mode Distribution, and Pin FMA | PDF | HTML | 2021/8/24 | |||
| 技術文章 | Powering medical imaging applications with DC/DC buck converters | PDF | HTML | 2020/11/24 | |||
| 應用說明 | Soldering Requirements for BQFN Packages (Rev. C) | 2020/3/5 | ||||
| 技術文章 | 35 years later, APEC continues to set the tone for innovation in power management | PDF | HTML | 2020/2/27 | |||
| 應用說明 | Practical Thermal Design With DC/DC Power Modules (Rev. A) | 2019/11/20 | ||||
| 白皮書 | Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Packaging | 2019/11/19 | ||||
| 應用說明 | Using the TPSM5360x for an Inverting Buck-Boost Application | 2019/10/29 |
設計與開發
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TPSM53604EVM — 3.8-V 至 36-V 輸入、4-A 電源模組評估板
SNVR482 — TPSM53604 EVM Design Files
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| B3QFN (RDA) | 15 | Ultra Librarian |
訂購與品質
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。