SGLS307P
July 2006 – February 2018
TLK2711-SP
PRODUCTION DATA.
1
Features
2
Applications
3
Description
External Component Interconnection
4
Revision History
5
Description (continued)
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
TTL Input Electrical Characteristics
7.6
Transmitter/Receiver Electrical Characteristics
7.7
Reference Clock (TXCLK) Timing Requirements
7.8
TTL Output Switching Characteristics
7.9
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Transmit Interface
8.3.2
Transmit Data Bus
8.3.3
Data Transmission Latency
8.3.4
8-Bit/10-Bit Encoder
8.3.5
Pseudo-Random Bit Stream (PRBS) Generator
8.3.6
Parallel to Serial
8.3.7
High-Speed Data Output
8.3.8
Receive Interface
8.3.9
Receive Data Bus
8.3.10
Data Reception Latency
8.3.11
Serial to Parallel
8.3.12
Comma Detect and 8-Bit/10-Bit Decoding
8.3.13
LOS Detection
8.3.14
PRBS Verification
8.3.15
Reference Clock Input
8.3.16
Operating Frequency Range
8.3.17
Testability
8.3.18
Loopback Testing
8.3.19
BIST
8.3.20
Power-On Reset
8.4
Device Functional Modes
8.4.1
Power-Down Mode
8.4.2
High-Speed I/O Directly-Coupled Mode
8.4.3
High-Speed I/O AC-Coupled Mode
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Receiving Notification of Documentation Updates
12.2
Community Resources
12.3
Trademarks
12.4
Electrostatic Discharge Caution
12.5
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
HFG|68
MCQF014F
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sgls307p_oa
8
Detailed Description