SGLS307P July   2006  – February 2018 TLK2711-SP

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     External Component Interconnection
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 TTL Input Electrical Characteristics
    6. 7.6 Transmitter/Receiver Electrical Characteristics
    7. 7.7 Reference Clock (TXCLK) Timing Requirements
    8. 7.8 TTL Output Switching Characteristics
    9. 7.9 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Transmit Interface
      2. 8.3.2  Transmit Data Bus
      3. 8.3.3  Data Transmission Latency
      4. 8.3.4  8-Bit/10-Bit Encoder
      5. 8.3.5  Pseudo-Random Bit Stream (PRBS) Generator
      6. 8.3.6  Parallel to Serial
      7. 8.3.7  High-Speed Data Output
      8. 8.3.8  Receive Interface
      9. 8.3.9  Receive Data Bus
      10. 8.3.10 Data Reception Latency
      11. 8.3.11 Serial to Parallel
      12. 8.3.12 Comma Detect and 8-Bit/10-Bit Decoding
      13. 8.3.13 LOS Detection
      14. 8.3.14 PRBS Verification
      15. 8.3.15 Reference Clock Input
      16. 8.3.16 Operating Frequency Range
      17. 8.3.17 Testability
      18. 8.3.18 Loopback Testing
      19. 8.3.19 BIST
      20. 8.3.20 Power-On Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
      2. 8.4.2 High-Speed I/O Directly-Coupled Mode
      3. 8.4.3 High-Speed I/O AC-Coupled Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Transmitter/Receiver Electrical Characteristics

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VOD(p) Preemphasis VOD, direct,
VOD(p) = |VTXP – VTXN|
Rt = 50 Ω, PREM = high, DC coupled,
see Figure 3
655 800 1100 mV
Rt = 50 Ω, PREM = low, DC coupled,
see Figure 3
590 740 1050
VOD(pp_p) Differential, peak-to-peak output voltage with preemphasis Rt = 50 Ω, PREM = high, DC coupled,
see Figure 3
1310 1600 2200 mVp-p
Rt = 50 Ω, PREM = low, DC coupled,
see Figure 3
1180 1480 2100
VOD(d) Deemphais output voltage,
|VTXP – VTXN|
Rt = 50 Ω, DC coupled, see Figure 3 540 650 950 mV
VOD(pp_d) Differential, peak-to-peak output voltage with deemphasis Rt = 50 Ω, DC coupled, see Figure 3 1080 1300 1900 mVp-p
V(cmt) Transmit common mode voltage range, (VTXP + VTXN) / 2 Rt = 50 Ω, see Figure 3 1000 1250 1450 mV
VID Receiver input voltage differential,
|VRXP – VRXN|
See (2)  220 1600 mV
V(cmr) Receiver common mode voltage range, (VRXP + VRXN) / 2 See (2) 1000 1250 2250 mV
Ilkg Receiver input leakage current –10 10 µA
CI Receiver input capacitance 4 pF
Serial data total jitter (peak to peak) Differential output jitter at 2.5 Gbps,
Random + deterministic, PRBS pattern
0.28 UI(1)
Differential output jitter at 1.6 Gbps,
Random + deterministic, PRBS pattern
0.32
tt, tf Differential output signal rise, fall time (20% to 80%) RL = 50 Ω, CL = 5 pF, see Figure 3 150 ps
Jitter tolerance eye closure Differential input jitter, random + deterministic, PRBS pattern at zero crossing(2) 0.4 UI
td(Tx latency) Tx latency See Figure 8 34 38 bits
td(Rx latency) Rx latency See Figure 11 76 107 bits
UI is the time interval of one serialized bit.
Nonproduction tested parameters.