SGLS307P July   2006  – February 2018 TLK2711-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     External Component Interconnection
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 TTL Input Electrical Characteristics
    6. 7.6 Transmitter/Receiver Electrical Characteristics
    7. 7.7 Reference Clock (TXCLK) Timing Requirements
    8. 7.8 TTL Output Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Transmit Interface
      2. 8.3.2  Transmit Data Bus
      3. 8.3.3  Data Transmission Latency
      4. 8.3.4  8-Bit/10-Bit Encoder
      5. 8.3.5  Pseudo-Random Bit Stream (PRBS) Generator
      6. 8.3.6  Parallel to Serial
      7. 8.3.7  High-Speed Data Output
      8. 8.3.8  Receive Interface
      9. 8.3.9  Receive Data Bus
      10. 8.3.10 Data Reception Latency
      11. 8.3.11 Serial to Parallel
      12. 8.3.12 Comma Detect and 8-Bit/10-Bit Decoding
      13. 8.3.13 LOS Detection
      14. 8.3.14 PRBS Verification
      15. 8.3.15 Reference Clock Input
      16. 8.3.16 Operating Frequency Range
      17. 8.3.17 Testability
      18. 8.3.18 Loopback Testing
      19. 8.3.19 BIST
      20. 8.3.20 Power-On Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
      2. 8.4.2 High-Speed I/O Directly-Coupled Mode
      3. 8.4.3 High-Speed I/O AC-Coupled Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from O Revision (March 2016) to P Revision

  • Changed column header of Table 4 indicating correct order of receive data bus bitsGo
  • Added Receiving Notification of Documentation Updates sectionGo

Changes from N Revision (December 2015) to O Revision

  • Changed reference to table note (2) Internal 10-kΩ pulldown for TKLSB and TKMSBGo

Changes from M Revision (October 2014) to N Revision

  • Updated the frequency range of TXCLK Go
  • Updated Handling Ratings table to an ESD Ratings table and moved Tstg to the Absolute Maximum Ratings tableGo
  • Added Community ResourcesGo

Changes from L Revision (August 2014) to M Revision

Changes from K Revision (July 2014) to L Revision

  • Updated Power-On/Reset Timing Diagram optionsGo

Changes from J Revision (May 2014) to K Revision

  • Updated pin description for ENABLEGo
  • Updated pin voltages in Absolute Maximum RatingsGo
  • Added more information to Power-On Reset detailing two power-on/reset timing options Go

Changes from I Revision (January 2014) to J Revision

  • Changed format to meet latest data sheet standards; added new sections and moved existing sections Go
  • Changed DescriptionGo
  • Changed paragraph for LCKREFN in Description (continued)Go
  • Changed Description of LCKREFN in Go
  • Changed Power-On Reset section Go

Changes from H Revision (December 2013) to I Revision

  • Added /EM bullet to FeaturesGo
  • Deleted Ordering Information tableGo