The TLV900x family includes single (TLV9001), dual (TLV9002), and quad-channel (TLV9004) low-voltage (1.8 V to 5.5 V) operational amplifiers (op amps) with rail-to-rail input and output swing capabilities. These op amps provide a cost-effective solution for space-constrained applications such as smoke detectors, wearable electronics, and small appliances where low-voltage operation and high capacitive-load drive are required. The capacitive-load drive of the TLV900x family is 500 pF, and the resistive open-loop output impedance makes stabilization easier with much higher capacitive loads. These op amps are designed specifically for low-voltage operation (1.8 V to 5.5 V) with performance specifications similar to the TLV600x devices.
The robust design of the TLV900x family simplifies circuit design. The op amps feature unity-gain stability, an integrated RFI and EMI rejection filter, and no-phase reversal in overdrive conditions.
The TLV900x devices include a shutdown mode (TLV9001S, TLV9002S and TLV9004S) that allow the amplifiers to switch off into standby mode with typical current consumption less than 1 µA.
Micro-size packages, such as SOT-553 and WSON, are offered for all channel variants (single, dual, and quad), along with industry-standard packages such as SOIC, MSOP, SOT-23 and TSSOP packages.
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| Part number | Order | Number of channels (#) | Total supply voltage (Min) (+5V=5, +/-5V=10) | Total supply voltage (Max) (+5V=5, +/-5V=10) | GBW (Typ) (MHz) | Slew rate (Typ) (V/us) | Rail-to-rail | Vos (offset voltage @ 25 C) (Max) (mV) | Iq per channel (Typ) (mA) | Vn at 1 kHz (Typ) (nV/rtHz) | Rating | Operating temperature range (C) | Package Group | Package size: mm2:W x L (PKG) | Offset drift (Typ) (uV/C) | Features | Input bias current (Max) (pA) | CMRR (Typ) (dB) | Output current (Typ) (mA) | Architecture |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TLV9002 |
|
2 | 1.8 | 5.5 | 1 | 2 |
In
Out |
1.5 | 0.06 | 28 | Catalog | -40 to 125 |
SOIC | 8
TSSOP | 8 VSSOP | 10 VSSOP | 8 WSON | 8 X2QFN | 10 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8TSSOP: 19 mm2: 6.4 x 3 (TSSOP | 8) 10VSSOP: 9 mm2: 3 x 3 (VSSOP | 10) 8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) See datasheet (WSON) 10X2QFN: 3 mm2: 2 x 1.5 (X2QFN | 10) |
0.6 |
Cost Optimized
EMI Hardened Shutdown Small Size |
90 | 15 | CMOS | |
| OPA2313 |
|
2 | 1.8 | 5.5 | 1 | 0.5 |
In
Out |
2.5 | 0.05 | 25 | Catalog | -40 to 125 |
SOIC | 8
SON | 8 VSSOP | 8 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
See datasheet (SON) 8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) |
2 |
EMI Hardened
Small Size |
10 | 80 | 15 | CMOS |
| TLV2313 |
|
2 | 1.8 | 5.5 | 1 | 0.5 |
In
Out |
3 | 0.065 | 26 | Catalog | -40 to 125 |
SOIC | 8
VSSOP | 8 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) |
2 |
Cost Optimized
EMI Hardened |
85 | 15 | CMOS | |
| TLV2314 |
|
2 | 1.8 | 5.5 | 3 | 1.5 |
In
Out |
3 | 0.15 | 16 | Catalog | -40 to 125 |
SOIC | 8
VSSOP | 8 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) |
2 |
Cost Optimized
EMI Hardened |
96 | 20 | CMOS |
