SWRS201C January   2017  – March 2025 CC2640R2F-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Functional Block Diagram
  6. Device Comparison
    1. 5.1 Related Products
  7. Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Wettable Flanks
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Consumption Summary
    5. 7.5  General Characteristics
    6. 7.6  1Mbps GFSK (Bluetooth Low Energy Technology)—RX
    7. 7.7  1Mbps GFSK (Bluetooth Low Energy Technology)—TX
    8. 7.8  24MHz Crystal Oscillator (XOSC_HF)
    9. 7.9  32.768kHz Crystal Oscillator (XOSC_LF)
    10. 7.10 48MHz RC Oscillator (RCOSC_HF)
    11. 7.11 32kHz RC Oscillator (RCOSC_LF)
    12. 7.12 ADC Characteristics
    13. 7.13 Temperature Sensor
    14. 7.14 Battery Monitor
    15. 7.15 Continuous Time Comparator
    16. 7.16 Low-Power Clocked Comparator
    17. 7.17 Programmable Current Source
    18. 7.18 Synchronous Serial Interface (SSI)
    19. 7.19 DC Characteristics
    20. 7.20 Thermal Resistance Characteristics for RGZ Package
    21. 7.21 Timing Requirements
    22. 7.22 Switching Characteristics
    23. 7.23 Typical Characteristics
  9. Detailed Description
    1. 8.1  Overview
    2. 8.2  Main CPU
    3. 8.3  RF Core
    4. 8.4  Sensor Controller
    5. 8.5  Memory
    6. 8.6  Debug
    7. 8.7  Power Management
    8. 8.8  Clock Systems
    9. 8.9  General Peripherals and Modules
    10. 8.10 System Architecture
  10. Application, Implementation, and Layout
    1. 9.1 Application Information
    2. 9.2 7 × 7 Internal Differential (7ID) Application Circuit
      1. 9.2.1 Layout
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Texas Instruments Low-Power RF Website
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Export Control Notice
    9. 10.9 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Sensor Controller

The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals in this domain may be controlled by the Sensor Controller Engine, which is a proprietary power-optimized CPU. This CPU can read and monitor sensors or perform other tasks autonomously, thereby significantly reducing power consumption and offloading the main Cortex-M3 CPU.

The Sensor Controller is set up using a PC-based configuration tool, called Sensor Controller Studio, and potential use cases may be (but are not limited to):

  • Analog sensors using integrated ADC
  • Digital sensors using GPIOs, bit-banged I2C, and SPI
  • UART communication for sensor reading or debugging
  • Capacitive sensing
  • Waveform generation
  • Pulse counting
  • Keyboard scan
  • Quadrature decoder for polling rotation sensors
  • Oscillator calibration

Note:

Texas Instruments provides application examples for some of these use cases, but not for all of them.

The peripherals in the Sensor Controller include the following:

  • The low-power clocked comparator can be used to wake the device from any state in which the comparator is active. A configurable internal reference can be used in conjunction with the comparator. The output of the comparator can also be used to trigger an interrupt or the ADC.
  • Capacitive sensing functionality is implemented through the use of a constant current source, a time-to-digital converter, and a comparator. The continuous time comparator in this block can also be used as a higher-accuracy alternative to the low-power clocked comparator. The Sensor Controller will take care of baseline tracking, hysteresis, filtering and other related functions.
  • The ADC is a 12-bit, 200-ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC can be triggered by many different sources, including timers, I/O pins, software, the analog comparator, and the RTC.
  • The Sensor Controller also includes a SPI–I2C digital interface.
  • The analog modules can be connected to up to eight different GPIOs.

The peripherals in the Sensor Controller can also be controlled from the main application processor.

Table 8-1 GPIOs Connected to the Sensor Controller(1)
ANALOG CAPABLE7 × 7 RGZ
DIO NUMBER
Y30
Y29
Y28
Y27
Y26
Y25
Y24
Y23
N7
N6
N5
N4
N3
N2
N1
N0
Up to 16 pins can be connected to the Sensor Controller. Up to 8 of these pins can be connected to analog modules.