SimpleLink™ automotive qualified 32-bit Arm Cortex-M3 Bluetooth® Low Energy wireless MCU
Product details
Parameters
Package | Pins | Size
Features
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 2: –40°C to +105°C ambient operating temperature range
- Device HBM ESD Classification Level 2
- Device CDM ESD Classification Level C3
- Microcontroller
- Powerful Arm Cortex-M3
- EEMBC CoreMark Score: 142
- Up to 48-MHz clock speed
- 275-KB nonvolatile memory, including 128-KB in-system Programmable Flash
- Up to 28-KB system SRAM, of which 20 KB is ultra-low leakage SRAM
- 8-KB SRAM for Cache or system RAM use
- 2-pin cJTAG and JTAG debugging
- Supports Over-the-Air (OTA) upgrade
- Ultra-low power sensor controller
- Can run autonomously from the rest of the system
- 16-bit architecture
- 2-KB ultra-low leakage SRAM for code and data
- Efficient code size architecture, placing drivers, Bluetooth low energy Controller, and bootloader in ROM to make more flash available for the application
- RoHS-compliant automotive grade package
- 7-mm × 7-mm RGZ VQFN48 with wettable flanks
- Peripherals
- 31 GPIOs, all digital peripheral pins can be routed to any GPIO
- Four general-purpose timer modules (eight 16-bit or four 32-bit timers, PWM each)
- 12-bit ADC, 200-ksamples/s, 8-channel analog MUX
- Continuous time comparator
- Ultra-low power analog comparator
- Programmable current source
- UART
- 2× SSI (SPI, MICROWIRE, TI)
- I2C, I2S
- Real-time clock (RTC)
- AES-128 security module
- True random number generator (TRNG)
- Support for eight capacitive-sensing buttons
- Integrated temperature sensor
- External system
- On-chip internal DC/DC converter
- Very few external components
- Seamless integration with the SimpleLink™ CC2590 and CC2592 range extenders
- Low power
- Wide supply voltage range: 1.8 to 3.8 V
- Active mode RX: 6.1 mA
- Active mode TX at 0 dBm: 7.0 mA
- Active mode TX at +5 dBm: 9.3 mA
- Active mode MCU: 61 µA/MHz
- Active mode MCU: 48.5 CoreMark/mA
- Active mode sensor controller: 0.4 mA + 8.2 µA/MHz
- Standby: 1.3 µA (RTC running and RAM/CPU retention)
- Shutdown: 150 nA (wake up on external events)
- RF section
- 2.4-GHz RF transceiver compatible with Bluetooth low energy (BLE) 4.2 and 5 specifications
- Excellent receiver sensitivity (–97 dBm for Bluetooth low energy 1 Mbps), selectivity, and blocking performance
- Programmable output power up to +5 dBm
- Link budget of 102 dB for Bluetooth low energy 1 Mbps
- Suitable for systems targeting compliance with worldwide radio frequency regulations
- ETSI EN 300 328 and EN 300 440 (Europe)
- FCC CFR47 Part 15 (US)
- ARIB STD-T66 (Japan)
- Development Tools and Software
All trademarks are the property of their respective owners.
Description
The SimpleLink™ Bluetooth ® low energy CC2640R2F-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth ® 4.2 and Bluetooth ® 5 low energy automotive applications such as Passive Entry/Passive Start (PEPS), remote keyless entry (RKE), car sharing, piloted parking, cable replacement, and smartphone connectivity.
The CC2640R2F-Q1 device is part of the SimpleLink™ MCU platform from Texas Instruments™. The platform consists of Wi-Fi®, Bluetooth ® low energy, Sub-1 GHz, Ethernet, Zigbee, Thread, and host MCUs. These devices all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables users to add any combination of the portfolio’s devices into their design, allowing 100 percent code reuse when design requirements change. For more information, visit http://www.ti.com/wireless-connectivity/simplelink-solutions/overview/overview.html.
With very low active RF and MCU current consumption, in addition to flexible low power modes, the CC2640R2F-Q1 provides excellent battery life and allows long-range operation on small coin-cell batteries and a low power-consumption footprint for nodes connected to the car battery. Excellent receiver sensitivity and programmable output power provides industry-leading RF performance that is required for the demanding automotive RF environment.
The CC2640R2F-Q1 wireless MCU contains a 32-bit Arm® Cortex®-M3 processor that runs at 48 MHz as the main application processor and includes the Bluetooth ® 4.2 low energy controller and host libraries embedded in ROM. This architecture improves overall system performance and power consumption and frees up significant amounts of flash memory for the application.
Additionally, the device is AEC-Q100 Qualified at the Grade 2 temperature range (–40°C to +105°C) and is offered in a 7-mm × 7-mm VQFN package with wettable flanks. The wettable flanks help reduce production-line cost and increase the reliability enabled by optical inspection of solder points.
The Bluetooth low energy Software Stack is available free of charge from ti.com.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The Texas Instruments XDS110 EnergyTrace™ High Dynamic Range (ETHDR) is an accessory to the XDS110 Debug Probe (emulator) that increases the Dynamic Range of the Energy Trace feature. This allows performing very accurate power consumption measurements on all Simplelink Wireless MCUs while (...)
Features
The Texas Instruments XDS110 EnergyTrace™ High Dynamic Range (ETHDR) is the first accessory to the XDS110 Debug Probe (emulator). Designed to be a complete plug-in solution that brings EnergyTrace to the higher power wireless connectivity systems, it features an improved range, resolution and (...)
Description
The Spectrum Digital XDS200 is the first model of the XDS200 family of debug probes (emulators) for TI processors. The XDS200 family features a balance of low cost with good performance between the super low cost XDS110 and the high performance XDS560v2, while supporting a wide variety of standards (...)
Features
The XDS200 is the mid-range family of JTAG debug probes (emulators) for TI processors. Designed to deliver good performance and the most common features that place it between the low cost XDS110 and the high performance XDS560v2, the XDS200 is the balanced solution to debug TI microcontrollers (...)
Description
This LaunchPad™ speeds development with a Bluetooth® Low Energy (BLE) connection using the CC2640R2F or CC2640R2L devices. The compatible SDK offers a fully qualified Bluetooth 5 protocol stack for single-mode BLE applications supporting high speed mode and example Bluetooth 5 coded (...)
Features
- All IOs accessible on pin headers compatible with the LaunchPad/BoosterPack eco system
- Connect your LaunchPad to the cloud with Bluetooth low energy on your Smartphone
- Upgrade the LaunchPad firmware over-the-air from the SimpleLink Starter app
Software development
This SDK includes TI’s royalty-free Bluetooth® Low Energy (BLE) software stacks with all necessary software, example applications and documentation to quickly get started with (...)
Features
- Bluetooth 5 protocol stack (BLE5-Stack) supporting 2 Mbps PHY, LE Coded PHYs, Advertising Extensions (AE), multiple advertisement sets, and Channel Hopping Algorithm v2 (CSA#2) for improved shared spectrum coexistence.
- Full support for all Bluetooth core specification 4.2 features: LE Secure (...)
Features
- TI Arm® Clang Compiler Tools release 1.2.1.STS:
- Improved compiler-generated code size vs. legacy TI compiler
- GCC-compatible compiler command-line interface
- Source-Based Code Coverage, including Branch Coverage
- With tiarmprofdata and tiarmcov utilities to help with visualization
- Support for Arm C Language (...)
Features
- Includes ready to use examples for several common use-cases
- Full toolchain with built-in compiler and assembler for programming in a C-like programming language
- Provides rapid development by using the integrated sensor controller task testing and debugging functionality including visualization of (...)
SmartRF Flash Programmer can be used to program the flash memory in Texas Instruments 8051-based low-power RF wireless MCUs and for (...)
Features
- Programming of SW images on low-power RF wireless MCUs
- Programming/updating firmware and bootloader on the Evaluation Boards' USB MCU
- Append software image to existing software on device
- Read out software image from device into binary, hex or ELF files (elf and bin for ARM-devices only)
- Verify software (...)
CCS Uniflash is a standalone tool used to (...)
Design tools & simulation
Features
- Modules listed are based on TI wireless technology supporting Wi-Fi®, Bluetooth®, Zigbee®, Sub-1 GHz, Sigfox, 2.4 GHz, multi-band connectivity and more
- Modules integrate clocks, SPI flash and passive components
- Listings included for hardware customization, software integration and cloud services
- Listings (...)
Features
- Packet sniffer for IEEE 802.15.4, ZigBee and Thread networks
- Packet sniffer for IEEE 802.15.4ge (TI 15.4 Stack) networks
- Packet sniffer for TI EasyLink protocol
- Packet sniffer for Bluetooth® Low Energy
Features
- Link tests. Send and Receive packets between nodes.
- Antenna and radiation tests. Set the radio in continuous wave TX and RX states.
- A set of recommended/typical register settings for all devices.
- Read and write individual RF registers.
- Execute individual commands to control the radio.
- Detailed (...)
Reference designs
Design files
-
download TIDA-01632 PCB.pdf (1062KB) -
download TIDA-01632 Assembly Drawing (Rev. A).pdf (150KB) -
download TIDA-01632 BOM (Rev. A).pdf (99KB) -
download TIDA-01632 CAD Files (Rev. B).zip (917KB) -
download TIDA-01632 Gerber (Rev. B).zip (499KB)
Design files
Design files
Design files
Design files
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
VQFN (RGZ) | 48 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
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