SWRS201C January   2017  – March 2025 CC2640R2F-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Wettable Flanks
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Consumption Summary
    5. 7.5  General Characteristics
    6. 7.6  1Mbps GFSK (Bluetooth Low Energy Technology)—RX
    7. 7.7  1Mbps GFSK (Bluetooth Low Energy Technology)—TX
    8. 7.8  24MHz Crystal Oscillator (XOSC_HF)
    9. 7.9  32.768kHz Crystal Oscillator (XOSC_LF)
    10. 7.10 48MHz RC Oscillator (RCOSC_HF)
    11. 7.11 32kHz RC Oscillator (RCOSC_LF)
    12. 7.12 ADC Characteristics
    13. 7.13 Temperature Sensor
    14. 7.14 Battery Monitor
    15. 7.15 Continuous Time Comparator
    16. 7.16 Low-Power Clocked Comparator
    17. 7.17 Programmable Current Source
    18. 7.18 Synchronous Serial Interface (SSI)
    19. 7.19 DC Characteristics
    20. 7.20 Thermal Resistance Characteristics for RGZ Package
    21. 7.21 Timing Requirements
    22. 7.22 Switching Characteristics
    23. 7.23 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  Main CPU
    3. 8.3  RF Core
    4. 8.4  Sensor Controller
    5. 8.5  Memory
    6. 8.6  Debug
    7. 8.7  Power Management
    8. 8.8  Clock Systems
    9. 8.9  General Peripherals and Modules
    10. 8.10 System Architecture
  10. 9 Application, Implementation, and Layout
    1. 9.1 Application Information
    2. 9.2 7 × 7 Internal Differential (7ID) Application Circuit
      1. 9.2.1 Layout
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Texas Instruments Low-Power RF Website
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Export Control Notice
    9. 10.9 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 Signal Descriptions—RGZ Package

Table 6-1 Signal Descriptions—RGZ Package
NAMENO.TYPEDESCRIPTION
DCDC_SW33PowerOutput from internal DC/DC(1)
DCOUPL23Power1.27V regulated digital-supply decoupling capacitor(2)
DIO_05Digital I/OGPIO, Sensor Controller
DIO_16Digital I/OGPIO, Sensor Controller
DIO_27Digital I/OGPIO, Sensor Controller
DIO_38Digital I/OGPIO, Sensor Controller
DIO_49Digital I/OGPIO, Sensor Controller
DIO_510Digital I/OGPIO, Sensor Controller, high-drive capability
DIO_611Digital I/OGPIO, Sensor Controller, high-drive capability
DIO_712Digital I/OGPIO, Sensor Controller, high-drive capability
DIO_814Digital I/OGPIO
DIO_915Digital I/OGPIO
DIO_1016Digital I/OGPIO
DIO_1117Digital I/OGPIO
DIO_1218Digital I/OGPIO
DIO_1319Digital I/OGPIO
DIO_1420Digital I/OGPIO
DIO_1521Digital I/OGPIO
DIO_1626Digital I/OGPIO, JTAG_TDO, high-drive capability
DIO_1727Digital I/OGPIO, JTAG_TDI, high-drive capability
DIO_1828Digital I/OGPIO
DIO_1929Digital I/OGPIO
DIO_2030Digital I/OGPIO
DIO_2131Digital I/OGPIO
DIO_2232Digital I/OGPIO
DIO_2336Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2437Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2538Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2639Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2740Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2841Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2942Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_3043Digital/Analog I/OGPIO, Sensor Controller, Analog
JTAG_TMSC24Digital I/OJTAG TMSC, high-drive capability
JTAG_TCKC25Digital I/OJTAG TCKC
RESET_N35Digital inputReset, active-low. No internal pullup.
RF_P1RF I/OPositive RF input signal to LNA during RX
Positive RF output signal to PA during TX
RF_N2RF I/ONegative RF input signal to LNA during RX
Negative RF output signal to PA during TX
VDDR45PowerConnect to output of internal DC/DC(2)(3)
VDDR_RF48PowerConnect to output of internal DC/DC(2)(4)
VDDS44Power1.8V to 3.8V main chip supply(1)
VDDS213Power1.8V to 3.8V DIO supply(1)
VDDS322Power1.8V to 3.8V DIO supply(1)
VDDS_DCDC34Power1.8V to 3.8V DC/DC supply
X32K_Q13Analog I/O32kHz crystal oscillator pin 1
X32K_Q24Analog I/O32kHz crystal oscillator pin 2
X24M_N46Analog I/O24MHz crystal oscillator pin 1
X24M_P47Analog I/O24MHz crystal oscillator pin 2
EGPPowerGround—Exposed Ground Pad
(1) See the technical reference manual listed in Section 10.3 for more details.
(2) Do not supply external circuitry from this pin.
(3) If internal DC/DC is not used, this pin is supplied internally from the main LDO.
(4) If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.