SWRS201C January   2017  – March 2025 CC2640R2F-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Wettable Flanks
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Consumption Summary
    5. 7.5  General Characteristics
    6. 7.6  1Mbps GFSK (Bluetooth Low Energy Technology)—RX
    7. 7.7  1Mbps GFSK (Bluetooth Low Energy Technology)—TX
    8. 7.8  24MHz Crystal Oscillator (XOSC_HF)
    9. 7.9  32.768kHz Crystal Oscillator (XOSC_LF)
    10. 7.10 48MHz RC Oscillator (RCOSC_HF)
    11. 7.11 32kHz RC Oscillator (RCOSC_LF)
    12. 7.12 ADC Characteristics
    13. 7.13 Temperature Sensor
    14. 7.14 Battery Monitor
    15. 7.15 Continuous Time Comparator
    16. 7.16 Low-Power Clocked Comparator
    17. 7.17 Programmable Current Source
    18. 7.18 Synchronous Serial Interface (SSI)
    19. 7.19 DC Characteristics
    20. 7.20 Thermal Resistance Characteristics for RGZ Package
    21. 7.21 Timing Requirements
    22. 7.22 Switching Characteristics
    23. 7.23 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  Main CPU
    3. 8.3  RF Core
    4. 8.4  Sensor Controller
    5. 8.5  Memory
    6. 8.6  Debug
    7. 8.7  Power Management
    8. 8.8  Clock Systems
    9. 8.9  General Peripherals and Modules
    10. 8.10 System Architecture
  10. 9 Application, Implementation, and Layout
    1. 9.1 Application Information
    2. 9.2 7 × 7 Internal Differential (7ID) Application Circuit
      1. 9.2.1 Layout
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Texas Instruments Low-Power RF Website
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Export Control Notice
    9. 10.9 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison

Table 5-1 Device Family Overview
DEVICEPHY SUPPORTFLASH
(KB)		RAM
(KB)		GPIOPACKAGE(1)
CC2640R2F-Q1(2)Bluetooth Low Energy (Normal, High Speed, Long Range, Automotive)1282031RGZ (Wettable Flanks), RGZ
CC2640R2Fxxx(2)Bluetooth Low Energy (Normal, High Speed, Long Range)1282031, 15, 14, 10RGZ, RHB, YFV, RSM
CC2650F128xxxMulti-Protocol(3)1282031, 15, 10RGZ, RHB, RSM
CC2640F128xxxBluetooth Low Energy (Normal)1282031, 15, 10RGZ, RHB, RSM
CC2630F128xxxIEEE 802.15.4 (Zigbee/6LoWPAN)1282031, 15, 10RGZ, RHB, RSM
CC2620F128xxxIEEE 802.15.4 (RF4CE)1282031, 10RGZ, RSM
(1) Package designator replaces the xxx in device name to form a complete device name, RGZ is 7mm × 7mm VQFN48, RHB is 5mm × 5mm VQFN32, RSM is 4mm × 4mm VQFN32, and YFV is 2.7mm × 2.7mm DSBGA.
(2) CC2640R2F-xxx devices contain Bluetooth 4.2 Host and Controller libraries in ROM, leaving more of the 128KB of flash available for
the customer application when used with supported BLE-Stack software protocol stack releases. Actual use of ROM and flash by
the protocol stack may vary depending on device software configuration. See Bluetooth Low Energy Stack for more details.
(3) The CC2650 device supports all PHYs and can be reflashed to run all the supported standards.
Table 5-2 Typical(1) Flash Memory Available for Customer Applications
DEVICESIMPLE BLE PERIPHERAL (BT 4.0)(2)SIMPLE BLE PERIPHERAL (BT 4.2)(2)(3)
CC2640R2Fxxx, CC2640R2F-Q1(4)83KB80KB
CC2640F128xxx, CC2650F128xxx41KB31KB
(1) Actual use of ROM and flash by the protocol stack will vary depending on the device software configuration. The values in this table are provided as guidance only.
(2) Application example with two services (GAP and Simple Profile). Compiled using IAR.
(3) BT4.2 configuration, including Secure Pairing, Privacy 1.2, and Data Length Extension
(4) Bluetooth Low Energy applications running on the CC2640R2F-Q1 device make use of up to 115KB of system ROM and up to 32KB of RF Core ROM to minimize flash usage. The maximum amount of nonvolatile memory available for Bluetooth Low Energy applications on the CC2640R2F-Q1 device is thus 275KB (128KB flash + 147KB ROM).