SLOSE70 December   2020 DRV8434S

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Indexer Timing Requirements
      1. 6.7.1 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 RMS Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2  PWM Motor Drivers
      3. 7.3.3  Microstepping Indexer
      4. 7.3.4  Controlling VREF with an MCU DAC
      5. 7.3.5  Current Regulation
      6. 7.3.6  Decay Modes
        1. 7.3.6.1 Slow Decay for Increasing and Decreasing Current
        2. 7.3.6.2 Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
        3. 7.3.6.3 Slow Decay for Increasing Current, Fast Decay for Decreasing current
        4. 7.3.6.4 Mixed Decay for Increasing and Decreasing Current
        5. 7.3.6.5 Smart tune Dynamic Decay
        6. 7.3.6.6 Smart tune Ripple Control
      7. 7.3.7  PWM OFF Time
      8. 7.3.8  Blanking time
      9. 7.3.9  Charge Pump
      10. 7.3.10 Linear Voltage Regulators
      11. 7.3.11 Logic Level, tri-level and quad-level Pin Diagrams
        1. 7.3.11.1 nFAULT Pin
      12. 7.3.12 Protection Circuits
        1. 7.3.12.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.12.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.12.3 Overcurrent Protection (OCP)
          1. 7.3.12.3.1 Latched Shutdown (OCP_MODE = 0b)
          2. 7.3.12.3.2 Automatic Retry (OCP_MODE = 1b)
        4. 7.3.12.4 Stall Detection
        5. 7.3.12.5 Open-Load Detection (OL)
        6. 7.3.12.6 Overtemperature Warning (OTW)
        7. 7.3.12.7 Thermal Shutdown (OTSD)
          1. 7.3.12.7.1 Latched Shutdown (OTSD_MODE = 0b)
          2. 7.3.12.7.2 Automatic Recovery (OTSD_MODE = 1b)
        8.       Fault Condition Summary
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2.      56
      3. 7.4.2 Disable Mode (nSLEEP = 1, ENABLE = 0)
      4. 7.4.3 Operating Mode (nSLEEP = 1, ENABLE = 1)
      5. 7.4.4 nSLEEP Reset Pulse
      6.      Functional Modes Summary
    5. 7.5 Programming
      1. 7.5.1 Serial Peripheral Interface (SPI) Communication
        1. 7.5.1.1 SPI Format
        2. 7.5.1.2 SPI for a Single Target Device
        3. 7.5.1.3 SPI for Multiple Target Devices in Daisy Chain Configuration
        4. 7.5.1.4 SPI for Multiple Target Devices in Parallel Configuration
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Mode
        4. 8.2.2.4 Application Curves
        5. 8.2.2.5 Thermal Application
          1. 8.2.2.5.1 Power Dissipation
          2. 8.2.2.5.2 Conduction Loss
          3. 8.2.2.5.3 Switching Loss
          4. 8.2.2.5.4 Power Dissipation Due to Quiescent Current
          5. 8.2.2.5.5 Total Power Dissipation
          6. 8.2.2.5.6 Device Junction Temperature Estimation
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.6.4 Mixed Decay for Increasing and Decreasing Current

GUID-5D01F5B9-9BD6-4688-A5C8-1D8D284525B4-low.gifFigure 7-11 Mixed-Mixed Decay Mode

Mixed decay begins as fast decay for an initial duration of the tOFF time, followed by slow decay for the remainder of tOFF time. In this mode, mixed decay occurs for both increasing and decreasing current steps.

This mode exhibits ripple larger than slow decay, but smaller than fast decay. On decreasing current steps, mixed decay settles to the new ITRIP level faster than slow decay.

When the winding current is held static for a long time (for example while no STEP input is present) or at very low step rates, slow decay may not properly regulate the current because back-EMF will be small or absent across the motor windings. In this case the motor current can rise rapidly and require an extremely long off-time to regulate the current. Increasing and decreasing current mixed decay mode allows the current to stay in regulation when no back-EMF is present across the motor windings.