SNOS641I October   1999  – July 2025 LM4041-N , LM4041-N-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions: ADJ Pinouts
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  LM4041-N LM4041-N-Q1 1.2 Electrical Characteristics (Industrial Temperature Range)
    6. 5.6  LM4041-N LM4041-N-Q1 1.2 Electrical Characteristics (Industrial Temperature Range)
    7. 5.7  LM4041-N LM4041-N-Q1 1.2 Electrical Characteristics (Extended Temperature Range)
    8. 5.8  LM4041-N LM4041-N-Q1 ADJ (Adjustable) Electrical Characteristics (Industrial Temperature Range)
    9. 5.9  LM4041-N LM4041-N-Q1 ADJ (Adjustable) Electrical Characteristics (Extended Temperature Range)
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Shunt Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Adjustable Shunt Regulator
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detail Design Procedure
      3. 8.2.3 Bounded Amplifier
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detail Design Procedure
        3. 8.2.3.3 Application Curve
      4. 8.2.4 Voltage Level Detector
        1. 8.2.4.1 Design Procedure
        2. 8.2.4.2 Detail Design Procedure
      5. 8.2.5 Precision Current Sink and Source
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
      6. 8.2.6 100mA Current Source
        1. 8.2.6.1 Design Requirements
        2. 8.2.6.2 Detailed Design Procedure
      7. 8.2.7 LM4041 in Clamp Circuits
        1. 8.2.7.1 Design Requirements
        2. 8.2.7.2 Detailed Design Procedure
      8. 8.2.8 Floating Current Detector
        1. 8.2.8.1 Design Requirement
        2. 8.2.8.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)±2000V
Charged-device model (CDM), per JEDEC specification JESD22-C101(3)±500
(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2) The human-body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. All pins are rated at 2kV for human-body model, but the feedback pin which is rated at 1kV.
(3) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250V CDM is possible with the necessary precautions.