SNOS641I October   1999  – July 2025 LM4041-N , LM4041-N-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions: ADJ Pinouts
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  LM4041-N LM4041-N-Q1 1.2 Electrical Characteristics (Industrial Temperature Range)
    6. 5.6  LM4041-N LM4041-N-Q1 1.2 Electrical Characteristics (Industrial Temperature Range)
    7. 5.7  LM4041-N LM4041-N-Q1 1.2 Electrical Characteristics (Extended Temperature Range)
    8. 5.8  LM4041-N LM4041-N-Q1 ADJ (Adjustable) Electrical Characteristics (Industrial Temperature Range)
    9. 5.9  LM4041-N LM4041-N-Q1 ADJ (Adjustable) Electrical Characteristics (Extended Temperature Range)
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Shunt Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Adjustable Shunt Regulator
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detail Design Procedure
      3. 8.2.3 Bounded Amplifier
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detail Design Procedure
        3. 8.2.3.3 Application Curve
      4. 8.2.4 Voltage Level Detector
        1. 8.2.4.1 Design Procedure
        2. 8.2.4.2 Detail Design Procedure
      5. 8.2.5 Precision Current Sink and Source
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
      6. 8.2.6 100mA Current Source
        1. 8.2.6.1 Design Requirements
        2. 8.2.6.2 Detailed Design Procedure
      7. 8.2.7 LM4041 in Clamp Circuits
        1. 8.2.7.1 Design Requirements
        2. 8.2.7.2 Detailed Design Procedure
      8. 8.2.8 Floating Current Detector
        1. 8.2.8.1 Design Requirement
        2. 8.2.8.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MINMAXUNIT
Reverse current20mA
Forward current10mA
Maximum output voltage (LM4041-NLM4041-N-Q1 ADJ)15V
Power dissipation (TA = 25°C)(3)DBZ package306mW
LP package550
DCK package241
Lead temperature  DBZ packagesVapor phase (60 seconds)215°C
Infrared (15 seconds)220°C
LP packageSoldering (10 seconds)260°C
Storage temperature, Tstg–65150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax − TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4041-N, TJmax = 125°C, and the typical thermal resistance (RθJA), when board mounted, is 326°C/W for the SOT-23 package, 415°C/W for the SC70 package and 180°C/W with 0.4-in lead length and 170°C/W with 0.125-in lead length for the TO-92 package.