SLASFC6A August   2024  – August 2025 TAS2120

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
      1. 6.3.1 Operational Modes
        1. 6.3.1.1 Hardware Shutdown
        2. 6.3.1.2 Hardware Config Modes
        3. 6.3.1.3 Software Power Modes Control and Software Reset
        4. 6.3.1.4 Efficiency and power saving modes
          1. 6.3.1.4.1 Noise Gate
          2. 6.3.1.4.2 Music Efficiency Mode
          3. 6.3.1.4.3 VDD Y-bridge
          4. 6.3.1.4.4 Class-H Boost
        5. 6.3.1.5 2S Battery Mode
        6. 6.3.1.6 External PVDD Mode
      2. 6.3.2 Faults and Status
        1. 6.3.2.1 Interrupt generation and clearing
    4. 6.4 Feature Description
      1. 6.4.1  PurePath™ Console 3 Software
      2. 6.4.2  Playback Signal Path
        1. 6.4.2.1 Digital Volume Control and Amplifier Output Level
        2. 6.4.2.2 High Pass Filter
        3. 6.4.2.3 Class-D Amplifier
        4. 6.4.2.4 Supply Tracking Limiters with Brown Out Prevention
          1. 6.4.2.4.1 Voltage Limiter and Clipping protection
        5. 6.4.2.5 Tone Generator
      3. 6.4.3  Digital Audio Serial Interface
        1. 6.4.3.1 Digital Loopback
      4. 6.4.4  Internal Boost
      5. 6.4.5  Boost Share
      6. 6.4.6  External Class-H Boost Controller
      7. 6.4.7  Supply Voltage Monitors
      8. 6.4.8  Thermal Protection
      9. 6.4.9  Clocks and PLL
        1. 6.4.9.1 Auto clock based wakeup and clock errors
      10. 6.4.10 Digital IO pins
    5. 6.5 Programming
      1. 6.5.1 I2C Control Interface
      2. 6.5.2 I2C Address Selection
      3. 6.5.3 General I2C Operation
      4. 6.5.4 I2C Single-Byte and Multiple-Byte Transfers
      5. 6.5.5 I2C Single-Byte Write
      6. 6.5.6 I2C Multiple-Byte Write
      7. 6.5.7 I2C Single-Byte Read
      8. 6.5.8 I2C Multiple-Byte Read
  8. 7 Register Maps
    1. 7.1  PAGE 0 Registers
    2. 7.2  PAGE 1 Registers
    3. 7.3  PAGE 2 Registers
    4. 7.4  PAGE 3 Registers
    5. 7.5  PAGE 4 Registers
    6. 7.6  PAGE 5 Registers
    7. 7.7  PAGE 6 Registers
    8. 7.8  PAGE 7 Registers
    9. 7.9  PAGE 8 Registers
    10. 7.10 BOOK100 PAGE9 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Mono/Stereo Configuration
        2. 8.2.2.2 Boost Converter Passive Devices
        3. 8.2.2.3 EMI Passive Devices
        4. 8.2.2.4 Miscellaneous Passive Devices
      3. 8.2.3 Application Performance Plots
    3. 8.3 What to Do and What Not to Do
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.1.1 Hardware Shutdown

The device can be powered down by asserting SDZ pin low. The shutdown behavior of the device when SDZ pin is pulled low is controlled by SDZ_MODE register settings.

In Hardware Shutdown mode (SDZ_MODE[1:0] = 00 or 01) if the SDZ pin is asserted low, the device consumes the minimum quiescent current from supplies. All registers lose state in this mode and go back to default settings, and I2C communication is disabled.

If configured in SDZ_MODE[1:0] = 00, when the SDZ pin is asserted low while audio is playing, the device will follow the normal power down sequencing like volume ramp down on the audio (if enabled), stop the Class-D switching, power down analog and digital blocks to ensure no power down pop and finally put the device into Hardware Shutdown mode. I2C communication is disabled while the SDZ pin is asserted low in this mode.

If configured in SDZ_MODE[1:0] = 01, when the SDZ pin is asserted low the device will immediately enter the hardware shutdown and will not go through any power-down sequencing routine. It is recommended to ensure that the audio input signal is ramped down to the idle channel before asserting the SDZ pin low in this mode, device software mute mode can be used to realize this. I2C communication is disabled while the SDZ pin is asserted low in this mode.

Finally, the device can be configured to Software shutdown mode by setting SDZ_MODE[1:0] = 10. In this mode, when the SDZ pin is pulled low, the device will follow normal power-down sequencing and enter software shutdown mode. All the device register configuration programmed is retained as is from the state the device was in before the SDZ pin was pulled low. I2C communication is still available while the SDZ pin is asserted low in this mode.

Table 6-1 Shutdown Control
SDZ_MODE[1:0]Configuration
00 (default)Hardware shutdown mode with power-down sequencing
01Hardware shutdown mode - immediate
10Software shutdown mode (All register values retained)
11Reserved

When SDZ_MODE[1:0] is 00 or 10, the device goes through shutdown sequencing and the SDZ pin must be held low for the entire duration of the shutdown time. The shutdown time is specified in the Power up/down Time section of the Electrical Characteristics section. When SDZ is released, the device will sample relevant configuration and address pins then enter software shutdown mode.