SLASFC6A August   2024  – August 2025 TAS2120

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
      1. 6.3.1 Operational Modes
        1. 6.3.1.1 Hardware Shutdown
        2. 6.3.1.2 Hardware Config Modes
        3. 6.3.1.3 Software Power Modes Control and Software Reset
        4. 6.3.1.4 Efficiency and power saving modes
          1. 6.3.1.4.1 Noise Gate
          2. 6.3.1.4.2 Music Efficiency Mode
          3. 6.3.1.4.3 VDD Y-bridge
          4. 6.3.1.4.4 Class-H Boost
        5. 6.3.1.5 2S Battery Mode
        6. 6.3.1.6 External PVDD Mode
      2. 6.3.2 Faults and Status
        1. 6.3.2.1 Interrupt generation and clearing
    4. 6.4 Feature Description
      1. 6.4.1  PurePath™ Console 3 Software
      2. 6.4.2  Playback Signal Path
        1. 6.4.2.1 Digital Volume Control and Amplifier Output Level
        2. 6.4.2.2 High Pass Filter
        3. 6.4.2.3 Class-D Amplifier
        4. 6.4.2.4 Supply Tracking Limiters with Brown Out Prevention
          1. 6.4.2.4.1 Voltage Limiter and Clipping protection
        5. 6.4.2.5 Tone Generator
      3. 6.4.3  Digital Audio Serial Interface
        1. 6.4.3.1 Digital Loopback
      4. 6.4.4  Internal Boost
      5. 6.4.5  Boost Share
      6. 6.4.6  External Class-H Boost Controller
      7. 6.4.7  Supply Voltage Monitors
      8. 6.4.8  Thermal Protection
      9. 6.4.9  Clocks and PLL
        1. 6.4.9.1 Auto clock based wakeup and clock errors
      10. 6.4.10 Digital IO pins
    5. 6.5 Programming
      1. 6.5.1 I2C Control Interface
      2. 6.5.2 I2C Address Selection
      3. 6.5.3 General I2C Operation
      4. 6.5.4 I2C Single-Byte and Multiple-Byte Transfers
      5. 6.5.5 I2C Single-Byte Write
      6. 6.5.6 I2C Multiple-Byte Write
      7. 6.5.7 I2C Single-Byte Read
      8. 6.5.8 I2C Multiple-Byte Read
  8. 7 Register Maps
    1. 7.1  PAGE 0 Registers
    2. 7.2  PAGE 1 Registers
    3. 7.3  PAGE 2 Registers
    4. 7.4  PAGE 3 Registers
    5. 7.5  PAGE 4 Registers
    6. 7.6  PAGE 5 Registers
    7. 7.7  PAGE 6 Registers
    8. 7.8  PAGE 7 Registers
    9. 7.9  PAGE 8 Registers
    10. 7.10 BOOK100 PAGE9 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Mono/Stereo Configuration
        2. 8.2.2.2 Boost Converter Passive Devices
        3. 8.2.2.3 EMI Passive Devices
        4. 8.2.2.4 Miscellaneous Passive Devices
      3. 8.2.3 Application Performance Plots
    3. 8.3 What to Do and What Not to Do
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Power Supply Recommendations

TAS2120 power up sequence of supply rails and ASI clocks can be applied in any order as long as SDZ pin is held low. Once all supplies and ASI clocks are stable the SDZ pin can be pulled high to initialize the device.

For power down sequence recommedation is to mute the device first. Following that SDZ pin must be pulled low before supply rails are ramped down in any order.

If using the device in external PVDD mode, the SW pad must be kept floating.

Once all the supplies are valid and SDZ pin is released to high, the digital core voltage regulator powers up, and starts the internal initialization sequence. After a hardware or software reset, additional I2C commands to the device should be delayed by at-least 300us to allow the device internal blocks to be initialized.

VBAT supply voltage needs to be 2.2V or higher at all times including ripple conditions to avoid device VBAT UVLO.