SBOS527G December   2010  – September 2025 TMP411-Q1 , TMP411D-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (TMP411-Q1)
    6. 6.6  Electrical Characteristics (TMP411D-Q1)
    7. 6.7  Timing Characteristics
    8. 6.8  Timing Diagrams
    9. 6.9  Typical Characteristics (TMP411-Q1)
    10. 6.10 Typical Characteristics (TMP411D-Q1)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Series Resistance Cancellation
      2. 7.3.2 Differential Input Capacitance
      3. 7.3.3 Temperature Measurement Data
      4. 7.3.4 THERM (PIN 4) and ALERT/ THERM2 (PIN 6)
      5. 7.3.5 Sensor Fault
      6. 7.3.6 Undervoltage Lockout (TMP411-Q1 Only)
      7. 7.3.7 Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 One-Shot Conversion
    5. 7.5 Programming
      1. 7.5.1  Serial Interface
      2. 7.5.2  Bus Overview
      3. 7.5.3  Timing Diagrams
      4. 7.5.4  Serial Bus Address
      5. 7.5.5  Read/Write Operations
      6. 7.5.6  Time-Out Function
      7. 7.5.7  High-Speed Mode
      8. 7.5.8  General-Call Reset
      9. 7.5.9  Software Reset
      10. 7.5.10 SMBUS Alert Function
  9. 8 Register Map
    1. 8.1  Register Information
    2. 8.2  Pointer Register
    3. 8.3  Temperature Registers
    4. 8.4  Limit Registers
    5. 8.5  Status Register
    6. 8.6  Configuration Register
    7. 8.7  Resolution Register
    8. 8.8  Conversion Rate Register
    9. 8.9  N-factor Correction Register
    10. 8.10 Minimum and Maximum Registers
    11. 8.11 Consecutive Alert Register
    12. 8.12 THERM Hysteresis Register
    13. 8.13 Identification Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4.1 Layout Guidelines

Remote temperature sensing on the TMP411-Q1 and TMP411D-Q1 devices measures small voltages using low currents, and therefore, noise at the device inputs must be minimized. Most applications using the TMP411-Q1 and TMP411D-Q1 devices have high digital content, with several clocks and logic-level transitions creating a noisy environment. The layout must adhere to the following guidelines:

  1. Place the TMP411-Q1 and TMP411D-Q1 devices as close to the remote junction sensor as possible.
  2. Route the D+ and D− traces next to each other and shield them from adjacent signals using ground guard traces, as shown in Figure 9-10. If a multilayer PCB is used, bury these traces between ground or VDD planes to shield them from extrinsic noise sources. Five-mil (0.127mm) PCB traces are recommended.
  3. Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are used, make the same number and approximate locations of copper-to-solder connections in both the D+ and D− connections to cancel any thermocouple effects.
  4. Use a 0.1μF local bypass capacitor directly between the V+ and GND of the TMP411-Q1 and TMP411D-Q1 devices, as shown in Figure 9-11. Minimize filter capacitance between D+ and D− to 1000pF or less for optimum measurement performance. This capacitance includes any cable capacitance between the remote temperature sensor and the TMP411-Q1 and TMP411D-Q1 devices.
  5. If the connection between the remote temperature sensor and the TMP411-Q1 and TMP411D-Q1 devices is less than 8 inches (20cm), use a twisted-wire pair connection. Beyond 8 inches (20cm), use a twisted, shielded pair with the shield grounded as close to the TMP411-Q1 and TMP411D-Q1 devices as possible. Leave the remote sensor connection end of the shield wire open to avoid ground loops and 60Hz pickup.

TMP411-Q1 TMP411D-Q1 Example Signal Traces
A. 5mil (0.127mm) traces with 5mil (0.127mm) spacing
Figure 9-10 Example Signal Traces
TMP411-Q1 TMP411D-Q1 Suggested Bypass Capacitor PlacementFigure 9-11 Suggested Bypass Capacitor Placement