SBOS527G December   2010  – September 2025 TMP411-Q1 , TMP411D-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (TMP411-Q1)
    6. 6.6  Electrical Characteristics (TMP411D-Q1)
    7. 6.7  Timing Characteristics
    8. 6.8  Timing Diagrams
    9. 6.9  Typical Characteristics (TMP411-Q1)
    10. 6.10 Typical Characteristics (TMP411D-Q1)
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Series Resistance Cancellation
      2. 7.3.2 Differential Input Capacitance
      3. 7.3.3 Temperature Measurement Data
      4. 7.3.4 THERM (PIN 4) and ALERT/ THERM2 (PIN 6)
      5. 7.3.5 Sensor Fault
      6. 7.3.6 Undervoltage Lockout (TMP411-Q1 Only)
      7. 7.3.7 Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 One-Shot Conversion
    5. 7.5 Programming
      1. 7.5.1  Serial Interface
      2. 7.5.2  Bus Overview
      3. 7.5.3  Timing Diagrams
      4. 7.5.4  Serial Bus Address
      5. 7.5.5  Read/Write Operations
      6. 7.5.6  Time-Out Function
      7. 7.5.7  High-Speed Mode
      8. 7.5.8  General-Call Reset
      9. 7.5.9  Software Reset
      10. 7.5.10 SMBUS Alert Function
  9. Register Map
    1. 8.1  Register Information
    2. 8.2  Pointer Register
    3. 8.3  Temperature Registers
    4. 8.4  Limit Registers
    5. 8.5  Status Register
    6. 8.6  Configuration Register
    7. 8.7  Resolution Register
    8. 8.8  Conversion Rate Register
    9. 8.9  N-factor Correction Register
    10. 8.10 Minimum and Maximum Registers
    11. 8.11 Consecutive Alert Register
    12. 8.12 THERM Hysteresis Register
    13. 8.13 Identification Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics (TMP411-Q1)

At TA = 25°C and V+ = VS = 5V (unless otherwise noted)

TMP411-Q1 TMP411D-Q1 Local Temperature Error vs TMP411-Q1 Ambient Temperature (Legacy Chip)Figure 6-2 Local Temperature Error vs TMP411-Q1 Ambient Temperature (Legacy Chip)
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs TMP411-Q1 Ambient Temperature (Legacy Chip)Figure 6-4 Remote Temperature Error vs TMP411-Q1 Ambient Temperature (Legacy Chip)
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs Leakage Resistance (Legacy Chip)Figure 6-6 Remote Temperature Error vs Leakage Resistance (Legacy Chip)
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs Series Resistance (Diode-Connected Transistor, 2N3906 PNP) (Legacy Chip)Figure 6-8 Remote Temperature Error vs Series Resistance (Diode-Connected Transistor, 2N3906 PNP) (Legacy Chip)
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs Series Resistance (GND Collector-Connected Transistor, 2N3906 PNP) (Legacy Chip)Figure 6-10 Remote Temperature Error vs Series Resistance (GND Collector-Connected Transistor, 2N3906 PNP) (Legacy Chip)
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs Differential Capacitance (Legacy Chip)Figure 6-12 Remote Temperature Error vs Differential Capacitance (Legacy Chip)
TMP411-Q1 TMP411D-Q1 Temperature Error vs Power-Supply Noise Frequency (Legacy Chip)Figure 6-14 Temperature Error vs Power-Supply Noise Frequency (Legacy Chip)
TMP411-Q1 TMP411D-Q1 Quiescent Current vs Conversion Rate (Legacy Chip)Figure 6-16 Quiescent Current vs Conversion Rate (Legacy Chip)
TMP411-Q1 TMP411D-Q1 Shutdown Quiescent Current vs SCL Clock Frequency (Legacy Chip)Figure 6-18 Shutdown Quiescent Current vs SCL Clock Frequency (Legacy Chip)
TMP411-Q1 TMP411D-Q1 Shutdown Quiescent Current vs Supply Voltage (Legacy Chip)Figure 6-20 Shutdown Quiescent Current vs Supply Voltage (Legacy Chip)
TMP411-Q1 TMP411D-Q1 POR threshold and Brownout detect voltages vs Temperature (Comparison of Legacy Chip and New Chip)Figure 6-22 POR threshold and Brownout detect voltages vs Temperature (Comparison of Legacy Chip and New Chip).
TMP411-Q1 TMP411D-Q1 Local Temperature Error vs TMP411-Q1 Ambient Temperature (New Chip)Figure 6-3 Local Temperature Error vs TMP411-Q1 Ambient Temperature (New Chip)
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs TMP411-Q1 Ambient Temperature (New Chip)Figure 6-5 Remote Temperature Error vs TMP411-Q1 Ambient Temperature (New Chip)
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs Leakage Resistance (Comparison of Legacy Chip and New Chip)Figure 6-7 Remote Temperature Error vs Leakage Resistance (Comparison of Legacy Chip and New Chip)
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs Series Resistance (Diode-Connected Transistor, 2N3906 PNP) (New Chip)Figure 6-9 Remote Temperature Error vs Series Resistance (Diode-Connected Transistor, 2N3906 PNP) (New Chip)
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs Series Resistance (GND Collector-Connected Transistor, 2N3906 PNP) (New Chip)Figure 6-11 Remote Temperature Error vs Series Resistance (GND Collector-Connected Transistor, 2N3906 PNP) (New Chip)
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs Differential Capacitance (New Chip)Figure 6-13 Remote Temperature Error vs Differential Capacitance (New Chip)
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs Power-Supply Noise Frequency (Comparison of Legacy Chip and New Chip)Figure 6-15 Remote Temperature Error vs Power-Supply Noise Frequency (Comparison of Legacy Chip and New Chip)
TMP411-Q1 TMP411D-Q1 Quiescent Current vs Conversion Rate (New Chip)Figure 6-17 Quiescent Current vs Conversion Rate (New Chip)
TMP411-Q1 TMP411D-Q1 Shutdown Quiescent Current vs SCL Clock Frequency (New Chip)Figure 6-19 Shutdown Quiescent Current vs SCL Clock Frequency (New Chip)
TMP411-Q1 TMP411D-Q1 Shutdown Quiescent Current vs Supply Voltage (New Chip)Figure 6-21 Shutdown Quiescent Current vs Supply Voltage (New Chip)