SBOS527G December   2010  – September 2025 TMP411-Q1 , TMP411D-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (TMP411-Q1)
    6. 6.6  Electrical Characteristics (TMP411D-Q1)
    7. 6.7  Timing Characteristics
    8. 6.8  Timing Diagrams
    9. 6.9  Typical Characteristics (TMP411-Q1)
    10. 6.10 Typical Characteristics (TMP411D-Q1)
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Series Resistance Cancellation
      2. 7.3.2 Differential Input Capacitance
      3. 7.3.3 Temperature Measurement Data
      4. 7.3.4 THERM (PIN 4) and ALERT/ THERM2 (PIN 6)
      5. 7.3.5 Sensor Fault
      6. 7.3.6 Undervoltage Lockout (TMP411-Q1 Only)
      7. 7.3.7 Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 One-Shot Conversion
    5. 7.5 Programming
      1. 7.5.1  Serial Interface
      2. 7.5.2  Bus Overview
      3. 7.5.3  Timing Diagrams
      4. 7.5.4  Serial Bus Address
      5. 7.5.5  Read/Write Operations
      6. 7.5.6  Time-Out Function
      7. 7.5.7  High-Speed Mode
      8. 7.5.8  General-Call Reset
      9. 7.5.9  Software Reset
      10. 7.5.10 SMBUS Alert Function
  9. Register Map
    1. 8.1  Register Information
    2. 8.2  Pointer Register
    3. 8.3  Temperature Registers
    4. 8.4  Limit Registers
    5. 8.5  Status Register
    6. 8.6  Configuration Register
    7. 8.7  Resolution Register
    8. 8.8  Conversion Rate Register
    9. 8.9  N-factor Correction Register
    10. 8.10 Minimum and Maximum Registers
    11. 8.11 Consecutive Alert Register
    12. 8.12 THERM Hysteresis Register
    13. 8.13 Identification Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics (TMP411D-Q1)

At TA = 25°C and V+ = 3.3V (unless otherwise noted)

TMP411-Q1 TMP411D-Q1 Local Temperature Error vs TMP411D-Q1 Ambient TemperatureFigure 6-23 Local Temperature Error vs TMP411D-Q1 Ambient Temperature
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs Leakage ResistanceFigure 6-25 Remote Temperature Error vs Leakage Resistance
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs Series Resistance (GND Collector-Connected Transistor, 2N3906 PNP)Figure 6-27 Remote Temperature Error vs Series Resistance (GND Collector-Connected Transistor, 2N3906 PNP)
TMP411-Q1 TMP411D-Q1 Temperature Error vs Power-Supply Noise FrequencyFigure 6-29 Temperature Error vs Power-Supply Noise Frequency
TMP411-Q1 TMP411D-Q1 Shutdown Current vs SCL Clock FrequencyFigure 6-31 Shutdown Current vs SCL Clock Frequency
TMP411-Q1 TMP411D-Q1 Shutdown Current vs TemperatureFigure 6-33 Shutdown Current vs Temperature
TMP411-Q1 TMP411D-Q1 Conversion Time vs Temperature (Local and Local + Remote)Figure 6-35 Conversion Time vs Temperature (Local and Local + Remote)
TMP411-Q1 TMP411D-Q1 Remote Temperature Noise Data Distribution (300 Samples)Figure 6-37 Remote Temperature Noise Data Distribution (300 Samples)
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs TMP411D-Q1 Ambient TemperatureFigure 6-24 Remote Temperature Error vs TMP411D-Q1 Ambient Temperature
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs Series Resistance (Diode-Connected Transistor, 2N3906 PNP)Figure 6-26 Remote Temperature Error vs Series Resistance (Diode-Connected Transistor, 2N3906 PNP)
TMP411-Q1 TMP411D-Q1 Remote Temperature Error vs Differential CapacitanceFigure 6-28 Remote Temperature Error vs Differential Capacitance
TMP411-Q1 TMP411D-Q1 Average Current vs Conversion RateFigure 6-30 Average Current vs Conversion Rate
TMP411-Q1 TMP411D-Q1 Standby Current vs TemperatureFigure 6-32 Standby Current vs Temperature
TMP411-Q1 TMP411D-Q1 Active Current vs Temperature (Local and Remote)Figure 6-34 Active Current vs Temperature (Local and Remote)
TMP411-Q1 TMP411D-Q1 Shutdown, Standby, Active (Local) and Active (Remote) Currents vs Supply Voltage (Temperature at 25°C)Figure 6-36 Shutdown, Standby, Active (Local) and Active (Remote) Currents vs Supply Voltage (Temperature at 25°C)
TMP411-Q1 TMP411D-Q1 Temperature Response Time (Stirred Liquid, Soldered Device, and 2N3906 PNP Transistor on 62mil 2-Layer FR4 PCB)Figure 6-38 Temperature Response Time (Stirred Liquid, Soldered Device, and 2N3906 PNP Transistor on 62mil 2-Layer FR4 PCB)