SBOS527G December   2010  – September 2025 TMP411-Q1 , TMP411D-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (TMP411-Q1)
    6. 6.6  Electrical Characteristics (TMP411D-Q1)
    7. 6.7  Timing Characteristics
    8. 6.8  Timing Diagrams
    9. 6.9  Typical Characteristics (TMP411-Q1)
    10. 6.10 Typical Characteristics (TMP411D-Q1)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Series Resistance Cancellation
      2. 7.3.2 Differential Input Capacitance
      3. 7.3.3 Temperature Measurement Data
      4. 7.3.4 THERM (PIN 4) and ALERT/ THERM2 (PIN 6)
      5. 7.3.5 Sensor Fault
      6. 7.3.6 Undervoltage Lockout (TMP411-Q1 Only)
      7. 7.3.7 Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 One-Shot Conversion
    5. 7.5 Programming
      1. 7.5.1  Serial Interface
      2. 7.5.2  Bus Overview
      3. 7.5.3  Timing Diagrams
      4. 7.5.4  Serial Bus Address
      5. 7.5.5  Read/Write Operations
      6. 7.5.6  Time-Out Function
      7. 7.5.7  High-Speed Mode
      8. 7.5.8  General-Call Reset
      9. 7.5.9  Software Reset
      10. 7.5.10 SMBUS Alert Function
  9. 8 Register Map
    1. 8.1  Register Information
    2. 8.2  Pointer Register
    3. 8.3  Temperature Registers
    4. 8.4  Limit Registers
    5. 8.5  Status Register
    6. 8.6  Configuration Register
    7. 8.7  Resolution Register
    8. 8.8  Conversion Rate Register
    9. 8.9  N-factor Correction Register
    10. 8.10 Minimum and Maximum Registers
    11. 8.11 Consecutive Alert Register
    12. 8.12 THERM Hysteresis Register
    13. 8.13 Identification Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Device Comparison

Table 4-1 Device Comparison
FEATURE TMP411-Q1 TMP411D-Q1(2) (4) TMP421-Q1 TMP451-Q1(1)(4)
VDD (V) 2.7 to 5.5 1.62 to 5.5 2.7 to 5.5 1.7 to 3.6
Local Temperature Accuracy (°C)
–40°C (max) ±2.5(2) ±1 ±2.5(2) ±2
-25°C (max) ±2.5(2) ±0.8 ±2.5(2) ±2
-10°C (max) ±2.5(2) ±0.8 ±2.5(2) ±2
0°C (max) ±2.5(2) ±0.8 ±2.5(2) ±1
15°C (max) ±1(1) ±0.8 ±1.5(1) ±1
70°C (max) ±1(1) ±0.8 ±1.5(1) ±1
85°C (max) ±1(1) ±0.8 ±1.5(1) ±2
100°C (max) ±2.5(2) ±1 ±2.5(2) ±2
125°C (max) ±2.5(2) ±1 ±2.5(2) ±2
Remote Temperature Accuracy (°C)
–40°C (max) ±3(1)(3) ±1 ±3(1)(3) ±2
-25°C (max) ±3(1)(3) ±0.8 ±3(1)(3) ±2
-10°C (max) ±3(1)(3) ±0.8 ±3(1)(3) ±2
0°C (max) ±3(1)(3) ±0.8 ±3(1)(3) ±1
15°C (max) ±1(1)(3) ±0.8 ±1(1)(3) ±1
70°C (max) ±1(1)(3) ±0.8 ±1(1)(3) ±1
75°C (max) ±1(1)(3) ±0.8 ±1(1)(3) ±2
85°C (max) ±3(1)(3) ±0.8 ±1(1)(3) ±2
100°C (max) ±3(1)(3) ±1 ±3(1)(3) ±2
105°C (max) ±5(1)(3) ±1 ±5(2),(3) ±4
125°C (max) ±5(1)(3) ±1.25 ±5(2)(3) ±4
Digital Input/Output
Resolution (Bit)
(Local and Remote)		 L = 9 to 12
R = 12		 L = 9 to 12
R = 12		 L = 12
R = 12		 L = 12
R = 12
VIH/VIL 2.1 / 0.8 2.1 / 0.8 and
70% / 30% VDD		 2.1 / 0.8 1.4 / 0.45
Current Consumption and Conversion Time (Typ: VDD=3.3V and 25°C)
TConv (ms)
(per channel)		 115÷2 17.7 115 31÷2
IAVG at 0.0625Hz (μA) 28 1.5 32 27
ISB (μA) 7.5 1 — —
ISD (μA) 3 0.6 3 3
Features: RSeriesCancellation, N-Factor Correction, Diode Fault Detection
I2C Addresses 4 orderables 4 orderables 9 (A1/A0 pins) 3 orderables
Packaging Dimension
Dimensions
[mm × mm × mm] 		VSSOP (8-pin)
3 × 4.9 × 1.1		 SOT-23 (8-pin)
2.9 × 2.8 × 1.1		 SOT-23 (8-pin)
2.9 × 2.8 × 1.1		 WSON (8-pin)
2 × 2 × 0.8
WSON (WF) (8-pin)
2.5 × 2 × 0.8
(1) Temperature accuracy is specified over VDD= 3.3V.
(2) Temperature accuracy is specified over the whole power supply.
(3) Remote temperature accuracy is specified over TDIODE = –40°C to 150°C.
(4) Remote temperature accuracy is specified over TDIODE = –55°C to 150°C.
TMP411-Q1 TMP411D-Q1 TMP411-Q1 and TMP411D-Q1 Device Nomenclature Figure 4-1 TMP411-Q1 and TMP411D-Q1 Device Nomenclature
Table 4-2 TMP411-Q1 and TMP411D-Q1 Device Nomenclature Description
FIELD DESCRIPTION FIELD DETAIL
Sensor Family TMP: Temperature Sensors
Device Name 411 or 411D
I2C Address
  • TMP411A-Q1/ TMP411DA-Q1 - 4Ch/ 1001100'b - 85°C default local/remote high temperature limit
  • TMP411B-Q1/ TMP411DB-Q1 - 4Dh/ 1001101'b - 85°C default local/remote high temperature limit
  • TMP411C-Q1/ TMP411DC-Q1 - 4Eh/ 1001110'b - 85°C default local/remote high temperature limit
  • TMP411D-Q1/ TMP411DD-Q1 - 4Ch/ 1001100'b - 110°C default local/remote high temperature limit

Automotive qualified

Applies to only automotive-qualified devices
TI Package Designator TMP411-Q1:
  • DGK, VSSOP package, 1.1mm (max) height
TMP411D-Q1:
  • DDF, SOT23 package, 1.1mm (max) height
T and R Packing Size Large T and R, SPQ (TMP411-Q1) = 2,500 units and SPQ (TMP411D-Q1) = 3,000 units
Automotive grade-1 qualified AEC-Q100 Qualified for automotive applications
Table 4-3 TMP411-Q1 and TMP411D-Q1 devices Device Nomenclature Detail
PRODUCTOUT
TMP411xQyyyRQ1x indicates that the device has A, B, C, or D variant. These devices can ship with the legacy chip (CSO: DM5) or the new chip (CSO: RFB). The reel packaging label provides date code information to distinguish which chip is being used. Device performance for new and legacy chips is denoted throughout the document.
yyy indicates that the package type of the device is DGK (VSSOP 8-pin).
TMP411DxQyyyRQ1x indicates that the device has A, B, C, or D variant. TMP411D-Q1 has only CSO: RFB.
yyy indicates that the package type of the device is DDF (SOT23 8-pin).