SBOS527G December   2010  – September 2025 TMP411-Q1 , TMP411D-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (TMP411-Q1)
    6. 6.6  Electrical Characteristics (TMP411D-Q1)
    7. 6.7  Timing Characteristics
    8. 6.8  Timing Diagrams
    9. 6.9  Typical Characteristics (TMP411-Q1)
    10. 6.10 Typical Characteristics (TMP411D-Q1)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Series Resistance Cancellation
      2. 7.3.2 Differential Input Capacitance
      3. 7.3.3 Temperature Measurement Data
      4. 7.3.4 THERM (PIN 4) and ALERT/ THERM2 (PIN 6)
      5. 7.3.5 Sensor Fault
      6. 7.3.6 Undervoltage Lockout (TMP411-Q1 Only)
      7. 7.3.7 Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 One-Shot Conversion
    5. 7.5 Programming
      1. 7.5.1  Serial Interface
      2. 7.5.2  Bus Overview
      3. 7.5.3  Timing Diagrams
      4. 7.5.4  Serial Bus Address
      5. 7.5.5  Read/Write Operations
      6. 7.5.6  Time-Out Function
      7. 7.5.7  High-Speed Mode
      8. 7.5.8  General-Call Reset
      9. 7.5.9  Software Reset
      10. 7.5.10 SMBUS Alert Function
  9. 8 Register Map
    1. 8.1  Register Information
    2. 8.2  Pointer Register
    3. 8.3  Temperature Registers
    4. 8.4  Limit Registers
    5. 8.5  Status Register
    6. 8.6  Configuration Register
    7. 8.7  Resolution Register
    8. 8.8  Conversion Rate Register
    9. 8.9  N-factor Correction Register
    10. 8.10 Minimum and Maximum Registers
    11. 8.11 Consecutive Alert Register
    12. 8.12 THERM Hysteresis Register
    13. 8.13 Identification Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics (TMP411-Q1)

At TA = –40°C to +125°C and V+ = 2.7V to 5.5V, over operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
TEMPERATURE ERROR
TERROR(LOCAL) Local temperature sensor TA = 15°C to 85°C
V+ = 3.3V		–1±0.06251°C
TA = –40°C to 125°C–2.5±1.252.5
TERROR(REMOTE)Remote temperature sensor(1)TA = 15°C to 75°C
TDIODE = –40°C to 150°C
V+ = 3.3V		–1±0.06251°C
TA = –40°C to 100°C
TDIODE = –40°C to 150°C
V+ = 3.3V		–3±13
TA = –40°C to 125°C
TDIODE = –40°C to 150°C
V+ = 3.3V		–5±35
TERROR_PSTemperature error power supply sensitivity (local and remote)V+ = 2.7V to 5.5V
TDIODE = –40°C to 150°C		–0.5±0.20.5°C/V
TEMPERATURE MEASUREMENT
tCONVConversion time (Local + Remote)One-Shot modeLegacy chip105115125ms
New chip303540
TRESResolutionLocal temperature sensor (programmable)912Bits
Remote temperature sensor12
RSERIESRemote sensor source currentHighSeries resistance: 3kΩ maximum120µA
Medium high60
Medium lowLegacy chip only12
Low6
ηRemote transistor ideality factorOptimized ideality factor1.008
SMBus INTERFACE
VIHLogic input high voltage (SCL, SDA)2.1V
VILLogic input low voltage (SCL, SDA)0.8V
VHYSTHysteresis170mV
SMBus output low sink current6mA
ILI and ILOLogic input currentLegacy chip–11µA
New chip–0.20.2
CINSMBus input capacitance (SCL, SDA)3pF
SMBus clock frequency3.4MHz
SMBus timeout253035ms
SCL falling edge to SDA valid time1µs
DIGITAL OUTPUTS
VOLOutput low voltageIOUT = 6mALegacy chip0.150.4V
New chip0.30.4
IOHHigh-level output leakage currentVOUT = V+Legacy chip0.11µA
New chip0.050.2
ALERT or THERM2 output low sink currentALERT/THERM2 forced to 0.4V6mA
THERM output low sink currentTHERM forced to 0.4V6mA
POWER SUPPLY
V+Specific voltage range2.75.5V
IDD_AVGQuiescent current0.0625Hz conversion
V+ = 3.3V		Legacy chip2830µA
New chip1.58.2
8Hz conversion
V+ = 3.3V		Legacy chip400475
New chip4585
IDD_SDShutdown currentSerial bus inactiveLegacy chip310µA
New chip0.67
Serial bus active, fs = 400kHzLegacy chip90
New chip7
Serial bus active, fs = 3.4MHzLegacy chip350
New chip55
Undervoltage lockout(2)Legacy chip2.32.42.6V
This behavior is combined with Power-on-reset (POR). For more information, please see Section 7.3.6 and footnote(2)New chip
PORPower-on-reset thresholdLegacy chip1.62.3V
New chip1.231.4
Brownout detectNew chip11.14V
(1) Tested with less than 5Ω effective series resistance and 100pF differential input capacitance. TA is the ambient temperature of the TMP411-Q1. TDIODE is the temperature at the remote diode sensor.
(2) When there is no remote diode connected, the first remote conversion should be ignored with the power supply ramp rate less than 240V/s.