SPRAAR7J November   2018  – February 2023 66AK2G12 , AM1806 , AM1808 , AM2431 , AM2432 , AM2434 , AM3351 , AM3352 , AM3354 , AM3356 , AM3357 , AM3358 , AM3358-EP , AM3359 , AM3871 , AM3874 , AM3892 , AM3894 , AM4376 , AM4377 , AM4378 , AM4379 , AM5706 , AM5708 , AM5716 , AM5718 , AM5726 , AM5728 , AM5729 , AM5746 , AM5748 , AM5749 , AM620-Q1 , AM623 , AM625 , AM625-Q1 , AM625SIP , AM62A3 , AM62A3-Q1 , AM62A7 , AM62A7-Q1 , AM62P , AM62P-Q1 , AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442 , AM6526 , AM6528 , AM6546 , AM6548 , BQ24392-Q1 , HD3SS6126 , LP8727 , OMAP-L137 , OMAP5912 , TMS320C6745 , TMS320DM335 , TMS320DM355 , TMS320DM365 , TMS320DM368 , TMS320DM369 , TMS320DM6441 , TMS320DM6443 , TMS320DM6446 , TMS320DM6467 , TMS320DM8127 , TMS320DM8147 , TMS320DM8148 , TMS320DM8165 , TMS320DM8167 , TMS320DM8168 , TMS320VC5506 , TMS320VC5507 , TMS320VC5509A , TS3USB221A-Q1 , TS3USBA225 , TSU5611 , TSU6111 , TSU6111A , TSU6721 , TSU8111

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
    1. 1.1 Scope
    2. 1.2 Critical Signals
  4. 2General High-Speed Signal Routing
    1. 2.1 PCB Fiber Weave Mitigation
    2. 2.2 High-Speed Signal Trace Lengths
    3. 2.3 High-Speed Signal Trace Length Matching
    4. 2.4 High-Speed Signal Reference Planes
  5. 3High-Speed Differential Signal Routing
    1. 3.1  Differential Signal Spacing
    2. 3.2  High-Speed Differential Signal Rules
    3. 3.3  Symmetry in the Differential Pairs
    4. 3.4  Crosstalk Between the Differential Signal Pairs
    5. 3.5  Connectors and Receptacles
    6. 3.6  Via Discontinuity Mitigation
    7. 3.7  Back-Drill Stubs
    8. 3.8  Increase Via Anti-Pad Diameter
    9. 3.9  Equalize Via Count
    10. 3.10 Surface-Mount Device Pad Discontinuity Mitigation
    11. 3.11 Signal Bending
    12. 3.12 Suggested PCB Stackups
    13. 3.13 ESD/EMI Considerations
    14. 3.14 ESD/EMI Layout Rules
  6. 4References
  7.   A Device Layout Parameters
  8.   Revision History

3.14 ESD/EMI Layout Rules

  • Place ESD and EMI protection devices as close as possible to the connector.
  • Keep any unprotected traces away from protected traces to minimize EMI coupling.
  • Incorporate 60% voids under the ESD/EMI component signal pads to reduce losses.
  • Use 0402 0-Ω resistors for common-mode filter (CMF) no-stuff options because larger components will typically introduce more loss that the CMF itself.
  • Place any required signal pair AC coupling capacitors on the protected side of the CMF and as close as possible to the CMF.
  • If vias are needed to transition to the CMF layer, ensure that the vias are as close as possible to the CMF.
  • Keep the overall routing of AC coupling capacitors + CMF + ESD protection as short and as close as possible to the connector.