SPRADB7 September   2023 AM2431 , AM2432 , AM2434 , AM2631 , AM2631-Q1 , AM2632 , AM2632-Q1 , AM2634 , AM2634-Q1 , AM263P2-Q1 , AM263P4 , AM263P4-Q1 , AM2732 , AM2732-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 How to Use This Application Note
    2. 1.2 Glossary
  5. 2Thermal Resistance Overview
    1. 2.1 Junction Vs. Ambient Temperature
    2. 2.2 Package Defined Thermal Resistance Characteristics
    3. 2.3 Board Defined Thermal Resistances
  6. 3Board Design Choices that Affect Thermal Performance
    1. 3.1 Thermal Vias
    2. 3.2 Board Size
    3. 3.3 Air Flow, Heat Sinking, and Enclosures
    4. 3.4 Copper Thickness
    5. 3.5 Relative Position of Heat Emitters
    6. 3.6 Layer Count
    7. 3.7 Breaks in Thermal Pathing
  7. 4Thermal Design Best Practices Review
  8. 5AM263x EVM Thermal Comparison with Data
    1. 5.1 Test Setup and Materials
    2. 5.2 Measurement Logging Software
    3. 5.3 AM263x EVM Comparison
    4. 5.4 Measurement Results
      1. 5.4.1 Lid Temperature Readings
      2. 5.4.2 Power Readings over Temperature
      3. 5.4.3 Calculated Thermal Resistance Values
      4. 5.4.4 Recorded Junction and Ambient Temperatures
      5. 5.4.5 Calculated Junction Temperature at Ambient Temperature Extremes
  9. 6Using the Thermal Model
  10. 7References

1.2 Glossary

Table 1-1 Glossary and Acronym Definitions
Term Definition
Junction Temperature The temperature within a package near a hotspot on the die
Ambient Temperature The temperature of the surrounding free air of a system
Lid (Case) Temperature The temperature of the surrounding material of a package
RΘJA Thermal resistance between junction and ambient temperature
RΘJC Thermal resistance between junction and case (lid) temperature
RΘCA Thermal resistance between case (lid) and ambient temperature
RΘJB Thermal resistance between junction and board temperature
RΘBA Thermal resistance between board and ambient temperature
RΘVia Thermal resistance of a thermal via array
RΘCu Lateral Thermal resistance of a planar copper pour
RΘFR-4 Thermal resistance between junction and ambient temperature
RΘSA Thermal resistance between the surface area of a PCB and the ambient temperature
Thermocouple A junction between two conductors that produces a voltage depending on the material that can be mapped to specific temperature values
AEC-Q100 As defined by the Automotive Electronics Council, AEC-Q100 is a qualification given to a device that can sustain stress tests with guaranteed level of quality and reliability for a given temperature range.
Acronyms Used in This Document
SoC System on a chip
JEDEC Joint Electron Device Engineering Council
LP LaunchPad Development Kit
CC Control Card Development Kit
RTI Real time interrupt module that provides a timer functionality