SBASAX3A May   2025  – September 2025 ADS9326 , ADS9327

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Electrical Characteristics 
    6. 6.6  Electrical Characteristics: AVDD = 5V
    7. 6.7  Electrical Characteristics: AVDD = 3.3V
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Timing Diagrams
    11. 6.11 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
      2. 7.3.2 Reference
        1. 7.3.2.1 Internal Reference
          1. 7.3.2.1.1 Selectable Internal Reference with 5V AVDD
        2. 7.3.2.2 External Reference
        3. 7.3.2.3 External Reference With External Reference Buffer
      3. 7.3.3 ADC Transfer Function
      4. 7.3.4 Data Interface
      5. 7.3.5 Programmable Data Averaging Filter
        1. 7.3.5.1 Simple Average
          1. 7.3.5.1.1 Simple Average with Noncontinuous CONVST
        2. 7.3.5.2 Moving Average
      6. 7.3.6 CRC on Output Data Interface
      7. 7.3.7 ADC Output Data Randomizer
      8. 7.3.8 Data Frame Width
      9. 7.3.9 Daisy-Chain Mode
        1. 7.3.9.1 Daisy-Clock Mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset
      2. 7.4.2 Normal Operation
      3. 7.4.3 Low-Latency Mode
      4. 7.4.4 CS-CONVST Short Mode
      5. 7.4.5 Register Read Mode
      6. 7.4.6 Initialization Sequence
    5. 7.5 Programming
      1. 7.5.1 SPI Frame Length for Register Operations
      2. 7.5.2 Register Map Lock
      3. 7.5.3 Register Write
      4. 7.5.4 Register Read
  9. 8 Register Map: ADS9327
    1. 8.1 Register Bank 0
    2. 8.2 Register Bank 1
    3. 8.3 Register Bank 2
  10. 9 Register Map: ADS9326
    1. 9.1 Register Bank 0
    2. 9.2 Register Bank 1
    3. 9.3 Register Bank 2
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Analog 1VPP Sine-Cosine Encoder Interface
      2. 10.2.2 Design Requirements
      3. 10.2.3 Detailed Design Procedure
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical Data

6.3 Thermal Information

THERMAL METRIC(1) ADS93x7 UNIT
VAE (VQFN)
22 PINS
RθJA Junction-to-ambient thermal resistance 36.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 26.5 °C/W
RθJB Junction-to-board thermal resistance 7.9 °C/W
ΨJT Junction-to-top characterization parameter 0.8 °C/W
ΨJB Junction-to-board characterization parameter 7.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 11.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.