SCAS892D February   2010  – July 2025 CDCE937-Q1 , CDCEL937-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Control Terminal Setting
      2. 8.3.2 Default Device Setting
    4. 8.4 Device Functional Modes
      1. 8.4.1 SDA and SCL Serial Interface
    5. 8.5 Programming
      1. 8.5.1 Data Protocol
      2. 8.5.2 Command Code Definition
      3. 8.5.3 Generic Programming Sequence
      4. 8.5.4 Byte Write Programming Sequence
      5. 8.5.5 Byte Read Programming Sequence
      6. 8.5.6 Block Write Programming Sequence
      7. 8.5.7 Block Read Programming Sequence
      8. 8.5.8 Timing Diagram for the SDA and SCL Serial Control Interface
      9. 8.5.9 SDA and SCL Hardware Interface
  10. Register Maps
    1. 9.1 SDA and SCL Configuration Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Spread-Spectrum Clock (SSC)
        2. 10.2.2.2 PLL Frequency Planning
        3. 10.2.2.3 Crystal Oscillator Start-Up
        4. 10.2.2.4 Frequency Adjustment With Crystal Oscillator Pulling
        5. 10.2.2.5 Unused Inputs and Outputs
        6. 10.2.2.6 Switching Between XO and VCXO Mode
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Revision History

Changes from Revision C (December 2016) to Revision D (July 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added links to Applications Go
  • Changed the Data Protocol sectionGo
  • Changed all instances of PLL Multiplier/Divider Definition to PLL Frequency Planning Go
  • Changed the Power Supply Recommendations sectionGo

Changes from Revision B (May 2010) to Revision C (December 2016)

  • Changed Applications Go
  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Ordering Information table; see Package Option Addendum at the end of the data sheetGo

Changes from Revision A (March 2010) to Revision B (May 2010)

  • Changed the PACKAGE THERMAL RESISTANCE tableGo
  • Changed RID default in Generic Configuration Register table From: 0h To: XbGo
  • Added note to PWDN description in Generic Configuration Register tableGo
  • Changed SLAVE_ADR default value in Generic Configuration Register table From: 00b To: 01bGo