SCAS892D February   2010  – July 2025 CDCE937-Q1 , CDCEL937-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Control Terminal Setting
      2. 8.3.2 Default Device Setting
    4. 8.4 Device Functional Modes
      1. 8.4.1 SDA and SCL Serial Interface
    5. 8.5 Programming
      1. 8.5.1 Data Protocol
      2. 8.5.2 Command Code Definition
      3. 8.5.3 Generic Programming Sequence
      4. 8.5.4 Byte Write Programming Sequence
      5. 8.5.5 Byte Read Programming Sequence
      6. 8.5.6 Block Write Programming Sequence
      7. 8.5.7 Block Read Programming Sequence
      8. 8.5.8 Timing Diagram for the SDA and SCL Serial Control Interface
      9. 8.5.9 SDA and SCL Hardware Interface
  10. 9 Register Maps
    1. 9.1 SDA and SCL Configuration Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Spread-Spectrum Clock (SSC)
        2. 10.2.2.2 PLL Frequency Planning
        3. 10.2.2.3 Crystal Oscillator Start-Up
        4. 10.2.2.4 Frequency Adjustment With Crystal Oscillator Pulling
        5. 10.2.2.5 Unused Inputs and Outputs
        6. 10.2.2.6 Switching Between XO and VCXO Mode
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)(1)
THERMAL METRIC(2) CDCE937-Q1, CDCEL937-Q1 UNIT
PW (TSSOP)
20 PINS
RθJA Junction-to-ambient thermal resistance Airflow = 0 lfm 89 °C/W
Airflow = 150 lfm 75
Airflow = 200 lfm 74
Airflow = 250 lfm 74
Airflow = 500 lfm 69
RθJC(top) Junction-to-case (top) thermal resistance 31 °C/W
RθJB Junction-to-board thermal resistance 55 °C/W
ψJT Junction-to-top characterization parameter 0.8 °C/W
ψJB Junction-to-board characterization parameter 49 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
(2) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.