SDYU001AC June   2015  – November 2025 LSF0101 , LSF0102 , LSF0108 , SN74GTL2014 , SN74HC245 , SN74LS07 , SN74LV123A , SN74LV1T08 , SN74LV1T34 , SN74LV244AT , SN74LV245A , SN74LV4T125 , SN74LVC14A , SN74LVC1G08 , SN74LVC1G125 , SN74LVC245A , SN74LVTH125 , SN74LVTH16244A , SN74LVTH16245A , SN74LVTH245A

 

  1.   1
  2.   Trademarks
  3. 1Introduction
  4. 2Logic Overview
    1. 2.1 Logic Family Quick Reference
    2. 2.2 Comparison of Switching Standards
    3. 2.3 Automotive Logic
    4. 2.4 Ongoing Packaging Investment
    5. 2.5 TI's Programmable Logic Devices: TPLD
    6. 2.6 Function Table
  5. 3Logic Families
    1. 3.1  Legacy Logic
    2. 3.2  AC(T): Advanced CMOS
    3. 3.3  AHC(T): Advanced High-Speed CMOS
    4. 3.4  ALVC: Advanced Low-Voltage CMOS
    5. 3.5  AUC: Advanced Ultra Low Voltage CMOS
    6. 3.6  AUP: Advanced Ultra-Low Power
    7. 3.7  AVC: Advanced Very-Low-Voltage CMOS
    8. 3.8  HC(T): High-Speed CMOS
    9. 3.9  HCS: High-Speed CMOS with Schmitt-trigger inputs
    10. 3.10 LV-A(T): Low Voltage
    11. 3.11 LVxT: Low-Voltage CMOS Single Supply Translating Logic
    12. 3.12 LVC: Low-Voltage CMOS
    13. 3.13 LVT: Low-Voltage BiCMOS Technology
  6. 4Appendix A: Logic Packages
  7. 5Appendix B: Competitor Family Cross Reference
  8. 6Appendix C: Logic Part Number Naming Conventions
  9. 7Appendix D: Standard Logic Functions
  10. 8Revision History

2.3 Automotive Logic

The Automotive Engineering Council (AEC) established the AEC-Q100 qualification standard for automotive-rated products, with contributions from semiconductor manufacturers like Texas Instruments (TI). This standard establishes a high level of component performance in harsh automotive environments. TI’s automotive logic products, marked with a "Q1" in the part number, meet this stringent standard for reliability and performance in demanding automotive applications. Our portfolio offers a range of functions, providing designers with flexibility to maximize designs for specific applications and enable advanced automotive features. Products are available in various packages, including industry-standard and compact, small-form-factor options, allowing for efficient board layout and reduced footprint.

TI is dedicated to providing exceptional support to automotive customers. Industry-leading lead times and tightly controlled manufacturing processes support requirements for low defect rates. Rigorous design-flow checks promote long-term reliability, contributing to confidence in system performance and durability.

With a proven track record of supply continuity since 1964, and automotive-grade products since 1984, TI provides automotive customers with the assurance of a stable supply and reliable performance throughout the lifetime of vehicles.

Key Features Common AEC-Q100 Qualification Tests
  • AEC-Q100 Qualified Portfolio
  • Broad portfolio with over 200 automotive qualified products
  • Variety of package offerings to meet system needs from standard SOIC and TSSOP to the latest X2SON and X2QFN options
  • Our vast network of production sites provides best-in-class lead times to our customers
  • Excellent quality control checks are geared to achieve zero-DPPM requirements for automotive OEMs
  • TI's design-flow checks provide long-term reliability expectations
  • TI has a solid track record of supply continuity with products dating back to 1964 that are still available today
  • Test group A: Accelerated environment stress test
    • A2 - Biased HAST (JESD22-A101/JESD22-A110)
    • A3 - Unbiased HAST (JESD22-A102/JESD22-A118)
    • A4 - Temperature cycle and post temp cycle bond pull (JESD22-A104, MIL-STD883 method 2011)
    • A6 - High temp storage bake (JESD22-A103)
  • Test group B: Accelerated lifetime simulation test
    • B1 - High temperature operating life (JESD22-A108)
    • B2 - Early life failure rate (AEC Q100-008)
  • Test group C: Package assembly integrity tests
    • C1 - Wire bond shear (AEC Q100-001)
    • C2 - Wire bond pull (MIL-STD883 method 2011)
    • C3 - Solderability (JEDEC J-STD-002)
    • C4 - Physical Dimensions (JESD22-B100 and B108)
    • C5 - Solder ball shear (AEC Q100-010)
  • Test group D: Die fabrication reliability tests
    • D1 - Electromigration
    • D2 - Time dependent dielectric breakdown
    • D3 - Hot carrier injection
    • D4 - Bias temperature instability
    • D5 - Stress migration
  • Test group E: Electrical verification
    • E2 - Electrostatic discharge (ESD) human body model (HBM) (AEC Q100-002)
    • E3 - Electrostatic discharge (ESD) charged device model (CDM) (AEC Q100-011)
    • E4 - Latch-up (AEC Q100-004)
    • E5 - Electrical distributions (AEC Q100-009)
  • Visit Quality, reliability & packaging data download website for product specific details.