SLAU966 February   2025 MSPM0C1103 , MSPM0C1103-Q1 , MSPM0C1104 , MSPM0C1104-Q1 , MSPM0C1105 , MSPM0C1106 , MSPM0C1106-Q1 , MSPM0G1106 , MSPM0G1107 , MSPM0G1506 , MSPM0G1507 , MSPM0G1518 , MSPM0G1519 , MSPM0G3106 , MSPM0G3106-Q1 , MSPM0G3107 , MSPM0G3107-Q1 , MSPM0G3506 , MSPM0G3506-Q1 , MSPM0G3507 , MSPM0G3507-Q1 , MSPM0G3518 , MSPM0G3518-Q1 , MSPM0G3519 , MSPM0G3519-Q1 , MSPM0H3216 , MSPM0L1105 , MSPM0L1106 , MSPM0L1116 , MSPM0L1117 , MSPM0L1227 , MSPM0L1227-Q1 , MSPM0L1228 , MSPM0L1228-Q1 , MSPM0L1303 , MSPM0L1304 , MSPM0L1304-Q1 , MSPM0L1305 , MSPM0L1305-Q1 , MSPM0L1306 , MSPM0L1306-Q1 , MSPM0L1343 , MSPM0L1344 , MSPM0L1345 , MSPM0L1346 , MSPM0L2228

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1MSPM0 Portfolio Overview
    1. 1.1 Introduction
    2. 1.2 Portfolio Comparison of NXP M0 MCUs to MSPM0
  5. 2Ecosystem and Migration
    1. 2.1 Software Ecosystem Comparison
      1. 2.1.1 MSPM0 Software Development Kit (MSPM0 SDK)
      2. 2.1.2 MCUXpresso IDE vs Code Composer Studio IDE (CCS)
      3. 2.1.3 MCUXpresso Code Configuration Tool vs SysConfig
    2. 2.2 Hardware Ecosystem
    3. 2.3 Debug Tools
    4. 2.4 Migration Process
    5. 2.5 Migration and Porting Example
  6. 3Core Architecture Comparison
    1. 3.1 CPU
    2. 3.2 Embedded Memory Comparison
      1. 3.2.1 Flash Features
      2. 3.2.2 Flash Organization
        1. 3.2.2.1 Memory Banks
        2. 3.2.2.2 Flash Memory Regions
        3. 3.2.2.3 NONMAIN Memory
    3. 3.3 Power Up and Reset Summary and Comparison
    4. 3.4 Clocks Summary and Comparison
    5. 3.5 MSPM0 Operating Modes Summary and Comparison
      1. 3.5.1 Operating Modes Comparison
      2. 3.5.2 MSPM0 Capabilities in Lower Power Modes
      3. 3.5.3 Entering Lower-Power Modes
    6. 3.6 Interrupt and Events Comparison
      1. 3.6.1 Interrupts and Exceptions
      2. 3.6.2 Event Handler and Extended Interrupt and Event Controller (EXTI)
    7. 3.7 Debug and Programming Comparison
      1. 3.7.1 Bootstrap Loader (BSL) Programming Options
  7. 4Digital Peripheral Comparison
    1. 4.1 General-Purpose I/O (GPIO, IOMUX)
    2. 4.2 Universal Asynchronous Receiver-Transmitter (UART)
    3. 4.3 Serial Peripheral Interface (SPI)
    4. 4.4 I2C
    5. 4.5 Timers (TIMGx, TIMAx)
    6. 4.6 Windowed Watchdog Timer (WWDT)
    7. 4.7 Real-Time Clock (RTC)
  8. 5Analog Peripheral Comparison
    1. 5.1 Analog-to-Digital Converter (ADC)
    2. 5.2 Comparator (COMP)
    3. 5.3 Digital-to-Analog Converter (DAC)
    4. 5.4 Operational Amplifier (OPA)
    5. 5.5 Voltage References (VREF)
  9. 6References

Flash Memory Regions

The memory within each bank is mapped to one or more logical regions based upon the functions that the memory in each bank supports. There are four regions:

  • FACTORY – Device Id and other parameters
  • NONMAIN – Device boot configuration (BCR and BSL)
  • MAIN – Application code and data
  • DATA – Data or EEPROM emulation

Devices with one bank implement the FACTORY, NONMAIN, and MAIN regions on BANK0 (the only bank present), and the data region is not available. Devices with multiple banks also implement FACTORY, NONMAIN, and MAIN regions on BANK0, but include additional banks (BANK1 through BANK4) that can implement MAIN or DATA regions.