SLLSFZ8 November   2025 MCF8329HS-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings Auto
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Characteristics of the SDA and SCL bus for Standard and Fast mode
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Three Phase BLDC Gate Drivers
      2. 7.3.2  Gate Drive Architecture
        1. 7.3.2.1 Dead time and Cross Conduction Prevention
      3. 7.3.3  AVDD Linear Voltage Regulator
      4. 7.3.4  Low-Side Current Sense Amplifier
      5. 7.3.5  Device Interface Modes
        1. 7.3.5.1 Interface - Control and Monitoring
        2. 7.3.5.2 I2C Interface
      6. 7.3.6  Motor Control Input Options
        1. 7.3.6.1 Analog-Mode Motor Control
        2. 7.3.6.2 PWM-Mode Motor Control
        3. 7.3.6.3 Frequency-Mode Motor Control
        4. 7.3.6.4 I2C based Motor Control
        5. 7.3.6.5 Input Control Signal Profiles
          1. 7.3.6.5.1 Linear Control Profiles
          2. 7.3.6.5.2 Staircase Control Profiles
          3. 7.3.6.5.3 Forward-Reverse Profiles
          4. 7.3.6.5.4 Multi-Reference Mode Operation
          5. 7.3.6.5.5 Input Reference Transfer Function without Profiler
      7. 7.3.7  Bootstrap Capacitor Initial Charging
      8. 7.3.8  Starting the Motor Under Different Initial Conditions
        1. 7.3.8.1 Case 1 – Motor is Stationary
        2. 7.3.8.2 Case 2 – Motor is Spinning in the Forward Direction
        3. 7.3.8.3 Case 3 – Motor is Spinning in the Reverse Direction
      9. 7.3.9  Motor Start Sequence (MSS)
        1. 7.3.9.1 Initial Speed Detect (ISD)
        2. 7.3.9.2 Motor Resynchronization
        3. 7.3.9.3 Reverse Drive
          1. 7.3.9.3.1 Reverse Drive Tuning
        4. 7.3.9.4 Motor Start-up
          1. 7.3.9.4.1 Align
          2. 7.3.9.4.2 Double Align
          3. 7.3.9.4.3 Initial Position Detection (IPD)
            1. 7.3.9.4.3.1 IPD Operation
            2. 7.3.9.4.3.2 IPD Release
            3. 7.3.9.4.3.3 IPD Advance Angle
          4. 7.3.9.4.4 Slow First Cycle Startup
          5. 7.3.9.4.5 Open Loop
          6. 7.3.9.4.6 Transition from Open to Closed Loop
      10. 7.3.10 Closed Loop Operation
        1. 7.3.10.1 Closed loop accelerate
        2. 7.3.10.2 Speed PI Control
        3. 7.3.10.3 Current PI Control
        4. 7.3.10.4 Overmodulation
        5. 7.3.10.5 Power Loop
        6. 7.3.10.6 Modulation Index Control
        7. 7.3.10.7 Motor Speed Limit
        8. 7.3.10.8 Input DC Power Limit
      11. 7.3.11 Maximum Torque Per Ampere (MTPA) Control
      12. 7.3.12 Flux Weakening Control
      13. 7.3.13 Motor Parameters
        1. 7.3.13.1 Motor Resistance
        2. 7.3.13.2 Motor Inductance
        3. 7.3.13.3 Motor Back-EMF constant
      14. 7.3.14 Motor Parameter Extraction Tool (MPET)
      15. 7.3.15 Single Hall Sensor Operation
      16. 7.3.16 Anti-Voltage Surge (AVS)
      17. 7.3.17 Active Braking
      18. 7.3.18 Output PWM Switching Frequency
      19. 7.3.19 Dead Time Compensation
      20. 7.3.20 Voltage Sense Scaling
      21. 7.3.21 Motor Stop Options
        1. 7.3.21.1 Coast (Hi-Z) Mode
        2. 7.3.21.2 Recirculation Mode
        3. 7.3.21.3 Low-Side Braking
        4. 7.3.21.4 Active Spin-Down
      22. 7.3.22 FG Configuration
        1. 7.3.22.1 FG Output Frequency
        2. 7.3.22.2 FG in Open-Loop
        3. 7.3.22.3 FG During Motor Stop
        4. 7.3.22.4 FG Behavior During Fault
      23. 7.3.23 Protections
        1. 7.3.23.1  PVDD Supply Undervoltage Lockout (PVDD_UV)
        2. 7.3.23.2  AVDD Power on Reset (AVDD_POR)
        3. 7.3.23.3  GVDD Undervoltage Lockout (GVDD_UV)
        4. 7.3.23.4  BST Undervoltage Lockout (BST_UV)
        5. 7.3.23.5  MOSFET VDS Overcurrent Protection (VDS_OCP)
        6. 7.3.23.6  VSENSE Overcurrent Protection (SEN_OCP)
        7. 7.3.23.7  Thermal Shutdown (OTSD)
        8. 7.3.23.8  Hardware Lock Detection Current Limit (HW_LOCK_ILIMIT)
          1. 7.3.23.8.1 HW_LOCK_ILIMIT Latched Shutdown (HW_LOCK_ILIMIT_MODE = 00xb or 010b)
          2. 7.3.23.8.2 HW_LOCK_ILIMIT Automatic recovery (HW_LOCK_ILIMIT_MODE = 011b or 10xb)
          3. 7.3.23.8.3 HW_LOCK_ILIMIT Report Only (HW_LOCK_ILIMIT_MODE = 110b)
          4. 7.3.23.8.4 HW_LOCK_ILIMIT Disabled (HW_LOCK_ILIMIT_MODE = 111b)
        9. 7.3.23.9  Lock Detection Current Limit (LOCK_ILIMIT)
          1. 7.3.23.9.1 LOCK_ILIMIT Latched Shutdown (LOCK_ILIMIT_MODE = 00xb or 010b)
          2. 7.3.23.9.2 LOCK_ILIMIT Automatic Recovery (LOCK_ILIMIT_MODE = 011b or 10xb)
          3. 7.3.23.9.3 LOCK_ILIMIT Report Only (LOCK_ILIMIT_MODE = 110b)
          4. 7.3.23.9.4 LOCK_ILIMIT Disabled (LOCK_ILIMIT_MODE = 111b)
        10. 7.3.23.10 Motor Lock (MTR_LCK)
          1. 7.3.23.10.1 MTR_LCK Latched Shutdown (MTR_LCK_MODE = 00xb or 010b)
          2. 7.3.23.10.2 MTR_LCK Automatic Recovery (MTR_LCK_MODE = 011b or 10xb)
          3. 7.3.23.10.3 MTR_LCK Report Only (MTR_LCK_MODE = 110b)
          4. 7.3.23.10.4 MTR_LCK Disabled (MTR_LCK_MODE = 111b)
        11. 7.3.23.11 Motor Lock Detection
          1. 7.3.23.11.1 Lock 1: Abnormal Speed (ABN_SPEED)
          2. 7.3.23.11.2 Lock 2: Abnormal BEMF (ABN_BEMF)
          3. 7.3.23.11.3 Lock3: No-Motor Fault (NO_MTR)
        12. 7.3.23.12 MPET Faults
        13. 7.3.23.13 IPD Faults
        14. 7.3.23.14 Dry Run Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Functional Modes
        1. 7.4.1.1 Sleep Mode
        2. 7.4.1.2 Standby Mode
        3. 7.4.1.3 Fault Reset (CLR_FLT)
    5. 7.5 External Interface
      1. 7.5.1 DRVOFF - Gate Driver Shutdown Functionality
      2. 7.5.2 Oscillator Source
      3. 7.5.3 External Watchdog with MCU Reset
    6. 7.6 EEPROM access and I2C interface
      1. 7.6.1 EEPROM Access
        1. 7.6.1.1 EEPROM Write
        2. 7.6.1.2 EEPROM Read
        3. 7.6.1.3 EEPROM Security
      2. 7.6.2 I2C Serial Interface
        1. 7.6.2.1 I2C Data Word
        2. 7.6.2.2 I2C Write Operation
        3. 7.6.2.3 I2C Read Operation
        4. 7.6.2.4 Examples of I2C Communication Protocol Packets
        5. 7.6.2.5 Internal Buffers
        6. 7.6.2.6 CRC Byte Calculation
  9. 8 EEPROM (Non-Volatile) Register Map
    1. 8.1 Algorithm_Configuration Registers
    2. 8.2 Fault_Configuration Registers
    3. 8.3 Hardware_Configuration Registers
    4. 8.4 Internal_Algorithm_Configuration Registers
  10. 9 RAM (Volatile) Register Map
    1. 9.1 Fault_Status Registers
    2. 9.2 System_Status Registers
    3. 9.3 Algorithm_Control Registers
    4. 9.4 Device_Control Registers
    5. 9.5 Algorithm_Variables Registers
  11. 10Typical Applications
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1.      Detailed Design Procedure
      2.      Bootstrap Capacitor and GVDD Capacitor Selection
      3.      Gate Drive Current
      4.      Gate Resistor Selection
      5.      System Considerations in High Power Designs
      6.      Capacitor Voltage Ratings
      7.      External Power Stage Components
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Bulk Capacitance
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
      3. 10.4.3 Thermal Considerations
        1. 10.4.3.1 Power Dissipation
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

External Power Stage Components

External components in the power stage are not required by design but are helpful in suppressing transients, managing inductor coil energy, mitigating supply pumping, dampening phase ringing, or providing strong gate-to-source pulldown paths. These components are used for system tuning and debuggability so the BLDC motor system is robust while avoiding damage to the MCF8329HS-Q1 device or external MOSFETs.

MCF8329HS-Q1 Optional external power stage componentsFigure 10-9 Optional external power stage components

Some examples of issues and external components that can resolve those issues are found in table below.

Table 10-2 Common issues and resolutions for power stage debugging

Issue

Resolution

Components

Gate drive current required is too large, resulting in very fast MOSFET VDS slew rate

Series resistors required for gate drive current adjustability

0-100 Ω series resistors (RGATE/RSOURCE) at gate driver outputs (GHx/GLx), optional sink resistor (RSINK) and diode in parallel with gate resistor for adjustable sink current

Ringing at phase’s switch node (SHx) resulting in high EMI emissions

RC snubbers placed in parallel to each HS/LS MOSFET to dampen oscillations

Resistor (RSNUB) and Capacitor (CSNUB) placed parallel to the MOSFET, calculate RC values based on ringing frequency using Proper RC Snubber Design for Motor Drivers

Negative transients at low-side source (LSS) below minimum specification

HS drain to LS source capacitor to suppress negative bouncing

0.01uF-1uF, PVDD-rated capacitor from PVDD-LSS (CHSD_LSS) placed near LS MOSFET’s source

Negative transient at low-side gate (GLx) below minimum specification

Gate-to-ground Zener diode to clamp negative voltage

GVDD voltage rated Zener diode (DGS) with anode connected to GND and cathode connected to GLx

Extra protection required to ensure MOSFET is turned off if gate drive signals are Hi-Z

External gate-to-source pulldown resistors (after series gate resistors)

10 kΩ to 100 kΩ resistor (RPD) connected from gate to source for each MOSFET