SNOSDM1 December   2025 TLV6722

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Separate Power Supplies (H_VCC, M_VCC)
      2. 8.4.2 Low Supply Reset Deassertion
      3. 8.4.3 Power-On Reset (POR)
      4. 8.4.4 Inputs (INT/RSTn, LPWn/PRSn(/ePPS), M_INT)
      5. 8.4.5 Outputs (M_RSTn, M_LPWn, M_CLK)
      6. 8.4.6 Switching Thresholds and Hysteresis
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.4.1 Layout Guidelines

For accurate comparator applications, the TLV672x must be supply must be powered by a stable power supply with minimized noise and glitches. Bypass capacitors must be as close to the supply pins as possible and connected to a solid ground plane.

Tie the GND pin to the PCB ground plane at the pin of the device. It's recommended to do this with a via-in-pad structure in the GND pad.