SNOSDM1 December   2025 TLV6722

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Separate Power Supplies (H_VCC, M_VCC)
      2. 8.4.2 Low Supply Reset Deassertion
      3. 8.4.3 Power-On Reset (POR)
      4. 8.4.4 Inputs (INT/RSTn, LPWn/PRSn(/ePPS), M_INT)
      5. 8.4.5 Outputs (M_RSTn, M_LPWn, M_CLK)
      6. 8.4.6 Switching Thresholds and Hysteresis
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Description

The TLV672x are a family of devices that fully integrates the module-side INT/RSTn and LPWn/PRSn(/ePPS) circuits as defined by the OSFP and OSFP-XD MSAs. The TLV672x integrates all devices and passives for the INT/RSTn and LPWn/PRsn(/ePPS) circuits into a small-size 1.2mm x 1.2mm DSBGA-9 package. This makes the TLV672x well-suited for space-critical OSFP and OSFP-XD module designs.

The TLV672x contains integrated resistors and voltage reference that are factory-trimmed per the specifications of the OSFP and OSFP-XD MSAs, making sure that the host-to-module interface voltages and comparator switching thresholds are within the proper voltage zones.

The M_LPWn comparator within the TLV672x has a push-pull output that is capable of being powered by a separate voltage supply (M_VCC). This allows for level-shifting of host-to-module logic levels without the need of a discrete pull-up resistor. The M_RSTn comparator within the TLV672x has an open-drain output allowing for easy OR-ing of multiple reset signal drivers.

The TLV6723 and TLV6724 have an integrated clock buffer that can support an embedded pulse-per-second or reference clock signal up to 156.25MHz as defined on the OSFP-XD MSA. Whenever the M_LPWn signal is low (asserted true), the integrated clock buffer on the TLV6723 enters a self-shutdown mode, lowering the quiescent current and saving power.

Package Information
PART NUMBERPACKAGE(1)PACKAGE SIZE(2)

TLV6722, TLV6723, TLV6724

DSBGA (9)

1.2mm x 1.2mm

For all available packages, see Section 12.
The package size (length × width) is a nominal value and includes pins, where applicable.
Device Information
PART NUMBER(1)Clock Buffer
TLV6722NO CLOCK BUFFER
TLV6723 (Preview)SELF-SHUTDOWN
TLV6724 (Preview)ALWAYS-ON
See the Device Comparison table.
TLV6722 TLV6723 TLV6724 TLV6722 Internal Block Diagram TLV6722 Internal Block Diagram