SNVSCO1 November   2025 LM5126A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Device Configuration (CFG0-pin, CFG1-pin, CFG2-pin )
      2. 6.3.2  Device Enable/Disable (UVLO/EN)
      3. 6.3.3  Dual Device Operation
      4. 6.3.4  Switching Frequency and Synchronization (SYNCIN)
      5. 6.3.5  Dual Random Spread Spectrum (DRSS)
      6. 6.3.6  Operation Modes (BYPASS, DEM, FPWM)
      7. 6.3.7  VCC Regulator, BIAS (BIAS-pin, VCC-pin)
      8. 6.3.8  Soft Start (SS-pin)
      9. 6.3.9  VOUT Programming (VOUT, ATRK, DTRK)
      10. 6.3.10 Protections
        1. 6.3.10.1 VOUT Overvoltage Protection (OVP)
        2. 6.3.10.2 Thermal Shutdown (TSD)
      11. 6.3.11 Power-Good Indicator (PGOOD-pin)
      12. 6.3.12 Slope Compensation (CSP, CSN)
      13. 6.3.13 Current Sense Setting and Switch Peak Current Limit (CSP, CSN)
      14. 6.3.14 Input Current Limit and Monitoring (ILIM, IMON, DLY)
      15. 6.3.15 Maximum Duty Cycle and Minimum Controllable On-time Limits
      16. 6.3.16 Signal Deglitch Overview
      17. 6.3.17 MOSFET Drivers, Integrated Boot Diode, and Hiccup Mode Fault Protection (LO, HO, HB-pin)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown State
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Feedback Compensation
      2. 7.1.2 3 Phase Operation
      3. 7.1.3 Non-synchronous Application
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1  Determine the Total Phase Number
        2. 7.2.2.2  Determining the Duty Cycle
        3. 7.2.2.3  Timing Resistor RT
        4. 7.2.2.4  Inductor Selection Lm
        5. 7.2.2.5  Current Sense Resistor Rcs
        6. 7.2.2.6  Current Sense Filter RCSFP, RCSFN, CCS
        7. 7.2.2.7  Low-Side Power Switch QL
        8. 7.2.2.8  High-Side Power Switch QH
        9. 7.2.2.9  Snubber Components
        10. 7.2.2.10 Vout Programming
        11. 7.2.2.11 Input Current Limit (ILIM/IMON)
        12. 7.2.2.12 UVLO Divider
        13. 7.2.2.13 Soft Start
        14. 7.2.2.14 CFG Settings
        15. 7.2.2.15 Output Capacitor Cout
        16. 7.2.2.16 Input Capacitor Cin
        17. 7.2.2.17 Bootstrap Capacitor
        18. 7.2.2.18 VCC Capacitor CVCC
        19. 7.2.2.19 BIAS Capacitor
        20. 7.2.2.20 VOUT Capacitor
        21. 7.2.2.21 Loop Compensation
      3. 7.2.3 Application Curves
        1. 7.2.3.1 Efficiency
        2. 7.2.3.2 Steady State Waveforms
        3. 7.2.3.3 Step Load Response
        4. 7.2.3.4 AC Loop Response Curve
        5. 7.2.3.5 Thermal Performance
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

6.3.4 Switching Frequency and Synchronization (SYNCIN)

The switching frequency of 100kHz to 2.2MHz is set by the RT resistor connected between the RT-pin and AGND. The RT resistor is selected between 14kΩ and 316kΩ according to Equation 4. If configured to use an external clock the device uses the RT-pin to set the internal oscillator and synchronizes the switching frequency within ±50% to an external clock applied at the SYNCIN-pin. The external clock must be within the SYNCIN frequency activity detection range fSYNC_DET and fSYNC_DET_min to be detected. The internal clock is synchronized at the rising edge of the external clock signal applied at the SYNCIN-pin. The CFG1-pin Spread Spectrum setting is ignored when external clock synchronization is selected and clock dithering is disabled.

The device always starts with the internal clock and starts synchronizing to an applied external clock during the START and the ACTIVE state (see Functional State Diagram). The device synchronizes to the external clock as soon as the clock is applied and switches back to the internal clock in case the external clock stops.

Equation 3. f S W =   1 R R T × s 31.5   G Ω + 18 n s
Equation 4. R R T = 1 f S W - 18 n s × 31.5 G Ω s
LM5126A-Q1 Clock Synchronization Figure 6-6 Clock Synchronization