SNVSCO1 November   2025 LM5126A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Device Configuration (CFG0-pin, CFG1-pin, CFG2-pin )
      2. 6.3.2  Device Enable/Disable (UVLO/EN)
      3. 6.3.3  Dual Device Operation
      4. 6.3.4  Switching Frequency and Synchronization (SYNCIN)
      5. 6.3.5  Dual Random Spread Spectrum (DRSS)
      6. 6.3.6  Operation Modes (BYPASS, DEM, FPWM)
      7. 6.3.7  VCC Regulator, BIAS (BIAS-pin, VCC-pin)
      8. 6.3.8  Soft Start (SS-pin)
      9. 6.3.9  VOUT Programming (VOUT, ATRK, DTRK)
      10. 6.3.10 Protections
        1. 6.3.10.1 VOUT Overvoltage Protection (OVP)
        2. 6.3.10.2 Thermal Shutdown (TSD)
      11. 6.3.11 Power-Good Indicator (PGOOD-pin)
      12. 6.3.12 Slope Compensation (CSP, CSN)
      13. 6.3.13 Current Sense Setting and Switch Peak Current Limit (CSP, CSN)
      14. 6.3.14 Input Current Limit and Monitoring (ILIM, IMON, DLY)
      15. 6.3.15 Maximum Duty Cycle and Minimum Controllable On-time Limits
      16. 6.3.16 Signal Deglitch Overview
      17. 6.3.17 MOSFET Drivers, Integrated Boot Diode, and Hiccup Mode Fault Protection (LO, HO, HB-pin)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown State
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Feedback Compensation
      2. 7.1.2 3 Phase Operation
      3. 7.1.3 Non-synchronous Application
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1  Determine the Total Phase Number
        2. 7.2.2.2  Determining the Duty Cycle
        3. 7.2.2.3  Timing Resistor RT
        4. 7.2.2.4  Inductor Selection Lm
        5. 7.2.2.5  Current Sense Resistor Rcs
        6. 7.2.2.6  Current Sense Filter RCSFP, RCSFN, CCS
        7. 7.2.2.7  Low-Side Power Switch QL
        8. 7.2.2.8  High-Side Power Switch QH
        9. 7.2.2.9  Snubber Components
        10. 7.2.2.10 Vout Programming
        11. 7.2.2.11 Input Current Limit (ILIM/IMON)
        12. 7.2.2.12 UVLO Divider
        13. 7.2.2.13 Soft Start
        14. 7.2.2.14 CFG Settings
        15. 7.2.2.15 Output Capacitor Cout
        16. 7.2.2.16 Input Capacitor Cin
        17. 7.2.2.17 Bootstrap Capacitor
        18. 7.2.2.18 VCC Capacitor CVCC
        19. 7.2.2.19 BIAS Capacitor
        20. 7.2.2.20 VOUT Capacitor
        21. 7.2.2.21 Loop Compensation
      3. 7.2.3 Application Curves
        1. 7.2.3.1 Efficiency
        2. 7.2.3.2 Steady State Waveforms
        3. 7.2.3.3 Step Load Response
        4. 7.2.3.4 AC Loop Response Curve
        5. 7.2.3.5 Thermal Performance
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

6.3.10 Protections

The device has the following protections implemented. Figure 6-15 shows in which state of the Functional State Diagram which protection is active. The protection is active for the grey shaded states having the same grey shading, for example TSD is active in STANDBY state including THERMAL SHUTDOWN state but not in FAULT state.

  • Thermal shutdown (TSD) turning off the device at high temperature.
  • Undervoltage Lockout (UVLO) turning off the device at low supply voltage.
  • VCC Undervoltage Lockout (VCC UVLO) avoiding too low low-side gate driver voltage. The device stops switching until VCC is recovered.
  • HB Undervoltage Lockout (HB UVLO) avoiding too low high-side gate driver voltage. The device initiates refresh pulses (512 cycles hiccup mode off time). See MOSFET Drivers, Integrated Boot Diode, and Hiccup Mode Fault Protection (LO, HO, HB-pin) for details.
  • Overvoltage Protection (OVP), when triggered the device stops switching until VOUT is back on target. There are two OVPs implemented:
    • OVPmax, which is a programmable absolute value (typically 64V, 50V, 35V, or 28.5V). When triggered the device stops switching and enters FAULT state.
    • OVP, which triggers when VOUT is 110% of the programmed value. When triggered the device stops switching until VOUT is back on target.
  • Undervoltage Protection (UVP), when triggered the device continues operation but pulls the PGOOD-pin low.
  • Peak Current Limit (PCL), limiting the switch current. See Current Sense Setting and Switch Peak Current Limit (CSP, CSN) for details.
  • Input Current Limit (ICL), limiting the peak switch current to 120% of the peak current limit. This protection is enabled and disabled by ICL_latch programming.
  • Average Input Current Limit (ILIM), limiting the average input current to the programmed value by RILIM. See Input Current Limit and Monitoring (ILIM, IMON, DLY) for details.
LM5126A-Q1 Protections Figure 6-15 Protections