SNVSCP5A April   2025  – August 2025 TPS7H3024-SP

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Quality Conformance Inspection
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Voltage (IN), VLDO and REFCAP
        1. 8.3.1.1 Undervoltage Lockout (VPOR_IN < VIN < UVLO)
        2. 8.3.1.2 Power-On Reset (VIN < VPOR_IN )
      2. 8.3.2 SR_UVLO
      3. 8.3.3 SENSEx Inputs
        1. 8.3.3.1 VTH_SENSEX and VOUTx_RISE
        2. 8.3.3.2 IHYS_SENSEx and VOUTx_FALL
        3. 8.3.3.3 Input to Output Time Diagrams
        4. 8.3.3.4 Top and Bottom Resistive Divider Design Equations
      4. 8.3.4 MODE
      5. 8.3.5 Output Stages (RESETx, PWRGD, WDO, PULL_UP1 and PULL_UP2)
        1. 8.3.5.1 Push-Pull Outputs
      6. 8.3.6 WDI
      7. 8.3.7 User-Programmable TIMERS
        1. 8.3.7.1 DLY_TMR
        2. 8.3.7.2 WD_TMR
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Window Voltage Monitoring
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Input Power Supplies and Decoupling Capacitors
          2. 9.2.1.2.2 SR_UVLO Threshold
          3. 9.2.1.2.3 SENSEx Thresholds
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS7H3024-SP UNIT
HFT (CFP)
22 pins
RθJA Junction-to-ambient thermal resistance 34.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.7 °C/W
RθJB Junction-to-board thermal resistance 17.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 16.9 °C/W
ΨJT Junction-to-top characterization parameter 8.6 °C/W
ΨJB Junction-to-board characterization parameter 17 °C/W
(1) For more information about the traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics
application report (SPRA953).