SNVSCS7D April   2025  – November 2025 TPSM33606-Q1 , TPSM33610-Q1 , TPSM33620-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range
      2. 7.3.2  Output Voltage Selection
        1. 7.3.2.1 Adjustable Output Voltage Variants
        2. 7.3.2.2 Fixed Output Voltage Variants
      3. 7.3.3  Enable, Start-Up, and Shutdown
        1. 7.3.3.1 External UVLO through the EN Pin
      4. 7.3.4  External CLK SYNC
        1. 7.3.4.1 Pulse-Dependent MODE/SYNC Pin Control
      5. 7.3.5  Power-Good Output Operation
      6. 7.3.6  Internal LDO, VCC and VOUT/FB Input
      7. 7.3.7  Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
      8. 7.3.8  Spread Spectrum
      9. 7.3.9  Soft Start and Recovery from Dropout
        1. 7.3.9.1 Recovery from Dropout
      10. 7.3.10 Overcurrent Protection (Hiccup Mode)
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 CCM Mode
        2. 7.4.3.2 Auto Mode – Light-Load Operation
          1. 7.4.3.2.1 Diode Emulation
          2. 7.4.3.2.2 Frequency Reduction
        3. 7.4.3.3 FPWM Mode – Light-Load Operation
        4. 7.4.3.4 Minimum On-Time (High Input Voltage) Operation
        5. 7.4.3.5 Dropout
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Setting the Output Voltage
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 VCC
        6. 8.2.2.6 CFF Selection
        7. 8.2.2.7 Power-Good Signal
        8. 8.2.2.8 Maximum Ambient Temperature
        9. 8.2.2.9 Other Connections
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
      3. 9.1.3 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.3 Best Design Practices

  • Do not exceed the Absolute Maximum Ratings.
  • Do not exceed the Recommended Operating Conditions.
  • Do not exceed the ESD Ratings.
  • Do not allow the EN input to float.
  • Do not allow the output voltage to exceed the input voltage, nor go below ground.
  • Follow all the guidelines and suggestions found in this data sheet before committing the design to production. TI application engineers are ready to help critique design and PCB layout to help make projects a success.