SWRA601N April 2019 – November 2025 CC1350 , CC1352P , CC1352P7 , CC1352R , CC2340R2 , CC2340R5 , CC2340R5-Q1 , CC2540 , CC2540T , CC2541 , CC2541-Q1 , CC2640 , CC2640R2F , CC2640R2F-Q1 , CC2642R , CC2642R-Q1 , CC2650 , CC2650MODA , CC2652P , CC2652R , CC2652R7 , CC2652RB , CC2652RSIP , CC2674P10 , CC2674R10 , CC2744R7-Q1 , CC2745P10-Q1 , CC2745R10-Q1 , CC2745R7-Q1 , CC2755R10
For the CC13xx and CC26xx wireless MCUs, pre-qualified, tested, Component QDIDs or DNs are used. This means that there are QDIDs or DNs available for the complete SW stack, excluding only the RF-PHY part and selected adopted services and profiles. Available Qualified RF-PHY component QDIDs or DNs provided by TI can be referenced. BQC assesses if additional testing is required.
The process for Bluetooth Mesh qualification is the same as the one for the other Bluetooth specifications. Texas Instruments provides qualified profiles for Bluetooth Mesh [25]. To identify the QDL and associated QDID or DN to use for the project, see the Table 2-3.
For some devices, TI provides End Product Listing QDIDs/DNs. These QDIDs or DNs allow users to adopt the RF-PHY test results as well as host and controller test results. The BQC assesses the appropriate level of retest necessary.