SWRA834 May   2025 CC2340R5 , CC2340R5-Q1 , CC2744R7-Q1 , CC2745P10-Q1 , CC2745R10-Q1 , CC2745R7-Q1 , CC2755R10

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
  5. 2 Reference Designs
    1. 2.1 LP-EM-CC2340R53
    2. 2.2 LP-EM-CC2340R5
    3. 2.3 LP-EM-CC2340R5-Q1
    4. 2.4 LP-EM-CC2340R5-RGE-4x4-IS24
    5. 2.5 LP-EM-CC2745R10-Q1
  6. 3 Schematic
    1. 3.1 Schematic Overview
      1. 3.1.1 48MHz Crystal
      2. 3.1.2 32.768kHz Crystal
      3. 3.1.3 Filter
      4. 3.1.4 Decoupling Capacitors
      5. 3.1.5 Antenna Components
      6. 3.1.6 RF Shield
    2. 3.2 I/O Pins Drive Strength
    3. 3.3 Bootloader Pins
    4. 3.4 Serial Wire Debug (SWD) Pins
  7. 4 PCB Layout
    1. 4.1 Board Stack-Up
    2. 4.2 LC Filter
    3. 4.3 Decoupling Capacitors
    4. 4.4 Placement of Crystal Load Capacitors
    5. 4.5 Current Return Path
    6. 4.6 DC/DC Regulator
    7. 4.7 Antenna Matching Components
    8. 4.8 Transmission Lines
    9. 4.9 Electromagnetic Simulation
  8. 5 Antenna
  9. 6 Crystal Tuning
    1. 6.1 CC23xx and CC27xx Crystal Oscillators
    2. 6.2 Crystal Selection
    3. 6.3 Tuning the LF Crystal Oscillator
    4. 6.4 Tuning the HF Crystal Oscillator
  10. 7 Optimum Load Impedance
  11. 8 PA Table
  12. 9 Power Supply Configuration
    1. 9.1 Introduction to Power Supply
    2. 9.2 DC/DC Converter Mode
    3. 9.3 Global LDO Mode
  13. 10Board Bring-Up
    1. 10.1 Power On
    2. 10.2 RF Test: SmartRF Studio
    3. 10.3 RF Test: Conducted Measurements
      1. 10.3.1 Sensitivity
      2. 10.3.2 Output Power
    4. 10.4 Hardware Troubleshooting
      1. 10.4.1 No Link: RF Settings
      2. 10.4.2 No Link: Frequency Offset
      3. 10.4.3 Poor Link: Antenna
      4. 10.4.4 Bluetooth Low Energy: Device Does Advertising But Cannot Connect
      5. 10.4.5 Poor Sensitivity: Background Noise
      6. 10.4.6 High Sleep Power Consumption
  14. 11Summary
  15. 12References

4.9 Electromagnetic Simulation

If the design does not follow the reference design (for example, different filter component placement or component size), then TI recommends to use Advanced Design System (ADS) or similar to simulate and compare the impedances and S-parameters of the custom design with the reference design. Changes to the filter component values can be required if the custom design deviates too much from the reference design.