SWRA834 May   2025 CC2340R5 , CC2340R5-Q1 , CC2744R7-Q1 , CC2745P10-Q1 , CC2745R10-Q1 , CC2745R7-Q1 , CC2755R10

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
  5. 2 Reference Designs
    1. 2.1 LP-EM-CC2340R53
    2. 2.2 LP-EM-CC2340R5
    3. 2.3 LP-EM-CC2340R5-Q1
    4. 2.4 LP-EM-CC2340R5-RGE-4x4-IS24
    5. 2.5 LP-EM-CC2745R10-Q1
  6. 3 Schematic
    1. 3.1 Schematic Overview
      1. 3.1.1 48MHz Crystal
      2. 3.1.2 32.768kHz Crystal
      3. 3.1.3 Filter
      4. 3.1.4 Decoupling Capacitors
      5. 3.1.5 Antenna Components
      6. 3.1.6 RF Shield
    2. 3.2 I/O Pins Drive Strength
    3. 3.3 Bootloader Pins
    4. 3.4 Serial Wire Debug (SWD) Pins
  7. 4 PCB Layout
    1. 4.1 Board Stack-Up
    2. 4.2 LC Filter
    3. 4.3 Decoupling Capacitors
    4. 4.4 Placement of Crystal Load Capacitors
    5. 4.5 Current Return Path
    6. 4.6 DC/DC Regulator
    7. 4.7 Antenna Matching Components
    8. 4.8 Transmission Lines
    9. 4.9 Electromagnetic Simulation
  8. 5 Antenna
  9. 6 Crystal Tuning
    1. 6.1 CC23xx and CC27xx Crystal Oscillators
    2. 6.2 Crystal Selection
    3. 6.3 Tuning the LF Crystal Oscillator
    4. 6.4 Tuning the HF Crystal Oscillator
  10. 7 Optimum Load Impedance
  11. 8 PA Table
  12. 9 Power Supply Configuration
    1. 9.1 Introduction to Power Supply
    2. 9.2 DC/DC Converter Mode
    3. 9.3 Global LDO Mode
  13. 10Board Bring-Up
    1. 10.1 Power On
    2. 10.2 RF Test: SmartRF Studio
    3. 10.3 RF Test: Conducted Measurements
      1. 10.3.1 Sensitivity
      2. 10.3.2 Output Power
    4. 10.4 Hardware Troubleshooting
      1. 10.4.1 No Link: RF Settings
      2. 10.4.2 No Link: Frequency Offset
      3. 10.4.3 Poor Link: Antenna
      4. 10.4.4 Bluetooth Low Energy: Device Does Advertising But Cannot Connect
      5. 10.4.5 Poor Sensitivity: Background Noise
      6. 10.4.6 High Sleep Power Consumption
  14. 11Summary
  15. 12References

1 Introduction

Designing high-performance wireless product with CC23xx and CC27xx device families careful hardware configuration and PCB layout. To optimize the performance of these systems, users must follow well-established design practices for RF performance, power efficiency, and regulatory compliance.

This application note provides comprehensive guidelines for hardware configuration and PCB design tailored to the CC23xx and CC27xx devices. This document addresses critical aspects such as RF front-end, crystal oscillator configuration, tuning, and layout. The recommendations are based on TI's extensive validation and reference designs; helping users accelerate time to market while minimizing design risks.