TIDUF63 December   2023

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 PV or Battery Input With DC/DC Converter
    2. 1.2 Isolation and CLLLC Converter
    3. 1.3 DC/AC Converter
    4. 1.4 Key System Specifications
  8. 2System Design Theory
    1. 2.1 Boost Converter Design
    2. 2.2 MPPT Operation
    3. 2.3 CLLLC Converter Design
      1. 2.3.1 Achieving Zero Voltage Switching (ZVS)
      2. 2.3.2 Resonant Tank Design
    4. 2.4 DC/AC Converter Design
  9. 3System Overview
    1. 3.1 Block Diagram
    2. 3.2 Design Considerations
      1. 3.2.1 DC/DC Converter
        1. 3.2.1.1 Input Current and Voltage Senses and MPPT
        2. 3.2.1.2 Inrush Current Limit
      2. 3.2.2 CLLLC Converter
        1. 3.2.2.1 Low-Voltage Side
        2. 3.2.2.2 High-Voltage Side
      3. 3.2.3 DC/AC Converter
        1. 3.2.3.1 Active Components Selection
          1. 3.2.3.1.1 High-Frequency FETs: GaN FETs
          2. 3.2.3.1.2 Isolated Power Supply
          3. 3.2.3.1.3 Low-Frequency FETs
        2. 3.2.3.2 Passive Components Selection
          1. 3.2.3.2.1 Boost Inductor Selection
          2. 3.2.3.2.2 Cx Capacitance Selection
          3. 3.2.3.2.3 EMI Filter Design
          4. 3.2.3.2.4 DC-Link Output Capacitance
        3. 3.2.3.3 Voltage and Current Measurements
    3. 3.3 Highlighted Products
      1. 3.3.1  TMDSCNCD280039C - TMS320F280039C Evaluation Module C2000™ MCU controlCARD™
      2. 3.3.2  LMG3522R050 - 650-V 50-mΩ GaN FET With Integrated Driver
      3. 3.3.3  LMG2100R044 - 100-V, 35-A GaN Half-Bridge Power Stage
      4. 3.3.4  TMCS1123 - Precision Hall-Effect Current Sensor
      5. 3.3.5  AMC1302 - Precision, ±50-mV Input, Reinforced Isolated Amplifier
      6. 3.3.6  AMC3330 - Precision, ±1-V Input, Reinforced Isolated Amplifier With Integrated DC/DC Converter
      7. 3.3.7  AMC1311 - High-Impedance, 2-V Input, Reinforced Isolated Amplifier
      8. 3.3.8  ISO6741 - General-Purpose Reinforced Quad-Channel Digital Isolators with Robust EMC
      9. 3.3.9  UCC21540 - Reinforced Isolation Dual-Channel Gate Driver
      10. 3.3.10 LM5164 - 100-V Input, 1-A Synchronous Buck DC/DC Converter with Ultra-low IQ
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
    2. 4.2 Test Setup
      1. 4.2.1 DC/DC Board
      2. 4.2.2 DC/AC Board
    3. 4.3 Test Results
      1. 4.3.1 Input DC/DC Boost Results
      2. 4.3.2 CLLLC Results
      3. 4.3.3 DC/AC Results
  11. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
    2. 5.2 Tools and Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
  12. 6About the Author

Key System Specifications

Table 1-1 shows key specifications of the reference design.

Table 1-1 Key System Specifications
PARAMETER SPECIFICATION COMMENT
Input DC voltage range

30 V to 60 V

Maximum input DC current 10 A Limited by input inductor saturation current
DC/DC

Boost converter switching frequency

250 kHz

Number of input channels

4

CLLLC switching frequency

500 kHz

Nominal output voltage

400 V

Output voltage is not regulated without the DC/AC board. Use with the DC/AC board or clamp output voltage with DC load.

Maximum output current

4 A

Nominal Output AC voltage

230 VAC

LMG3522R030 required for 120-VAC operation

Output AC current

7 A

DC/AC stage switching frequency

125 kHz

GUID-E6E50D60-2200-40DA-9902-3DC3155245EF-low.gif
CAUTION:

Do not leave the design powered when unattended.

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WARNING:

High voltage! Accessible high voltages are present on the board. Electric shock is possible. The board operates at voltages and currents that can cause shock, fire, or injury if not properly handled. Use the equipment with necessary caution and appropriate safeguards to avoid injuring yourself or damaging property. For safety, use of isolated test equipment with overvoltage and overcurrent protection is highly recommended.

TI considers it the user's responsibility to confirm that the voltages and isolation requirements are identified and understood before energizing the board or simulation. When energized, do not touch the design or components connected to the design.

GUID-D9BEBC20-188D-4CBD-A202-356FDC060593-low.gif
WARNING:

Hot surface! Contact can cause burns. Do not touch!

Some components can reach high temperatures > 55°C when the board is powered on. Do not touch the board at any point during operation or immediately after operating, as high temperatures can be present.

GUID-E6E50D60-2200-40DA-9902-3DC3155245EF-low.gif
WARNING:

TI intends this reference design to be operated in a lab environment only and does not consider the design as a finished product for general consumer use. The design is intended to be run at ambient room temperature and is not tested for operation under other ambient temperatures.

TI intends this reference design to be used only by qualified engineers and technicians familiar with risks associated with handling high-voltage electrical and mechanical components, systems, and subsystems.

There are accessible high voltages present on the board. The board operates at voltages and currents that can cause shock, fire, or injury if not properly handled or applied. Use the equipment with necessary caution and appropriate safeguards to avoid injuring yourself or damaging property.