Packaging information
| Package | Pins HTSSOP (PWP) | 20 |
| Operating temperature range (°C) -40 to 125 |
| Package qty | Carrier 2,000 | LARGE T&R |
Features for the OPA561
- 1.2‑A output current
- 12-V PP output voltage
- Wide power range
- Single supply: 7 V to 15 V
- Dual supply: ±3.5 V to ±7.5 V
- Fully protected
- Thermal shutdown
- Adjustable current limit
- Output disable control
- 17-MHz gain-bandwidth product
- 50-V/µs slew rate
- 1‑MHz full-power bandwidth
- Thermally enhanced HTSSOP-20 PowerPAD™ integrated circuit package
- Temperature range: 0°C to 125°C
Description for the OPA561
The OPA561 is a low-cost, high-current operational amplifier capable of driving up to 1.2-A pulses into reactive loads. This monolithic integrated circuit provides high reliability in demanding line-carrier communications, laser diode drivers, and motor-control applications. The high slew rate provides 1 MHz of full-power bandwidth and excellent linearity.
For design flexibility, the OPA561 operates from either a single supply in the range of 7 V to 15 V or dual power supplies of ±3.5 V to ±7.5 V. In single-supply operation, the input common-mode range extends below ground. At maximum output current, a wide output swing provides a 12 V PP capability with a nominal 15‑V supply.
The OPA561 is internally protected against overtemperature conditions and current overloads. In addition, the OPA561 is designed to provide an accurate, user-selected, current limit. The current limit can be adjusted from 0.2 A to 1.2 A with a low-power resistor or potentiometer, or DAC (digital-to-analog converter). The high-speed characteristics of the current control loop provide accuracy, even under pulsed-load conditions.
The enable and status (E/S) pin performs two functions: the pin can be monitored to determine if the device is in thermal shutdown (active low), and can also be forced low to disable the output, thus disconnecting the load.
The OPA561 is available in a miniature HTSSOP-20 PowerPAD integrated circuit package. This surface-mount package is thermally enhanced and has a very low thermal resistance. Operation is specified over the industrial temperature range of 0°C to 125°C.