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SN74AUP1G80

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Low-Power Single Postitive-Edge-Triggered D-Type Flip-Flop

Data sheet
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Low-Power Single Postitive-Edge-Triggered D-Type Flip-Flop

SN74AUP1G80

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Data sheet Order now

Product details

Parameters

Channels (#) 1 Technology Family AUP VCC (Min) (V) 0.8 VCC (Max) (V) 3.6 Input type Standard CMOS Output type Push-Pull Clock Frequency (Max) (MHz) 260 IOL (Max) (mA) 4 IOH (Max) (mA) -4 ICC (Max) (uA) 0.9 Features Balanced outputs, Very high speed (tpd 5-10ns), Over-voltage tolerant inputs, Partial power down (Ioff) open-in-new Find other D-type flip-flop

Package | Pins | Size

DSBGA (YFP) 6 1 mm² .8 x 1.2 DSBGA (YZP) 5 2 mm² .928 x 1.428 SOT-23 (DBV) 5 5 mm² 2.9 x 1.6 SOT-SC70 (DCK) 5 4 mm² 2 x 2.1 USON (DRY) 6 1 mm² 1.5 x 1 X2SON (DPW) 5 1 mm² .8 x .8 X2SON (DSF) 6 1 mm² 1 x 1 open-in-new Find other D-type flip-flop

Features

  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4.3 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Schmitt-Trigger Action Allows Slow Input Transition and Better Switching Noise Immunity at the Input
    (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.4 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications

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Description

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see AUP – The Lowest-Power Family). This product also maintains excellent signal integrity (see Excellent Signal Integrity).

This is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 9
Type Title Date
* Datasheet SN74AUP1G80 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop datasheet (Rev. F) Jul. 20, 2017
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Application note Designing and Manufacturing with TI's X2SON Packages Aug. 23, 2017
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Technical articles A race against the clock: how to determine the power-up states of clocked devices Mar. 06, 2015
Application note Power-Up Behavior of Clocked Devices (Rev. A) Feb. 06, 2015
Application note Understanding Schmitt Triggers Sep. 21, 2011
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
10
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices
View details

Design tools & simulation

SIMULATION MODEL Download
SCEM444B.ZIP (64 KB) - IBIS Model

Reference designs

REFERENCE DESIGNS Download
Multi-Rail Power Reference Design for Eliminating EMI Effects in High Performance DAQ Systems
TIDA-01054 — The TIDA-01054 reference design helps eliminate the performance degrading effects of EMI on Data Acquisition (DAQ) systems greater than 16 bits with the help of the LM53635 buck converter. The buck converter enables the designer to place power solutions close to the signal path without the unwanted (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
ADC Voltage Reference Buffer Optimization Reference Design for High Performance DAQ Systems
TIDA-01055 — The TIDA-01055 reference design for high performance DAQ Systems optimizes the ADC reference buffer to improve SNR performance and reduce power consumption with the TI OPA837 high-speed op amp. This device is used in a composite buffer configuration and provides a 22% power improvement over (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Reference Design Maximizing Signal Dynamic Range for True 10 Vpp Differential Input to 20 bit ADC
TIDA-01057 — This reference design is designed for high performance data acquisition(DAQ) systems to improve the dynamic range of 20 bit differential input ADCs. Many DAQ systems require the measurement capability at a wide FSR (Full Scale Range) in order to obtain sufficient signal dynamic range. Many earlier (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
20-bit 1MSPS DAQ Reference Design Optimizing Power Supply Efficiency While Minimizing EMI
TIDA-01056 — This reference design for high performance data acquisition (DAQ) systems optimizes power stage in order to reduce power consumption and minimize the effect of EMI from switching regulator by using LMS3635-Q1 buck converter.  This reference designs yields 7.2% efficiency improvement at most (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Reference Design Optimizing FPGA Utilization and Data Throughput for Automatic Test Equipment
TIDA-01051 — The TIDA-01051 reference design is used to demonstrate optimized channel density, integration, power consumption, clock distribution and signal chain performance of very high channel count data acquisition (DAQ) systems such as those used in automatic test equipment (ATE). Using serializers, such as (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Optimized Analog Front End DAQ System Reference Design for 18 bit SAR Data Converters
TIDA-01050 — The TIDA-01050 reference design aims to improve the integration, power consumption, performance, and clocking issues typically associated with automatic test equipment. This design is applicable to any ATE system but most applicable to systems requiring a large number of input channels.
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
ADC Driver Reference Design Improving Full Scale THD Using Negative Supply
TIDA-01052 — The TIDA-01052 reference design aims to highlight system performance increases seen using a negative voltage rail on the analog front end driver amplifiers rather than ground. This concept is relative to all analog front ends, however this design is aimed specifically at automatic test equipment.
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
DSBGA (YFP) 6 View options
DSBGA (YZP) 5 View options
SC70 (DCK) 5 View options
SON (DRY) 6 View options
SON (DSF) 6 View options
SOT-23 (DBV) 5 View options
X2SON (DPW) 5 View options

Ordering & quality

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