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SN74AUP1G80

ACTIVE

Low-Power Single Postitive-Edge-Triggered D-Type Flip-Flop

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Data sheet

SN74AUP1G80

ACTIVE
Data sheet Order now

Product details

Number of channels 1 Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 260 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (µA) 0.9 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 1 Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 260 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (µA) 0.9 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
DSBGA (YFP) 6 1.4000000000000001 mm² 1 x 1.4000000000000001 SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8 SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1 USON (DRY) 6 1.45 mm² 1.45 x 1 X2SON (DPW) 5 0.64 mm² 0.8 x 0.8 X2SON (DSF) 6 1 mm² 1 x 1
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4.3 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Schmitt-Trigger Action Allows Slow Input Transition and Better Switching Noise Immunity at the Input
    (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.4 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4.3 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Schmitt-Trigger Action Allows Slow Input Transition and Better Switching Noise Immunity at the Input
    (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.4 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see AUP – The Lowest-Power Family). This product also maintains excellent signal integrity (see Excellent Signal Integrity).

This is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see AUP – The Lowest-Power Family). This product also maintains excellent signal integrity (see Excellent Signal Integrity).

This is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
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SN74LVC1G80 ACTIVE Single Positive-Edge-Triggered D-Type Flip-Flop Voltage range 1.65V to 5.5V, average propagation delay 5.5ns, average drive strength 24mA

Technical documentation

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Top documentation Type Title Format options Date
* Data sheet SN74AUP1G80 Low-Power Single Positive-Edge-Triggered D-Type Flip-Flop datasheet (Rev. F) PDF | HTML 20 Jul 2017
Selection guide Logic Guide (Rev. AC) PDF | HTML 13 Nov 2025
Application brief Understanding Schmitt Triggers (Rev. B) PDF | HTML 17 Apr 2025
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 Dec 2022
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Application note Designing and Manufacturing with TI's X2SON Packages 23 Aug 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic evaluation module for 5-pin to 8-pin DCK, DCT, DCU, DRL and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
User guide: PDF
Not available on TI.com
Evaluation board

5-8-NL-LOGIC-EVM — Generic logic and translation EVM supporting 5 to 8 pin DPW, DQE, DRY, DSF, DTM, DTQ and DTT pkgs

Generic EVM designed to support any logic or translation device that has a DTT, DRY, DPW, DTM, DQE, DQM, DSF, or DTQ package. Board design allows for flexible evaluation.

User guide: PDF | HTML
Not available on TI.com
Simulation model

SN74AUP1G80 IBIS Model (Rev. B)

SCEM444B.ZIP (64 KB) - IBIS Model
Download
Reference designs

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Design guide: PDF
Schematic: PDF
Reference designs

TIDA-01054 — Multi-Rail Power Reference Design for Eliminating EMI Effects in High Performance DAQ Systems

The TIDA-01054 reference design helps eliminate the performance degrading effects of EMI on Data Acquisition (DAQ) systems greater than 16 bits with the help of the LM53635 buck converter. The buck converter enables the designer to place power solutions close to the signal path without the (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-01055 — ADC Voltage Reference Buffer Optimization Reference Design for High Performance DAQ Systems

The TIDA-01055 reference design for high performance DAQ Systems optimizes the ADC reference buffer to improve SNR performance and reduce power consumption with the TI OPA837 high-speed op amp. This device is used in a composite buffer configuration and provides a 22% power improvement over (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-01057 — Reference Design Maximizing Signal Dynamic Range for True 10 Vpp Differential Input to 20 bit ADC

This reference design is designed for high performance data acquisition(DAQ) systems to improve the dynamic range of 20 bit differential input ADCs. Many DAQ systems require the measurement capability at a wide FSR (Full Scale Range) in order to obtain sufficient signal dynamic range. Many earlier (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-01051 — Reference Design Optimizing FPGA Utilization and Data Throughput for Automatic Test Equipment

The TIDA-01051 reference design is used to demonstrate optimized channel density, integration, power consumption, clock distribution and signal chain performance of very high channel count data acquisition (DAQ) systems such as those used in automatic test equipment (ATE). Using serializers, such (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-01050 — Optimized Analog Front End DAQ System Reference Design for 18 bit SAR Data Converters

The TIDA-01050 reference design aims to improve the integration, power consumption, performance, and clocking issues typically associated with automatic test equipment. This design is applicable to any ATE system but most applicable to systems requiring a large number of input channels.
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-01052 — ADC Driver Reference Design Improving Full Scale THD Using Negative Supply

The TIDA-01052 reference design aims to highlight system performance increases seen using a negative voltage rail on the analog front end driver amplifiers rather than ground. This concept is relative to all analog front ends, however this design is aimed specifically at automatic test equipment.
Design guide: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
DSBGA (YFP) 6 Ultra Librarian
SOT-23 (DBV) 5 Ultra Librarian
SOT-SC70 (DCK) 5 Ultra Librarian
USON (DRY) 6 Ultra Librarian
X2SON (DPW) 5 Ultra Librarian
X2SON (DSF) 6 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

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