SN74LV4053A

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5-V, 2:1 (SPDT), 3-channel analog switch

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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 3 Ron (Typ) (Ohms) 23 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 50 Operating temperature range (C) -40 to 85 Input/output continuous current (Max) (mA) 25 Rating Catalog CON (Typ) (pF) 5.6 open-in-new Find other Analog switches/muxes

Package | Pins | Size

PDIP (N) 16 181 mm² 19.3 x 9.4 SOIC (D) 16 59 mm² 9.9 x 6 SOP (NS) 16 80 mm² 10.2 x 7.8 SSOP (DB) 16 48 mm² 6.2 x 7.8 TSSOP (PW) 16 22 mm² 5 x 4.4 TSSOP (PW) 16 22 mm² 4.4 x 5 TVSOP (DGV) 16 23 mm² 3.6 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5 open-in-new Find other Analog switches/muxes

Features

  • 2-V to 5.5-V VCC Operation
  • Support Mixed-Mode Voltage Operation on All Ports
  • High On-Off Output-Voltage Ratio
  • Low Crosstalk Between Switches
  • Individual Switch Controls
  • Extremely Low Input Current
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

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Description

These triple 2-channel CMOS analog multiplexers/demultiplexers are designed for 2-V to 5.5-V VCC operation.

The ’LV4053A devices handle both analog and digital signals. Each channel permits signals with amplitudes up to 5.5 V (peak) to be transmitted in either direction.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

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Technical documentation

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No results found. Please clear your search and try again. View all 6
Type Title Date
* Datasheet SN54LV4053A, SN74LV4053A datasheet (Rev. K) Apr. 05, 2005
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Technical articles Is charge injection causing output voltage errors in your industrial control system? Oct. 18, 2018
Technical articles Achieving highly accurate full-scale charge and discharge current control for high-cell Li-ion battery-formation testing Aug. 13, 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
$30.00
Description

To get started developing:
Step 1: Buy the C2000 MCU F280049C Launchpad
Step 2: See the “Get Started” section below
LAUNCHXL-F280049C is a low cost evaluation and development tool for the F28004x series (including InstaSPIN-FOC capability) in the TI MCU LaunchPad ecosystem which is compatible with (...)

Features

Hardware Features

  • TMS320F280049C: 100 MHz C28x CPU with FPU and TMU, 256 KB Flash, InstaSPIN-FOC enabled, 3x 12-bit ADC, CAN, encoder, FSI, UART, and more
  • On-board XDS110 debug probe for real-time debug and flash programming
  • 80 pin LaunchPad leveraging the BoosterPack ecosystem
  • Power domain isolation (...)
INTERFACE ADAPTERS Download
document-generic User guide
$10.00
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTERS Download
document-generic User guide
$10.00
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODELS Download
SCLM115.ZIP (10 KB) - IBIS Model

Reference designs

REFERENCE DESIGNS Download
6A, 0.05% Current Accuracy Power Solution for Battery Test Systems Reference Design
PMP15043 — This reference design circuit introduces a highly accurate, bi-directional current power solution used in battery test systems (BTS). The maximum current capability is 6A with lower than 0.05% full scale accuracy. Controlling through a logic pin, the circuit can be used to charge or discharge a (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
50A, 0.05% Current Accuracy Power Reference Design for Battery Test Systems
PMP15038 — This reference design introduces a large current, highly accurate and bi-directional power solution used in battery test systems (BTS). It includes a LM5170EVM-BIDIR and a signal control board. The LM5170EVM-BIDIR is an evaluation board  to showcase the high performance of the dual-channel (...)
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
PDIP (N) 16 View options
SO (NS) 16 View options
SOIC (D) 16 View options
SSOP (DB) 16 View options
TSSOP (PW) 16 View options
TVSOP (DGV) 16 View options
VQFN (RGY) 16 View options

Ordering & quality

Support & training

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