350-mW, mono, Class-AB audio amplifier
Product details
Parameters
Package | Pins | Size
Features
- Fully Specified for 3.3-V and 5-V Operation
- Wide Power Supply Compatibility 2.5 V - 5.5 V
- Output Power for RL = 8
- 350 mW at VDD = 5 V, BTL
- 250 mW at VDD = 3.3 V, BTL
- Ultra-Low Quiescent Current in Shutdown Mode...0.15 µA
- Thermal and Short-Circuit Protection
- Surface-Mount Packaging
- SOIC
- PowerPAD™ MSOP
PowerPAD is a trademark of Texas Instruments Incorporated.
Description
The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TPA301: 350-mW Mono Audio Power Amplifier datasheet (Rev. E) | Jun. 24, 2004 |
Application note | PowerPAD™ Thermally Enhanced Package (Rev. H) | Jul. 06, 2018 | |
User guide | TPA301EVM - User Guide (Rev. A) | Apr. 17, 2001 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
A low-voltage bridge-tied load (BTL) audio power amplifier capable of delivering 350-mW to the load. It is characterized at 3.3-V and 5-V, but will operate from 2-V to 5.5-V. To minimize power consumption, this device features a shutdown mode, holding IDD <0.15 µA. Package: 8-pin SOIC.
Features
- 350-mW mono speaker drive
- Ultra-Low supply and shutdown current
- 8-pin SOIC package (IC is available in MSOP PowerPAD package)
Description
When plugged into a LaunchPad™ Development Kit, the BOOSTXL-AUDIO Audio BoosterPack™ Plug-in Module can capture audio input from a microphone and output audio through an on-board speaker. Headphone input and output is also supported. This audio input/output stream lets developers (...)
Features
- High quality audio playback with onboard 14-bit DAC (can be bypassed if target MCU has an integrated DAC)
- Automatic switching from onboard speakers and microphone to a headset with microphone
- Onboard microphone supports sampling rates of up to 20kHz
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Reference designs
Design files
-
download Voice Band Audio Playback Using a PWM DAC Gerber Files.zip (297KB) -
download Voice Band Audio Playback Using a PWM DAC CAD Files.zip (468KB) -
download Voice Band Audio Playback Using a PWM DAC PCB Layout.zip (354KB) -
download Voice Band Audio Playback Using a PWM DAC Bill of Materials (BOM).pdf (215KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
HVSSOP (DGN) | 8 | View options |
SOIC (D) | 8 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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