TPA301

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350-mW, mono, Class-AB audio amplifier

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Product details

Parameters

Audio input type Analog Input Architecture Class-AB Speaker channels (Max) Mono Power stage supply (Max) (V) 5.5 Power stage supply (Min) (V) 2.5 Load (Min) (ohms) 8 Output power (W) 0.35 THD + N @ 1 kHz (%) 1 Iq (Typ) (mA) 0.7 Control interface Hardware Closed/open loop Closed Analog supply (Min) (V) 2.5 Analog supply (Max) (V) 5.5 PSRR (dB) 85 Operating temperature range (C) -40 to 85 open-in-new Find other Speaker amps

Package | Pins | Size

HVSSOP (DGN) 8 9 mm² 3 x 3 SOIC (D) 8 19 mm² 3.91 x 4.9 open-in-new Find other Speaker amps

Features

  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 3.3 V, BTL
  • Ultra-Low Quiescent Current in Shutdown Mode...0.15 µA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.

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Description

The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

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Technical documentation

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Type Title Date
* Data sheet TPA301: 350-mW Mono Audio Power Amplifier datasheet (Rev. E) Jun. 24, 2004
Application note PowerPAD™ Thermally Enhanced Package (Rev. H) Jul. 06, 2018
User guide TPA301EVM - User Guide (Rev. A) Apr. 17, 2001

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
49
Description

A low-voltage bridge-tied load (BTL) audio power amplifier capable of delivering 350-mW to the load. It is characterized at 3.3-V and 5-V, but will operate from 2-V to 5.5-V. To minimize power consumption, this device features a shutdown mode, holding IDD <0.15 µA. Package: 8-pin SOIC.

Features
  • 350-mW mono speaker drive
  • Ultra-Low supply and shutdown current
  • 8-pin SOIC package (IC is available in MSOP PowerPAD™ package)
DAUGHTER CARD Download
document-generic User guide
Description

When plugged into a LaunchPad™ Development Kit, the BOOSTXL-AUDIO Audio BoosterPack™ Plug-in Module can capture audio input from a microphone and output audio through an on-board speaker. Headphone input and output is also supported. This audio input/output stream lets developers (...)

Features
  • High quality audio playback with onboard 14-bit DAC (can be bypassed if target MCU has an integrated DAC)
  • Automatic switching from onboard speakers and microphone to a headset with microphone
  • Onboard microphone supports sampling rates of up to 20kHz

Design tools & simulation

SIMULATION MODEL Download
SLOM361.ZIP (21 KB) - PSpice Model
SIMULATION TOOL Download
PSpice® for TI design and simulation tool
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Features
  • Leverages Cadence PSpice Technology
  • Preinstalled library with a suite of digital models to enable worst-case timing analysis
  • Dynamic updates ensure you have access to most current device models
  • Optimized for simulation speed without loss of accuracy
  • Supports simultaneous analysis of multiple products
  • (...)

Reference designs

REFERENCE DESIGNS Download
Voice Band Audio Playback Using a PWM DAC
TIDM-VOICEBANDAUDIO Low cost audio output based upon timer generating PWM & external low-pass filter with amplifier stages for either headphone or speaker. Audio data is stored in an on-board SPI Flash. A PC GUI with launchpad passthrough code is provided to load SPI Flash with audio data.
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
HVSSOP (DGN) 8 View options
SOIC (D) 8 View options

Ordering & quality

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  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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