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CC2564C

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Bluetooth®-Dual-Mode-Transceiver qualifiziert nach Bluetooth Core 5.1

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CC2564C

AKTIV
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Produktdetails

CPU Proprietary Type Transceiver Technology 2.4 GHz, Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 Operating system FreeRTOS, Linux Features Advanced audio distribution profile, Classic audio, Hands-free profile Edge AI enabled No Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 85
CPU Proprietary Type Transceiver Technology 2.4 GHz, Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 Operating system FreeRTOS, Linux Features Advanced audio distribution profile, Classic audio, Hands-free profile Edge AI enabled No Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 85
VQFNP-MR (RVM) 76 64 mm² 8 x 8
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 
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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet CC2564C Dual-Mode Bluetooth® Controller datasheet (Rev. B) 02 Dez 2020
Application note QFN and SON PCB Attachment (Rev. C) PDF | HTML 06 Dez 2023
User guide CC256x TI Bluetooth Stack SPPLEDemo App PDF | HTML 08 Aug 2023
User guide CC256x TI’s Bluetooth Stack Basic HFGAGDemo APP PDF | HTML 08 Aug 2023
User guide TI Bluetooth Stack HIDDemo App PDF | HTML 04 Aug 2023
Selection guide CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 13 Mai 2022
Selection guide Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. B) 07 Mär 2022
User guide CC2564C TI Dual-mode Bluetooth Stack on MSP432 MCUs (Rev. B) PDF | HTML 20 Dez 2021
More literature Dual-Mode Bluetooth® CC256xCQFNEM Evaluation Board (Rev. C) PDF | HTML 20 Dez 2021
User guide CC2564C TI Dual-mode Bluetooth Stack on STM32F4 MCUs (Rev. B) PDF | HTML 02 Dez 2021
User guide CC2564B to CC2564C Migration Guide (Rev. B) PDF | HTML 01 Dez 2021
Application brief TI Bluetooth CC2564C Solution (Rev. B) PDF | HTML 01 Dez 2021
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 15 Jan 2021
User guide CC2564x Demo Applications User's Guide PDF | HTML 17 Dez 2020
Cybersecurity advisory Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 17 Jul 2020
Cybersecurity advisory Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 18 Mai 2020
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18 Mai 2020
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 07 Jan 2019
White paper Which TI Bluetooth® solution should I choose? 05 Mai 2017
White paper White Paper: Why Classic Bluetooth® (BR/EDR)? 04 Mai 2017
Technical article Introducing TI’s dual-mode Bluetooth® 4.2 CC2564C solution PDF | HTML 13 Dez 2016
Application note Application Notes for CC2564C Bluetooth® 4.1 and 4.2 01 Nov 2016

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

CC256XCQFN-EM — CC2564C Dual-Mode Bluetooth®-Controller – Evaluierungsmodul

Der Bluetooth®-Baustein TI CC256xC ist eine Host-Controller-Schnittstellenlösung (HCI) für Basisrate (BR), verbesserte Datenrate (EDR) und Low Energy (LE), die den Designaufwand reduziert und eine schnelle Markteinführung ermöglicht. Das Modul auf Grundlage des Kerns der siebten TI-Generation ist (...)

Benutzerhandbuch: PDF | HTML
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Evaluierungsplatine

PIDEU-3P-PAN13X6C — Panasonic Industry PAN13x6C Bluetooth-Funkfrequenz (RF)-Module

Panasonic™ PAN1326C2 / PAN1316C Series ist ein Host Controlled Interface (HCI) Bluetooth® Radio Frequency (RF)-Modul, das den integrierten Schaltkreis CC2564C, Texas Instruments der siebten Generation für Bluetooth-Kerne, in ein benutzerfreundliches Modulformat bringt. Der PAN1326C2/PAN1316C ist (...)

Von: Panasonic Industrial Devices Europe GmbH
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Tochterkarte

BDE-3P-BD2564CX — Drahtlose BDE BD2564Cx-Module

BDE-3P-BD2564Cx-Module sind Bluetooth 5.1 Basic Rate (BR)-, Enhanced Data Rate (EDR)- und Low Energy (LE)-Dual-Mode-Transceiver-Module auf Grundlage des Bausteins CC2564 von TI. Diese Module bieten klassenbeste HF-Leistung mit einer Übertragungsleistung von bis zu +10 dBm und einer (...)

Von: BDE Technology Inc.
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Tochterkarte

BDE-3P-BDM209B — BDE BDM209B dual-mode Bluetooth® module

BDE-BDM209B is a Bluetooth 5.1 Basic Rate (BR), Enhanced Data Rate (EDR) and Low Energy (LE) Dual-Mode module.

The module offers Bluetooth Classic and Bluetooth LE radio (CC2564C) from Texas Instruments (TI) and an ultra-low-power Arm® Cortex®-M4 32-bit MCU (STM32L431). It integrates all required (...)

Von: BDE Technology Inc.
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Treiber oder Bibliothek

CC2564CMSP432BTBLESW — CC2564C TI Dual-Mode Bluetooth®-Stack auf MSP432-MCUs

Der CC2564C Dual-Mode Bluetooth® Stack von TI auf der Software von MSP432 MCUs für Bluetooth + Bluetooth Low Energy aktiviert die MSP432 MCU und besteht aus Single-Mode- und Dual-Mode-Angeboten, welche die Bluetooth 5.1-Spezifikation implementieren. Der Bluetooth-Stack ist voll qualifiziert ( (...)
Benutzerhandbuch: PDF | HTML
Benutzerhandbuch: PDF | HTML
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Treiber oder Bibliothek

CC2564CSTBTBLESW — CC2564C TI Dual-Mode Bluetooth®-Stack auf STM32F4-MCUs

Der CC2564C Dual-Mode-Bluetooth®-Stack von TI auf STM32F4 MCUs-Software für Bluetooth + Bluetooth Low Energy aktiviert die STM32 ARM Cortex M4-MCU und besteht aus Single-Mode- und Dual-Mode-Angeboten, welche die Bluetooth 5.1-Spezifikation implementieren. Der Bluetooth-Stack ist voll qualifiziert ( (...)
Benutzerhandbuch: PDF | HTML
Benutzerhandbuch: PDF | HTML
Herunterladen
Treiber oder Bibliothek

CC256XC-BT-SP — Bluetooth® Service Pack für CC256xC

Das Bluetooth Service Pack (SP) CC256xC enthält die obligatorischen Initialisierungsskripts (BTS-Dateien), die plattformspezifische Konfigurationen und Fehlerbehebungen aufweisen.

Außerdem enthält das Bluetooth Service Pack Begleitdateien für den CC2564C-Baustein, die für das Testen und Debuggen (...)

Benutzerhandbuch: PDF | HTML
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Treiber oder Bibliothek

TI-BT-STACK-LINUX-ADDON — TI Bluetooth Linux Add-on für AM335x EVM, AM437x EVM und BeagleBone mit WL18xx und CC256x

Dieses Paket enthält das Installationspaket, den vorkompilierten Objekt- und Quellcode des Bluetooth-Stacks und des Platform Managers von TI für einfache Upgrades der Standard-LINUX-EZSDK-Binärdatei auf einem AM437x-EVM, AM335x-EVM oder BeagleBone. Die Software wurde mit Linaro GCC 4.7 erstellt und (...)
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IDE, Konfiguration, Compiler oder Debugger

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

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Zertifizierung

CC2564MODN-DESIGN-FILES — CC2564MODN Design Information for Regulatory Compliance

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
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Zertifizierung

CC256X-CERTIFICATION — Funkzertifizierung für Dual Mode Bluetooth

Suchen Sie nach Unterstützung bei der Zertifizierung für CC256x-Module? CC256x-ZERTIFIZIERUNG bietet die relevanten Informationen und Unterstützung für eine erfolgreiche Zertifizierung Ihres Produkts. Auf dieser Seite finden Sie die neuesten Zertifizierungsberichte unserer Module sowie unsere (...)
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Zertifizierung

CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
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Designtool

DUALMODE-BT-DESIGN-REVIEWS — Hardware-Design-Prüfungen für CC256x-Bausteine

So starten Sie den Überprüfungsprozess für das Hardwaredesign des Dual-Mode-Bluetooth®:
  • Schritt 1: Bevor Sie eine Überprüfung anfordern, sollten Sie unbedingt die technische Dokumentation und die Ressourcen für Design und Entwicklung durchsehen, die auf der entsprechenden Produktseite verfügbar sind (...)
Benutzerhandbuch: PDF
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Gerberdatei

CC256XCQFN-EM Design Files

SWRC329.ZIP (1375 KB)
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Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VQFNP-MR (RVM) 76 Ultra Librarian
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