CC2652RSIP

AKTIV

SimpleLink™ 2,4-GHz-Multiprotokoll-Drahtlos-System-in-Package-Modul mit 352 KB Speicher

Produktdetails

CPU core Arm® Cortex®-M4 Technology Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 88 Peripherals 2 SPI, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Features Border router, Direction finding, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 32 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Operating system FreeRTOS, TI RTOS Type Wireless module Sensitivity (best) (dBm) -99 Operating temperature range (°C) -40 to 105 Cryptographic accelerators RNG Edge AI enabled No
CPU core Arm® Cortex®-M4 Technology Bluetooth® LE, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Thread, Zigbee 3.0 Flash memory (kByte) 352 RAM (kByte) 88 Peripherals 2 SPI, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Features Border router, Direction finding, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor Number of GPIOs 32 Security Cryptographic acceleration, Device attestation & anti-counterfeit, Secure boot, Secure debug, Secure firmware & software update Operating system FreeRTOS, TI RTOS Type Wireless module Sensitivity (best) (dBm) -99 Operating temperature range (°C) -40 to 105 Cryptographic accelerators RNG Edge AI enabled No
QFM (MOT) 48 49 mm² 7 x 7

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4F processor
  • 352KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 80KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, OOK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.5 mA active mode, CoreMark
    • 74 µA/MHz running CoreMark
    • 1 µA standby mode, RTC, 80KB RAM
    • 160 nA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 30.1 µA in 2 MHz mode
    • 808 µA in 24 MHz mode
  • Radio Consumption:
    • 7.3 mA RX at 2.4 GHz
    • 7.5 mA TX at 0 dBm
    • 9.8 mA TX at +5 dBm

Wireless protocol support

High performance radio

  • -103 dBm sensitivity for Bluetooth® Low Energy 125-kbps LE Coded PHY

  • Output power up to +5 dBm with temperature compensation

Regulatory compliance

  • Regulatory certification for compliance with worldwide radio frequency:
    • ETSI RED (Europe) / RER (UK)
    • ISED (Canada)
    • FCC (USA)

MCU peripherals

  • Digital peripherals can be routed to any of 32 GPIOs
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • Tj: -40 to +105°C

Package

  • 7-mm × 7-mm MOT ( 32 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4F processor
  • 352KB flash program memory
  • 256KB of ROM for protocols and library functions
  • 8KB of cache SRAM
  • 80KB of ultra-low leakage SRAM with parity for high-reliability operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, OOK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4KB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.5 mA active mode, CoreMark
    • 74 µA/MHz running CoreMark
    • 1 µA standby mode, RTC, 80KB RAM
    • 160 nA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption:
    • 30.1 µA in 2 MHz mode
    • 808 µA in 24 MHz mode
  • Radio Consumption:
    • 7.3 mA RX at 2.4 GHz
    • 7.5 mA TX at 0 dBm
    • 9.8 mA TX at +5 dBm

Wireless protocol support

High performance radio

  • -103 dBm sensitivity for Bluetooth® Low Energy 125-kbps LE Coded PHY

  • Output power up to +5 dBm with temperature compensation

Regulatory compliance

  • Regulatory certification for compliance with worldwide radio frequency:
    • ETSI RED (Europe) / RER (UK)
    • ISED (Canada)
    • FCC (USA)

MCU peripherals

  • Digital peripherals can be routed to any of 32 GPIOs
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Two UART, two SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128- and 256-bit cryptographic accelerator
  • ECC and RSA public key hardware accelerator
  • SHA2 Accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • Tj: -40 to +105°C

Package

  • 7-mm × 7-mm MOT ( 32 GPIOs)
  • RoHS-compliant package

The SimpleLink™ CC2652RSIP is a System-in-Package (SiP) certified module, multiprotocol 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Small 7-mm x 7-mm certified system-in-package module 2.4GHz with integrated DCDC components, balun, and crystal oscillators
  • Wide flexibility of protocol stack support in the SimpleLink™ CC13xx and CC26xx Software Development Kit (SDK).
  • Longer battery life wireless applications with low standby current of 1 µA with full RAM retention.
  • Industrial temperature ready with lowest standby current of 11 µA at 105 ⁰C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy (-103 dBm for 125-kbps LE Coded PHY).

The CC2652RSIP device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™ CC2652RSIP is a System-in-Package (SiP) certified module, multiprotocol 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Small 7-mm x 7-mm certified system-in-package module 2.4GHz with integrated DCDC components, balun, and crystal oscillators
  • Wide flexibility of protocol stack support in the SimpleLink™ CC13xx and CC26xx Software Development Kit (SDK).
  • Longer battery life wireless applications with low standby current of 1 µA with full RAM retention.
  • Industrial temperature ready with lowest standby current of 11 µA at 105 ⁰C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
  • Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy (-103 dBm for 125-kbps LE Coded PHY).

The CC2652RSIP device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet CC2652RSIP SimpleLink™ Multiprotocol 2.4-GHz Wireless System-in-Package datasheet (Rev. B) PDF | HTML 16 Sep 2022
* Errata CC2652RSIP SimpleLink™ Wireless MCU Module Silicon Errata PDF | HTML 28 Feb 2022
* User guide CC13x2, CC26x2 SimpleLink Wireless MCU Technical Reference Manual (Rev. G) PDF | HTML 27 Jun 2024
Application note How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 18 Nov 2025
Application note CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 06 Aug 2024
Application note CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 02 Mai 2024
Application note CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices (Rev. A) PDF | HTML 20 Okt 2022
Application note CC2652RSIP OEM Integrators Guide PDF | HTML 19 Aug 2022
Application note How to Do RF Radio Test With Your Bluetooth Product (Rev. A) PDF | HTML 04 Aug 2022
Technical article Designing signal chains for portable diagnostics PDF | HTML 18 Mai 2022
Certificate CC2652RSIP CE DoC (Certification) 31 Mär 2022
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 Mär 2022
Selection guide Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. B) 07 Mär 2022
Certificate CC2652RSIP UK DoC (Certification) 03 Mär 2022
Application note Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 25 Feb 2022
Application note DN035 -- Antenna Quick Guide (Rev. B) 09 Feb 2022
Application note Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 20 Dez 2021
Application note TI Bluetooth® Mesh Software Product Brief PDF | HTML 17 Dez 2021
Application note Hardware Migration From CC26x0 to CC26x2R (Rev. D) 23 Aug 2021
Technical article Seamlessly connect your world with 16 new wireless MCUs for the 2.4-GHz and Sub-1- PDF | HTML 04 Jun 2021
Application brief Dynamic Multi-protocol Manager (DMM) Tech Note (Rev. A) PDF | HTML 13 Mai 2021
White paper Dynamic Multi-Protocol (DMM) Performance 21 Apr 2021
White paper Exploring Thread and Zigbee for home and building automation PDF | HTML 12 Apr 2021
Cybersecurity advisory Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 17 Jul 2020
Cybersecurity advisory Variable Time Tag Comparison on SimpleLink™ Devices PDF | HTML 05 Jun 2020
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18 Mai 2020
Application note Cloning Z-Stack Network Properties Using the SimpleLink Wireless MCU Family PDF | HTML 31 Mär 2020
Application note SimpleLink WLAN Access Point (Rev. A) PDF | HTML 16 Mär 2020
Application note Z-Stack Large Mesh Network Performance Using the SimpleLink™ Wireless MCU Family (Rev. B) PDF | HTML 05 Feb 2020
Application note Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs PDF | HTML 28 Jan 2020
Application note Ultra-Low Power Sensing Applications With CC13x2/CC26x2 (Rev. B) PDF | HTML 27 Jan 2020
White paper Simple and efficient software development with the SimpleLink™ MCU platform (Rev. E) 06 Dez 2019
White paper Exploring IoT wireless connectivity in mechanical shock and vibration environme 07 Nov 2019
White paper Deep dive into the tools and development kits of the SimpleLink™ MCU platform (Rev. B) 25 Sep 2019
Application note Running Bluetooth® Low Energy on CC13x2/CC26xx Without a 32 kHz Crystal (Rev. C) PDF | HTML 23 Sep 2019
More literature Understanding security features for SimpleLink™ Zigbee CC13x2 and CC26x2 Wireles 17 Jun 2019
Application brief What's New in Zigbee 3.0 (Rev. A) PDF | HTML 06 Jun 2019
Application note Bluetooth® Low Energy Tree Structure Network PDF | HTML 29 Mai 2019
Application note Debugging Communication Range (Rev. A) PDF | HTML 23 Mai 2019
Application note Z-Stack End Dev Pwr Cons Measuremen w/ the SimpleLink™ Wireless MCU Family (Rev. B) PDF | HTML 17 Mai 2019
Application note Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs 15 Apr 2019
Selection guide Zigbee® Selection Guide for SimpleLink MCUs (Rev. F) 21 Feb 2019
White paper SimpleLink Crystal-Less Wireless MCU based on TI BAW technology 18 Feb 2019
Product overview Out-of-box star-network solution: TI 15.4-Stack 14 Jan 2019
Application note Measuring CC13xx and CC26xx current consumption (Rev. D) PDF | HTML 10 Jan 2019
Application note RF PCB Simulation Cookbook 09 Jan 2019
Product overview Meet the SimpleLink™ Sensor Controller 04 Jan 2019
Product overview Time Multiplexing: Concurrent Multi-standard Operation 03 Jan 2019
White paper Migrating your proprietary solution to the SimpleLink™ WMCU 07 Nov 2018
Product overview Electronic Smart Locks: Ultra-low power and Multi-Standard operation 05 Nov 2018
Application note Low-Power ADC Solution for CC13x2 and CC26x2 02 Mär 2018
White paper Thread and Zigbee for home and building automation 01 Mär 2018
Application brief Ultra-Low Power Designs With the CC13x2 and CC26x2 Sensor Controller 27 Feb 2018
Application note Use of Low-power Zigbee® and Thread With the SimpleLink™ Wireless MCU Family 27 Feb 2018
Application note CC-Antenna-DK2 and Antenna Measurements Summary (Rev. A) 02 Okt 2017
Application note Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller 05 Mär 2017
Application note TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 28 Feb 2017

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SIMPLELINK-2-4GHZ-DESIGN-REVIEWS — Hardware-Designprüfungen für SimpleLink™ CC2xxx-Bausteine

Der SimpleLine-Überprüfungsprozess für das Hardwaredesign stellt eine Möglichkeit bereit, direkt mit einem Fachexperten in Verbindung zu treten, welcher Sie bei der Prüfung Ihres Designs unterstützen und Ihnen ein wertvolles Feedback geben kann. Hier finden Sie einen einfachen dreistufigen Prozess (...)
Gerberdatei

CC2652XSIP_EM Design Files

SWRC388.ZIP (1191 KB)
Schaltplan

LP-CC2652PSIP Design Files

SWRR172.ZIP (7286 KB)
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
QFM (MOT) 48 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

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