Gehäuseinformationen
| Gehäuse | Pins LSON-CLIP (DQP) | 12 |
| Betriebstemperaturbereich (°C) -55 to 150 |
| Gehäusemenge | Träger 2.500 | LARGE T&R |
Merkmale von CSD95373AQ5M
- 45 A Continuous Operating Current
Capability - 92.6% System Efficiency at 25 A
- Ultra-Low Power Loss of 2.6 W at 25 A
- High Frequency Operation (up to 2 MHz)
- High Density – SON 5 × 6-mm
Footprint - Ultra-Low Inductance Package
- System Optimized PCB Footprint
- 3.3 V and 5 V PWM Signal Compatible
- Diode Emulation Mode with FCCM
- Analog Temperature Output
- Tri-State PWM Input
- Integrated Bootstrap Switch
- Optimized Dead Time for Shoot Through
Protection - RoHS Compliant – Lead-Free Terminal
Plating - Halogen Free
Beschreibung von CSD95373AQ5M
The CSD95373AQ5M NexFET™ Power Stage is a highly-optimized design for use in a high-power, high-density Synchronous Buck converters. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. This combination produces high current, high efficiency, and high speed switching capability in a small 5 × 6 mm outline package. It also integrates the temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.