NEU

DDC3512

AKTIV

Analog-Digital-Wandler mit 512 Kanälen und 20 KSPS Stromeingang

Produktdetails

Operating temperature range (°C) 0 to 70 Rating Catalog
Operating temperature range (°C) 0 to 70 Rating Catalog
NFBGA (ZWR) 656 227.04 mm² 17.2 x 13.2
  • Single-chip design to directly measure 512 low-level currents simultaneously
  • Adjustable full-scale charge range up to 600pC
  • Input current: 1µA (maximum)
  • Adjustable speed with integration times as low as 50µs (20 KSPS per channel)
  • Resolution: 24 bit
  • Low power dissipation: 1.2mW/channel
  • Integral non-linearity: ±0.025% of reading ±1ppm of full scale range (all channels active)
  • Low noise: 0.26 fCrms at 600pC FSR with 20pF sensor capacitance
  • No charge loss
  • On-chip temperature sensor
  • Serial LVDS output interface
  • Single 1.85V supply
  • In-package bypass capacitors and reference buffer to reduce PCB area and design complexity
  • Single-chip design to directly measure 512 low-level currents simultaneously
  • Adjustable full-scale charge range up to 600pC
  • Input current: 1µA (maximum)
  • Adjustable speed with integration times as low as 50µs (20 KSPS per channel)
  • Resolution: 24 bit
  • Low power dissipation: 1.2mW/channel
  • Integral non-linearity: ±0.025% of reading ±1ppm of full scale range (all channels active)
  • Low noise: 0.26 fCrms at 600pC FSR with 20pF sensor capacitance
  • No charge loss
  • On-chip temperature sensor
  • Serial LVDS output interface
  • Single 1.85V supply
  • In-package bypass capacitors and reference buffer to reduce PCB area and design complexity

The DDC3512 is a 24-bit, 512-channel, current-input analog-to-digital (A/D) converter. The device combines both, current-to-voltage conversion by current integration, and A/D conversion. The device is a stacked-die version of DDC3256, with one die of the latter sitting on top of the other.

Up to 512 individual low-level current output devices, such as photodiodes, can be directly connected to the inputs and digitized in parallel (simultaneously).

For each of the 512 inputs, the device has one low noise and low power integrator designed to capture all the charge from the sensor. The integration time is adjustable from 50µs to 1.6ms, allowing currents in the order of fA to µA to be continuously measured with outstanding precision. The outputs of the integrators are digitized by on-chip low power ADCs and the converted digital codes are transmitted over a single LVDS pair designed to minimize noise coupling in environments with high channel count.

The DDC3512 operates from single 1.85V supply. The device is specified from 0°C to 70°C operating temperature and available in a 13.2 × 17.2mm2 656-ball 0.8mm row-pitch and 0.4mm column-pitch BGA. The on-chip reference buffer and bypass capacitors (on the BGA) help minimize the external component requirements and further reduce board space.

The DDC3512 is a 24-bit, 512-channel, current-input analog-to-digital (A/D) converter. The device combines both, current-to-voltage conversion by current integration, and A/D conversion. The device is a stacked-die version of DDC3256, with one die of the latter sitting on top of the other.

Up to 512 individual low-level current output devices, such as photodiodes, can be directly connected to the inputs and digitized in parallel (simultaneously).

For each of the 512 inputs, the device has one low noise and low power integrator designed to capture all the charge from the sensor. The integration time is adjustable from 50µs to 1.6ms, allowing currents in the order of fA to µA to be continuously measured with outstanding precision. The outputs of the integrators are digitized by on-chip low power ADCs and the converted digital codes are transmitted over a single LVDS pair designed to minimize noise coupling in environments with high channel count.

The DDC3512 operates from single 1.85V supply. The device is specified from 0°C to 70°C operating temperature and available in a 13.2 × 17.2mm2 656-ball 0.8mm row-pitch and 0.4mm column-pitch BGA. The on-chip reference buffer and bypass capacitors (on the BGA) help minimize the external component requirements and further reduce board space.

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* Data sheet DDC3512 512-Channel, Current-Input Analog-To-Digital Converter datasheet PDF | HTML 31 Okt 2025

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