Gehäuseinformationen
| Gehäuse | Pins DSBGA (YFF) | 81 |
| Betriebstemperaturbereich (°C) -40 to 85 |
| Gehäusemenge | Träger 1.500 | LARGE T&R |
Merkmale von TPS65912
- Four Step-Down Converters:
- VIN Range From 2.7 V to 5.5 V
- Power Save Mode at Light Load Current
- Output Voltage Accuracy in PWM Mode ±2%
- Typical 26-µA Quiescent Current per Converter
- Dynamic Voltage Scaling
- 100% Duty Cycle for Lowest Dropout
- Ten LDOs:
- 8 General-Purpose LDOs
- Output Voltage Range From 0.8 V to 3.3 V
- 2 Low-Noise RF-LDOs
- Output Voltage Range From 1.6 V to 3.3 V
- 32-µA Quiescent Current
- Preregulation Support by Separate Power Inputs
- ECO Mode
- VIN Range of LDOs Respective to the Following Voltage
Ranges:
- 1.8 V to 3.6 V
- 3.0 V to 5.5 V
- Three LED Outputs:
- Internal Dimming Using I2C
- Multiplexed With GPIOs
- Up to 20 mA per Current Sink
- Thermal Monitoring
- High Temperature Warning
- Thermal Shutdown
- Bypass Switch
- Used With DCDC4 in Applications Powering an RF-PA
- For Example, as Supply Switch for SD Cards
- Interface
- I2C Interface
- Power I2C Interface for Dynamic Voltage Scaling
- SPI
- 32-kHz RC Oscillator
- Undervoltage Lockout and Battery Fault Comparator
- Long Button-Press Detection
- Flexible Power-Up and Power-Down Sequencing
- 3.6-mm × 3.6-mm DSBGA Package With 0.4-mm Pitch
Beschreibung von TPS65912
The TPS65912x
device provides four configurable step-down converters with up to 2.5-A output current for memory,
processor core, I/O, or preregulation of LDOs. The device also contains ten LDO regulators for
external use. These LDOs can be supplied from either a battery or a preregulated supply. Power-up
or power-down controller is configurable and can support any power-up or power-down sequences
(OTP-based). The TPS65912x device integrates a 32-kHz RC oscillator to sequence all
resources during power up or power down. All LDOs and DC-DC converters can be controlled by
I2C-SPI interface or basic ENABLE balls. In addition, an independent
automatic voltage-scaling interface allows for transitioning
DC-DC to a different voltage by I2C or basic Roof/Floor Control.
Three RGB LEDs with an advanced dimming feature are integrated inside the device. GPIO
functionality is multiplexed with LED/ENABLE/SPI when not used. Each GPIO can be configured as part
of the power-up sequence to control external resources. One SLEEP pin enables power mode control
between active mode and preprogrammed sleep mode for power optimization. For system control, the
TPS65912x device has one
comparator for system state management. The TPS65912x device comes in a 9-pin × 9-pin DSBGA package (3.6 mm × 3.6 mm)
with a 0.4-mm pitch.