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MCU inalámbricas Sub-1 GHz

CC1354P10

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MCU inalámbrica multibanda SimpleLink™ Arm® Cortex®-M33, compa. EdgeAI, 1 MB + 296 KB, +20 dBm

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CC1354P10

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Detalles del producto

Protocols 6LoWPAN, Amazon Sidewalk, Bluetooth low energy, IEEE 802.15.4, MIOTY, Matter, Proprietary, Thread, Wi-SUN, Wireless M-Bus, Zigbee Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 2360-2500, 287-351, 359-439, 431-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 20 RAM (kByte) 296 Flash memory (kByte) 1024 Security Arm® TrustZone® technology, Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, PSA level 1 and 2 ready, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure provisioning, Secure storage, Software IP protection Cryptographic accelerators AES, ECC, PKA, SHA-2, TRNG CPU Arm® Cortex®-M33 Operating system FreeRTOS, RTOS, TI RTOS Peripherals 12-bit ADC 8-channel, 2 comparators, 4 SPI, 4 UART, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Number of GPIOs 26, 42 Rating Catalog Operating temperature range (°C) -40 to 105 Edge AI enabled Edge AI Studio enabled, Yes
Protocols 6LoWPAN, Amazon Sidewalk, Bluetooth low energy, IEEE 802.15.4, MIOTY, Matter, Proprietary, Thread, Wi-SUN, Wireless M-Bus, Zigbee Modulation scheme (G)MSK, 2(G)FSK, 4(G)FSK, ASK, OOK Frequency bands 1076-1315, 2360-2500, 287-351, 359-439, 431-527, 861-1054 Type Wireless MCU TX power (max) (dBm) 20 RAM (kByte) 296 Flash memory (kByte) 1024 Security Arm® TrustZone® technology, Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, PSA level 1 and 2 ready, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure provisioning, Secure storage, Software IP protection Cryptographic accelerators AES, ECC, PKA, SHA-2, TRNG CPU Arm® Cortex®-M33 Operating system FreeRTOS, RTOS, TI RTOS Peripherals 12-bit ADC 8-channel, 2 comparators, 4 SPI, 4 UART, 4 timers, 8-bit DAC, I2C, I2S, Sensor controller Number of GPIOs 26, 42 Rating Catalog Operating temperature range (°C) -40 to 105 Edge AI enabled Edge AI Studio enabled, Yes
VQFN (RSK) 64 64 mm² (8 mm × 8 mm) VQFN (RGZ) 48 49 mm² (7 mm × 7 mm)

Wireless microcontroller

  • Powerful 48 MHz Arm Cortex-M33 processor with TrustZone
  • FPU and DSP extension
  • 1024 kB flash program memory
  • 8 kB of cache SRAM
  • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation
    • ­32 kB of additional SRAM is available if parity is disabled
  • Dual-band Sub-1 GHz and 2.4 GHz operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4 kB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.4 mA active mode, CoreMark
    • 71 µA/MHz running CoreMark
    • 0.98 µA standby mode, RTC, 256 kB RAM
    • 0.17 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption
    • 32 µA in 2 MHz mode
    • 849 µA in 24 MHz mode
  • Radio consumption:
    • 5.8 mA RX at 868 MHz
    • 6.9 mA RX at 2.4 GHz
    • 22 mA TX at +10 dBm at 2.4 GHz
    • 25.8 mA TX at +14 dBm at 868 MHz
    • 69 mA TX at +20 dBm at 915 MHz
    • 101 mA TX at +20 dBm at 2.4 GHz

Wireless protocol support

High performance radio

  • Up to 130 dB link budget at 50 kbps, 868 MHz
  • Up to 141 dB link budget at 2.5 kbps, 868 MHz
  • –­121 dBm for 2.5 kbps long-range mode
  • –­110 dBm at 50 kbps, 802.15.4, 868 MHz
  • –104 dBm for Bluetooth® Low Energy 125 kbps
  • –105 dBm for IEEE 802.15.4-2006 2.4 GHz OQPSK (coherent modem)
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 300 328, EN 303 131, EN 303 204, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66, STD-T67 and STD-T108

MCU peripherals

  • Most digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit SAR ADC, 200 ksps, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Four UART, four SPI, two I2C, one I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • Supports secure boot
  • Supports secure key storage and device ID
  • Arm TrustZone for trusted execution environment
  • AES 128- and 256-bit cryptographic accelerator
  • Public key accelerator
  • SHA2 accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)
  • Secure debug lock
  • Software anti-rollback protection

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8 V to 3.8 V single supply voltage
  • –40°C to +105°C

Package

  • 7 mm × 7 mm RGZ VQFN48 (26 GPIOs)
  • 8 mm × 8 mm RSK VQFN64 (42 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48 MHz Arm Cortex-M33 processor with TrustZone
  • FPU and DSP extension
  • 1024 kB flash program memory
  • 8 kB of cache SRAM
  • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation
    • ­32 kB of additional SRAM is available if parity is disabled
  • Dual-band Sub-1 GHz and 2.4 GHz operation
  • Dynamic multiprotocol manager (DMM) driver
  • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

  • Autonomous MCU with 4 kB of SRAM
  • Sample, store, and process sensor data
  • Fast wake-up for low-power operation
  • Software defined peripherals; capacitive touch, flow meter, LCD

Low power consumption

  • MCU consumption:
    • 3.4 mA active mode, CoreMark
    • 71 µA/MHz running CoreMark
    • 0.98 µA standby mode, RTC, 256 kB RAM
    • 0.17 µA shutdown mode, wake-up on pin
  • Ultra low-power sensor controller consumption
    • 32 µA in 2 MHz mode
    • 849 µA in 24 MHz mode
  • Radio consumption:
    • 5.8 mA RX at 868 MHz
    • 6.9 mA RX at 2.4 GHz
    • 22 mA TX at +10 dBm at 2.4 GHz
    • 25.8 mA TX at +14 dBm at 868 MHz
    • 69 mA TX at +20 dBm at 915 MHz
    • 101 mA TX at +20 dBm at 2.4 GHz

Wireless protocol support

High performance radio

  • Up to 130 dB link budget at 50 kbps, 868 MHz
  • Up to 141 dB link budget at 2.5 kbps, 868 MHz
  • –­121 dBm for 2.5 kbps long-range mode
  • –­110 dBm at 50 kbps, 802.15.4, 868 MHz
  • –104 dBm for Bluetooth® Low Energy 125 kbps
  • –105 dBm for IEEE 802.15.4-2006 2.4 GHz OQPSK (coherent modem)
  • Output power up to +20 dBm with temperature compensation

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN 300 328, EN 303 131, EN 303 204, EN 300 440 Cat. 2 and 3
    • FCC CFR47 Part 15
    • ARIB STD-T66, STD-T67 and STD-T108

MCU peripherals

  • Most digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit SAR ADC, 200 ksps, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • Four UART, four SPI, two I2C, one I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • Supports secure boot
  • Supports secure key storage and device ID
  • Arm TrustZone for trusted execution environment
  • AES 128- and 256-bit cryptographic accelerator
  • Public key accelerator
  • SHA2 accelerator (full suite up to SHA-512)
  • True random number generator (TRNG)
  • Secure debug lock
  • Software anti-rollback protection

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8 V to 3.8 V single supply voltage
  • –40°C to +105°C

Package

  • 7 mm × 7 mm RGZ VQFN48 (26 GPIOs)
  • 8 mm × 8 mm RSK VQFN64 (42 GPIOs)
  • RoHS-compliant package

The SimpleLink™CC1354P10 device is a multiprotocol and multi-band Sub-1 GHz and 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN, Amazon Sidewalk, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz and 2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communications, with advanced security features and on-chip over-the-air (OAD) update capability. It enables long range and reliable communication in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Arm TrustZone based secure key storage, device ID and trusted functions support.
  • Multi-band device supporting concurrent multiprotocol for both Sub-1 GHz and 2.4 GHz through a DMM driver.
  • Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK).
  • Enablement of long-range and low-power applications using the integrated +20 dBm high-power amplifier with best-in-class transmit current consumption at 64 mA for Sub-1 GHz and 101 mA for 2.4 GHz operation.
  • Maximum transmit power of +14 dBm at Sub-1 GHz with 24.9 mA and +5 dBm at 2.4 GHz with 9.6 mA current consumption.
  • Optimized for coin-cell operation at +10 dBm at 2.4 GHz with 22 mA current consumption.
  • Longer battery life wireless applications with low standby current of 0.98 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5 µA at 85 ⁰C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1 Hz ADC sampling at 1 µA system current.
  • Low Soft Error Rate (SER) Failure-in-Time (FIT) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm Cortex-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity (-121 dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.

The CC1354P10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink MCU platform.

In addition to the software compatibility, within the multi-band wireless MCUs, there is pin-to-pin compatibility from 352 kB of flash up to 1 MB of flash in the 7 × 7 mm QFN package for maximum design scalability. For more information on TIs Sub-1 GHz solutions, visit www.ti.com/sub1ghz

The SimpleLink™CC1354P10 device is a multiprotocol and multi-band Sub-1 GHz and 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN, Amazon Sidewalk, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz and 2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communications, with advanced security features and on-chip over-the-air (OAD) update capability. It enables long range and reliable communication in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

  • Arm TrustZone based secure key storage, device ID and trusted functions support.
  • Multi-band device supporting concurrent multiprotocol for both Sub-1 GHz and 2.4 GHz through a DMM driver.
  • Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK).
  • Enablement of long-range and low-power applications using the integrated +20 dBm high-power amplifier with best-in-class transmit current consumption at 64 mA for Sub-1 GHz and 101 mA for 2.4 GHz operation.
  • Maximum transmit power of +14 dBm at Sub-1 GHz with 24.9 mA and +5 dBm at 2.4 GHz with 9.6 mA current consumption.
  • Optimized for coin-cell operation at +10 dBm at 2.4 GHz with 22 mA current consumption.
  • Longer battery life wireless applications with low standby current of 0.98 µA and full RAM retention.
  • Industrial temperature ready with lowest standby current of 5 µA at 85 ⁰C.
  • Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1 Hz ADC sampling at 1 µA system current.
  • Low Soft Error Rate (SER) Failure-in-Time (FIT) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
  • Dedicated software controlled radio controller (Arm Cortex-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
  • Excellent radio sensitivity (-121 dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.

The CC1354P10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink MCU platform.

In addition to the software compatibility, within the multi-band wireless MCUs, there is pin-to-pin compatibility from 352 kB of flash up to 1 MB of flash in the 7 × 7 mm QFN package for maximum design scalability. For more information on TIs Sub-1 GHz solutions, visit www.ti.com/sub1ghz

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Descargar la versión más reciente en inglés Fecha
* Hoja de datos CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU datasheet (Rev. B) PDF | HTML 14/12/2023
* Guía del usuario CC13x4, CC26x4 SimpleLink™ Wireless MCU Technical Reference Manual PDF | HTML 28/03/2022
* Errata CC1354P10 SimpleLink Wireless MCU Device Revision B (Rev. B) PDF | HTML 30/11/2023
Nota sobre la aplicación How to Modify TX and RX Commands Imported/Exported from SysConfig or SmartRF™ Studio PDF | HTML 30/04/2026
Nota sobre la aplicación TI Wi-SUN® Network Performance PDF | HTML 1/08/2025
Nota sobre la aplicación CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E) PDF | HTML 6/08/2024
Nota sobre la aplicación CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H) PDF | HTML 2/05/2024
Guía del usuario SimpleLink CC131x and CC135x Family Hardware Migration Guide PDF | HTML 2/05/2024
Certificado LP-EM-CC1354P10-6 EU Declaration of Conformity (DoC) 23/04/2024
Application brief Wireless Technologies for Solar Micro Inverters and Trackers (Rev. A) PDF | HTML 9/04/2024
Certificado LP-EM-CC1354P10-1 EU Declaration of Conformity (DoC) (Rev. A) PDF | HTML 25/10/2023
Nota sobre la aplicación TI 15.4-Stack Software PDF | HTML 17/10/2023
Application brief Wireless MCUs Designed to Meet Complex IoT Requirements PDF | HTML 12/07/2023
Nota sobre la aplicación 2.4-GHz, 10-dBm PA IPC for CC26x2P and CC1352P PDF | HTML 5/04/2022
Nota sobre la aplicación Antenna Impedance Measurement and Matching PDF | HTML 22/03/2022
Nota sobre la aplicación Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 25/02/2022
Nota sobre la aplicación 433 to 930-MHz and 2.4-GHz BOM Tunable PCB Antenna PDF | HTML 7/02/2022
Nota sobre la aplicación Connect One TI 15.4 Stack Sensor to Multiple Gateways PDF | HTML 20/12/2021
Nota sobre la aplicación TI Bluetooth® Mesh Software Product Brief PDF | HTML 17/12/2021
Artículo técnico 4 questions to ask before choosing a Wi-SUN stack PDF | HTML 13/08/2021
Informe Dynamic Multi-Protocol (DMM) Performance 21/04/2021
Informe Exploring Thread and Zigbee for home and building automation PDF | HTML 12/04/2021
Artículo técnico How Wi-SUN® FAN improves connected infrastructures PDF | HTML 19/11/2020
Artículo técnico How TI helps expand connectivity beyond the front door with Amazon Sidewalk PDF | HTML 21/09/2020
Nota sobre la aplicación Finding Settings for New Phy’s for the CC13x0 and CC13x2 Family PDF | HTML 14/09/2020
Asesoramiento en ciberseguridad Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18/05/2020
Nota sobre la aplicación Cloning Z-Stack Network Properties Using the SimpleLink Wireless MCU Family PDF | HTML 31/03/2020
Nota sobre la aplicación Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs PDF | HTML 28/01/2020
Artículo técnico Designing a building security system with the Sub-1 GHz Linux Gateway Software Dev PDF | HTML 25/09/2019
Más documentación Understanding security features for SimpleLink™ Zigbee CC13x2 and CC26x2 Wireles 17/06/2019
Más documentación Understanding security features for SimpleLink™ Sub-1 GHz CC13x2 MCUs 17/06/2019
Nota sobre la aplicación Bluetooth® Low Energy Tree Structure Network PDF | HTML 29/05/2019
Nota sobre la aplicación Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs PDF | HTML 15/04/2019
Artículo técnico The “key” to security: Zigbee 3.0’s security features PDF | HTML 5/02/2019
Product overview Out-of-box star-network solution: TI 15.4-Stack 14/01/2019
Nota sobre la aplicación RF PCB Simulation Cookbook 9/01/2019
Product overview Time Multiplexing: Concurrent Multi-standard Operation 3/01/2019
Informe Migrating your proprietary solution to the SimpleLink™ WMCU 7/11/2018
Product overview Electronic Smart Locks: Ultra-low power and Multi-Standard operation 5/11/2018
Artículo técnico Unlock every door with the SimpleLink™ platform PDF | HTML 19/09/2018
Nota sobre la aplicación Low-Power ADC Solution for CC13x2 and CC26x2 2/03/2018
Informe Thread and Zigbee for home and building automation 1/03/2018
Application brief Single-Chip Flow Metering Solution With the CC13x2R Wireless MCUs PDF | HTML 27/02/2018
Nota sobre la aplicación Use of Low-power Zigbee® and Thread With the SimpleLink™ Wireless MCU Family 27/02/2018
Nota sobre la aplicación Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller 5/03/2017
Nota sobre la aplicación TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A) 28/02/2017

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

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La aplicación móvil SimpleLink Connect es un ejemplo de aplicación Bluetooth® de baja energía para dispositivos móviles que funciona con los siguientes dispositivos:

  • Dispositivos CC23XX que ejecuten SIMPLELINK-LOWPOWER-SDK
  • Dispositivos CC33xx conectados a un host que ejecute el CC33XX-SOFTWARE
(...)
Productos y hardware compatibles
Enchufe

SIMPLELINK-SDK-EDGEAI-PLUGIN — Edge AI Plugin and application support for SimpleLink™ family of devices

Los kits de desarrollo de software (SDK) de baja potencia de SimpleLink™ son compatibles con la familia de productos CC13xx, CC23xx, CC26xx y CC27xx. Juntos, estos SDK proporcionan paquetes de programas completos para el desarrollo de aplicaciones Sub-1 GHz y 2.4 GHz que incluyen compatibilidad con (...)

Productos y hardware compatibles
Enchufe

SIMPLELINK-SDK-LVGL-PLUGIN — Complemento LittlevGL del kit de desarrollo de software (SDK) SimpleLink™

El complemento SimpleLink™ SDK LVGL es un paquete de software complementario que permite capacidades gráficas avanzadas en varias plataformas MCU SimpleLink™ mediante la integración de la biblioteca gratuita y de código abierto de terceros, LittlevGL, en el ecosistema SimpleLink SDK. El complemento (...)

Productos y hardware compatibles
Herramienta de programación de software

FLASH-PROGRAMMER — SmartRF Flash Programmer

SmartRF Flash Programmer 2 se puede utilizar para programar la memoria flash en MCU inalámbricas RF de bajo consumo basadas en ARM de Texas Instruments a través de las interfaces serie y de depuración. Consulte la lista de productos compatibles para verificar la compatibilidad. Uniflash también se (...)

lock = Requiere aprobación de exportación (1 minuto)
Productos y hardware compatibles
Herramienta de programación de software

UNIFLASH — Herramienta de programación flash UniFlash

UniFlash forma parte del amplio ecosistema de desarrollo CCStudio™ de TI y es una herramienta de software diseñada para programar la memoria flash integrada en los microcontroladores y dispositivos de conectividad inalámbrica de TI, así como la memoria flash integrada en los procesadores de TI. (...)

Productos y hardware compatibles
Herramienta de cálculo

SMARTRF-STUDIO-7 — SmartRF Studio

SmartRF™ Studio es una aplicación para Windows que ayuda a los diseñadores de sistemas de RF a evaluar fácilmente la radio en una etapa temprana del proceso de diseño para todos los dispositivos de RF de baja potencia CC1xxx y CC2xxx de TI. Simplifica la generación de los valores y comandos del (...)

Productos y hardware compatibles
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VQFN (RSK) 64 Ultra Librarian
VQFN (RGZ) 48 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

Ver todos los temas del foro en inglés

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene alguna pregunta sobre calidad, encapsulados o pedido de productos de TI, consulte el servicio de asistencia de TI. ​​​​​​​​​​​​​​

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