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TXG4122

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Convertidor de nivel a tierra bidireccional de 2 bits y 40 V para señal I2C

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TXG4122

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Detalles del producto

Rating Catalog Ground offset voltage (max) (V) 40 Bits (#) 2 Topology Open drain Applications GPIO, I2C, SMBus Forward/reverse channels 2/2 Isolation rating Functional Data rate (max) (Mbps) 2 Prop delay (ns) 5.9 CMTI (V/µs) 250 Technology family TXG Vin (min) (V) 3 Vin (max) (V) 5.5 Vout (min) (V) 2.25 Vout (max) (V) 5.5 Current consumption per channel (1 Mbps) (typ) (mA) 3.3
Rating Catalog Ground offset voltage (max) (V) 40 Bits (#) 2 Topology Open drain Applications GPIO, I2C, SMBus Forward/reverse channels 2/2 Isolation rating Functional Data rate (max) (Mbps) 2 Prop delay (ns) 5.9 CMTI (V/µs) 250 Technology family TXG Vin (min) (V) 3 Vin (max) (V) 5.5 Vout (min) (V) 2.25 Vout (max) (V) 5.5 Current consumption per channel (1 Mbps) (typ) (mA) 3.3
SOIC (D) 8 29.4 mm² (4.9 mm × 6 mm)
  • Bidirectional I2C compatible communication
  • Support for Standard-mode, Fast-mode, and Fast-mode Plus I2C operation
  • Supports DV shifts up to ±40V
  • Data rate up to 1MHz
  • Side 1 Supply Range: 3V to 5.5V
  • Side 2 Supply Range: 2.25V to 5.5V
  • Maximum capacitive load:
    • 80pF (Side 1) and 550pF (Side 2)
  • Open -drain outputs with current sink capability:
    • 16.5mA (Side 1) and 30mA (Side 2)
  • Low power consumption at 400kHz (typical):
    • ICC1 = 4.2mA, ICC2 = 0.9mA
  • Operating temperature from –40°C to +125°C
  • CMTI of 2kV/µs
  • Latch-up performance exceeds 100mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 2000V human-body model
    • 500V charged-device model
  • Package options provided: SOIC (8D), WSON (8DSG), SOT-23 (8DDF)
  • Bidirectional I2C compatible communication
  • Support for Standard-mode, Fast-mode, and Fast-mode Plus I2C operation
  • Supports DV shifts up to ±40V
  • Data rate up to 1MHz
  • Side 1 Supply Range: 3V to 5.5V
  • Side 2 Supply Range: 2.25V to 5.5V
  • Maximum capacitive load:
    • 80pF (Side 1) and 550pF (Side 2)
  • Open -drain outputs with current sink capability:
    • 16.5mA (Side 1) and 30mA (Side 2)
  • Low power consumption at 400kHz (typical):
    • ICC1 = 4.2mA, ICC2 = 0.9mA
  • Operating temperature from –40°C to +125°C
  • CMTI of 2kV/µs
  • Latch-up performance exceeds 100mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 2000V human-body model
    • 500V charged-device model
  • Package options provided: SOIC (8D), WSON (8DSG), SOT-23 (8DDF)

The TXG4122 device is a dual bidirectional, non-galvanic based voltage and ground-level translator for I2C. This device supports two separate configurable power-supply rails. Side 1 is designed to track VCC1 which accepts any supply voltage from 3V to 5.5V. Side 2 is designed to track VCC2 which accepts any supply voltage from 2.25V to 5.5V. Compared to traditional level shifters, the TXG4122 can solve the challenges of voltage translation across different ground levels up to ±40V. Both GND1 or GND2 can have an offset ground as long as the difference between GND1 and GND2 remains -40V to +40V.

The Simplified Block Diagram shows a common use case where DC shift occurs between GND1 to GND2 due to parasitic resistance or capacitance. The TXG4122 is able to support I2C-based communication between systems that have different supply voltages and different ground references. The leakage between GND1 and GND2 is typically 25nA when VCC to GND is shorted.

The TXG4122 device is a dual bidirectional, non-galvanic based voltage and ground-level translator for I2C. This device supports two separate configurable power-supply rails. Side 1 is designed to track VCC1 which accepts any supply voltage from 3V to 5.5V. Side 2 is designed to track VCC2 which accepts any supply voltage from 2.25V to 5.5V. Compared to traditional level shifters, the TXG4122 can solve the challenges of voltage translation across different ground levels up to ±40V. Both GND1 or GND2 can have an offset ground as long as the difference between GND1 and GND2 remains -40V to +40V.

The Simplified Block Diagram shows a common use case where DC shift occurs between GND1 to GND2 due to parasitic resistance or capacitance. The TXG4122 is able to support I2C-based communication between systems that have different supply voltages and different ground references. The leakage between GND1 and GND2 is typically 25nA when VCC to GND is shorted.
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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Descargar la versión más reciente en inglés Fecha
* Hoja de datos TXG4122 ± 40V Bidirectional Ground-Level Translator for I2C datasheet PDF | HTML 15/06/2026
Application brief Solving Ground Shift Issues in Phase Array Satellites PDF | HTML 30/07/2026
Application brief Top Questions about Ground-Level Translators PDF | HTML 27/05/2026
Artículo técnico Uneven grounds? Address offset challenges with novel ground-level translators (Rev. A) PDF | HTML 5/06/2025
Application brief Not All Grounds Are 0V PDF | HTML 21/05/2025
Product overview TI's Latest Ground-Level Translators PDF | HTML 7/05/2025

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TXG-4CH-EVM — Módulo de evaluación TXG para conversor de nivel de tierra de 4 canales

El TXG-4CH-EVM es un módulo de evaluación (EVM) que se utiliza para evaluar la familia de productos del conversor de nivel de tierra de 4 canales TXGx04x. El EVM admite múltiples opciones de paquetes, que incluyen DBQ de 16 pines, DYY de 14 pines y RUC de 14 pines. El EVM dispone de múltiples (...)
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